+15v/-15v wide analog signal range, high current capability 80ma (typical)
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Harris |
| 包装说明 | SOP, SOP16,.4 |
| Reach Compliance Code | unknown |
| Is Samacsys | N |
| 模拟集成电路 - 其他类型 | DPST |
| JESD-30 代码 | R-PDSO-G16 |
| JESD-609代码 | e0 |
| 标称负供电电压 (Vsup) | -15 V |
| 正常位置 | NO |
| 信道数量 | 2 |
| 功能数量 | 2 |
| 端子数量 | 16 |
| 标称断态隔离度 | 80 dB |
| 通态电阻匹配规范 | 1 Ω |
| 最大通态电阻 (Ron) | 45 Ω |
| 最高工作温度 | 75 °C |
| 最低工作温度 | |
| 输出 | SEPARATE OUTPUT |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装等效代码 | SOP16,.4 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 5,+-15 V |
| 认证状态 | Not Qualified |
| 最大供电电流 (Isup) | 0.5 mA |
| 标称供电电压 (Vsup) | 15 V |
| 表面贴装 | YES |
| 最长断开时间 | 500 ns |
| 最长接通时间 | 500 ns |
| 切换 | BREAK-BEFORE-MAKE |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL EXTENDED |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| Base Number Matches | 1 |
| HI9P5049-5 | HI9P5043-5 | HI9P5045-5 | HI9P5043-9 | HI9P5051-9 | HI9P5049-9 | HI9P5045-9 | HI9P5051-5 | |
|---|---|---|---|---|---|---|---|---|
| 描述 | +15v/-15v wide analog signal range, high current capability 80ma (typical) | +15v/-15v wide analog signal range, high current capability 80ma (typical) | +15v/-15v wide analog signal range, high current capability 80ma (typical) | +15v/-15v wide analog signal range, high current capability 80ma (typical) | +15v/-15v wide analog signal range, high current capability 80ma (typical) | +15v/-15v wide analog signal range, high current capability 80ma (typical) | +15v/-15v wide analog signal range, high current capability 80ma (typical) | +15v/-15v wide analog signal range, high current capability 80ma (typical) |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Harris | Harris | Harris | Harris | Harris | Harris | Harris | Harris |
| 包装说明 | SOP, SOP16,.4 | SOP, SOP16,.4 | SOP, SOP16,.4 | SOP, SOP16,.4 | SOP, SOP16,.4 | SOP, SOP16,.4 | SOP, SOP16,.4 | SOP, SOP16,.4 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| 模拟集成电路 - 其他类型 | DPST | SPDT | DPST | SPDT | SPDT | DPST | DPST | SPDT |
| JESD-30 代码 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 标称负供电电压 (Vsup) | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V |
| 信道数量 | 2 | 1 | 2 | 1 | 1 | 2 | 2 | 1 |
| 功能数量 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| 最大通态电阻 (Ron) | 45 Ω | 75 Ω | 75 Ω | 75 Ω | 50 Ω | 50 Ω | 75 Ω | 45 Ω |
| 最高工作温度 | 75 °C | 75 °C | 75 °C | 85 °C | 85 °C | 85 °C | 85 °C | 75 °C |
| 输出 | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | SOP | SOP | SOP | SOP | SOP | SOP | SOP |
| 封装等效代码 | SOP16,.4 | SOP16,.4 | SOP16,.4 | SOP16,.4 | SOP16,.4 | SOP16,.4 | SOP16,.4 | SOP16,.4 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
| 电源 | 5,+-15 V | 5,+-15 V | 5,+-15 V | 5,+-15 V | 5,+-15 V | 5,+-15 V | 5,+-15 V | 5,+-15 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 标称供电电压 (Vsup) | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
| 最长接通时间 | 500 ns | 500 ns | 500 ns | 1000 ns | 1000 ns | 1000 ns | 1000 ns | 500 ns |
| 切换 | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL EXTENDED |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
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