TAI-SAW TECHNOLOGY CO., LTD.
No. 3, Industrial 2nd Rd., Ping-Chen Industrial District,
Taoyuan, 324, Taiwan, R.O.C.
TEL: 886-3-4690038
FAX: 886-3-4697532
E-mail: tstsales@mail.taisaw.com
Web: www.taisaw.com
Approval Sheet For Product Specification
Issued Date: 1/5/2006 (REV. NO: 2)
Product Name: SMD 5.0x3.2 19.44MHz VCTCXO
TST Parts No.: TX0159A
Customer Parts No. :
Company:
Division:
Approved by:
Date:
Checked by:
Approval by:
Date:
CC Hsu
TF Yang
1/5/2006
TAI-SAW TECHNOLOGY CO., LTD.
TST DCC
Release document
FR-71S03-01
TAI-SAW TECHNOLOGY CO., LTD.
No. 3, Industrial 2nd Rd., Ping-Chen Industrial District,
Taoyuan, 324, Taiwan, R.O.C.
TEL: 886-3-4690038
FAX: 886-3-4697532
E-mail: tstsales@mail.taisaw.com
Web: www.taisaw.com
SMD 5.0x3.2 19.44MHz VCTCXO
MODEL NO.: TX0159A
REV. NO.: 2
RoHS Compliant
Lead free
Lead-free soldering
Features:
Frequency Adjustment Capability after Reflow Soldering Process
Good Frequency Stability
Good Phase Noise Response
Description and Applications:
Surface mount 5.0mmx3.2mmm VCTCXO for use in wireless communications devices.
Electrical Specifications:
TX0159A
Nominal Frequency, Fo
Storage Temperature Range
Operating Temperature Range
Power Supply Voltage, Vcc
Output Voltage with Load 10pF//10KΩ, Vout
Power Supply Current, Icc
Control Voltage, Vcon
Frequency Tolerance (Vcon=1.5V) after Reflow
Frequency Stability
a. Vs. Temperature (-30~75
°
C)
b. Vs. Supply Voltage varied 3.0V+/-10%
c. Vs. Load varied +/-10%
Vcon Frequency Control Range (1.5+/-1.0 V)
Start Up Time (90% of final RF level in Vp-p)
Harmonics
SSB Phase Noise (@1KHz Carrier Offset)
Aging
Specifications
19.440000 MHz
-40
°
C to +85
°
C
-30
°
C to +75
°
C
3.0 V
0.8 Vp-p min
2.0 mA max
1.5 +/- 1.0 V
+/- 2.0 ppm max @ 25
°
C +/- 3
°
C
+/- 2.5 ppm
+/- 0.2 ppm
+/- 0.2 ppm
+/-8 ~ +/-12 ppm/V
2.0 msec max.
-5.0 dBc max
-130 dBc/Hz max
+/-1.0 ppm/year @25
°
C
TAI-SAW TECHNOLOGY CO., LTD.
TST DCC
Release document
2
Mechanical Dimensions (mm):
Marking:
Line 1: Customer Frequency (19.440)
Line 2: TST Logo + Crystal Product Code + Date Code
Pin #1
Product Code Table
Year
Product Code
2001
2005
X
2002
2006
x
2003
2007
X
2004
2008
x
Date Code Table
WK01
A
WK14
N
WK27
a
WK40
n
WK02
B
WK15
O
WK28
b
WK41
o
WK03
C
WK16
P
WK29
c
WK42
p
WK04
D
WK17
Q
WK30
d
WK43
q
WK05
E
WK18
R
WK31
e
WK44
r
WK06
F
WK19
S
WK32
f
WK45
s
WK07
G
WK20
T
WK33
g
WK46
t
WK08
H
WK21
U
WK34
h
WK47
u
WK09
I
WK22
V
WK35
i
WK48
v
WK10
J
WK23
W
WK36
j
WK49
w
WK11
K
WK24
X
WK37
k
WK50
x
WK12
L
WK25
Y
WK38
l
WK51
y
WK13
M
WK26
Z
WK39
m
WK52
z
TAI-SAW TECHNOLOGY CO., LTD.
TST DCC
Release document
3
5x3.2 VCTCXO Recommended Circuit
5x3.2 VCTCXO Recommended Reflow Soldering Condition
Packing (mm):
1. Reel Dimension
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TST DCC
Release document
4
2. Tape Dimension
Direction of Feed
[NOTE]:
1. Unless otherwise specified tolerance on dimension +/-0.1 mm.
2. Material: conductive polystyrene with color black
3. 10 pitch cumulative tolerance +/-0.2 mm.
Notes of the Usage:
1. Touch the solder iron at 260+/-5 deg C onto the leads for 10+/-2 sec max or touch the
solder at 350+/-5 deg C onto the leads for 3+/-0.5 sec.
2. In the customer’s reflow process, if it will remain some mechanical stress at the soldering
terminals, also make some cracks on the soldering termination. Some cracks will cause
open or short circuit and cause of thermal increasing or smoking. Don’t make any excess
mechanical stress to soldering points.
3. In case of giving a heavy shock to the products, it may make an open or short circuit and
cause of thermal increasing and smoking. To avoid heavy shock impact applying to
products is strictly required.
Notes of the Storage:
1. To keep products under the condition at the room temperature (-5~35 deg C) with normal
humidity (45~75%). Absorption of moisture and dewdrop may make inferiority of
characteristics and a short circuit.
2. Oxidization of terminals shall make the solderability more inferior. Dusts and corrosive gas
will make a cause of the open or short circuit. Keep it in the clean place where is not in
dusty and no corrosive gas.
3. Use the unti-static material to the storage package.
4. Don’t put any excess weight to the TCXO in the storage process.
TAI-SAW TECHNOLOGY CO., LTD.
TST DCC
Release document
5