CYStech Electronics Corp.
P-CHANNEL ENHANCEMENT MODE POWER MOSFET
Spec. No. : C394N6
Issued Date : 2007.12.28
Revised Date :
Page No. : 1/5
MTP2603N6
Description
The MTP2603N6 is a P-channel enhancement-mode MOSFET, providing the designer with the best
combination of fast switching, ruggedized device design, low on-resistance and cost effectiveness.
The SOT-26 package is universally preferred for all commercial-industrial surface mount applications.
Features
•
Simple drive requirement
•
Low on-resistance
•
Small package outline
•
Pb-free package
Equivalent Circuit
MTP2603N6
G：Gate
S：Source
D：Drain
Absolute Maximum Ratings
(Ta=25°C)
Parameter
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current @T
A
=25
°C
Continuous Drain Current @T
A
=70
°C
Pulsed Drain Current
(Note 2, 3)
Symbol
V
DS
V
GS
(Note 1)
(Note 1)
Limits
-20
±12
-5
-4
-20
2
0.016
-55~+150
62.5
Unit
V
V
A
A
A
W
W /
°C
°C
°C/W
I
D
I
D
I
DM
Pd
Tj, Tstg
Rth,ja
Total Power Dissipation @ T
A
=25
°C
Linear Derating Factor
Operating Junction Temperature and Storage Temperature Range
Thermal Resistance, Junction-to-Ambient
(Note 1)
Note : 1.Surface mounted on 1 in² copper pad of FR-4 board. 156
℃
/W when mounted on minimum copper pad.
2.Pulse width limited by maximum junction temperature.
3.Pulse Width
≤300μs,
Duty Cycle≤2%
MTP2603N6
CYStek Product Specification
CYStech Electronics Corp.
Electrical
Characteristics (Ta=25°C, unless otherwise noted)
Symbol
BV
DSS
ΔBV
DSS
/ΔTj
V
GS(th)
I
GSS
I
DSS
I
DSS
*R
DS(ON)
*G
FS
Ciss
Coss
Crss
t
d(ON)
t
r
t
d(OFF)
t
f
Qg
Qgs
Qgd
Min.
-20
-
-0.5
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
Typ.
-
-0.1
-
-
-
-
-
-
-
-
9
740
167
126
5.9
3.6
32.4
2.6
10.6
2.32
3.68
Max.
-
-
-1.2
±100
-1
-10
53
65
120
250
-
1200
-
-
-
-
-
-
16
-
-
Unit
V
V/℃
V
nA
μA
μA
mΩ
S
pF
Spec. No. : C394N6
Issued Date : 2007.12.28
Revised Date :
Page No. : 2/5
Test Conditions
V
GS
=0, I
D
=-250μA
Reference to 25
℃
, I
D
=-1mA
V
DS
=V
GS
, I
D
=-250μA
V
GS
=±12V, V
DS
=0
V
DS
=-20V, V
GS
=0, Tj=25℃
V
DS
=-16V, V
GS
=0, Tj=55℃
I
D
=-4.5A, V
GS
=-10V
I
D
=-4.2A, V
GS
=-4.5V
I
D
=-2.0A, V
GS
=-2.5V
I
D
=-1.0A, V
GS
=-1.8V
V
DS
=-5V, I
D
=-2.8A
V
DS
=-15V, V
GS
=0, f=1MHz
ns
V
DS
=-15V, I
D
=-4.2A,
V
GS
=-10V, R
G
=6Ω, R
D
=3.6Ω
V
DS
=-16V, I
D
=-4.2A,
V
GS
=-4.5V,
*Pulse Test : Pulse Width
≤300μs,
Duty Cycle≤2%
nC
Source Drain Diode
Symbol
*V
SD
*T
rr
Q
rr
Min.
-
-
-
Typ.
-
27.7
22
Max.
-1.2
-
-
Unit
V
ns
nC
Test Conditions
I
S
=-1.2A,V
GS
=0V
I
S
=-4.2A,V
GS
=0V,dI/dt=100A/μs
*Pulse Test : Pulse Width
≤300μs,
Duty Cycle≤2%
MTP2603N6
CYStek Product Specification
CYStech Electronics Corp.
Characteristic Curves
Spec. No. : C394N6
Issued Date : 2007.12.28
Revised Date :
Page No. : 3/5
MTP2603N6
CYStek Product Specification
CYStech Electronics Corp.
Characteristic Curves(Cont.)
Spec. No. : C394N6
Issued Date : 2007.12.28
Revised Date :
Page No. : 4/5
MTP2603N6
CYStek Product Specification
CYStech Electronics Corp.
SOT-26 Dimension
A
D
d1
6
d2
5
4
Style:
Pin 1. Drain
Pin 2. Drain
Pin 3. Gate
Pin 4. Source
Pin 5. Drain
Pin 6. Drain
Spec. No. : C394N6
Issued Date : 2007.12.28
Revised Date :
Page No. : 5/5
Marking:
B C
3
E
1
2
(D)
(D)
(G)
(S)
(D)
(D)
Device Name
Date Code
2603
□□□□
I
F
G
H
J
K
L
6-Lead SOT-26 Plastic
Surface Mounted Package
CYStek Package Code: N6
DIM
A
B
C
D
d1
d2
E
Inches
Min.
Max.
0.1063
0.1220
0.1024
0.1181
0.0551
0.0709
0.0748 REF
0.0374 REF
0.0374 REF
0.0118
0.0217
Millimeters
Min.
Max.
2.70
3.10
2.60
3.00
1.40
1.80
1.90 REF
0.95 REF
0.95 REF
0.30
0.55
DIM
F
G
H
I
J
K
L
Inches
Min.
Max.
0.0472 REF
0
0.0039
-
0.0079
0.0047 REF
0.0146 REF
0.0236 REF
0°
10°
Millimeters
Min.
Max.
1.20 REF
0
0.10
-
0.20
0.12 REF
0.37 REF
0.60 REF
0°
10°
Notes :
1.Controlling dimension : millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material :
•
Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
Important Notice:
•
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
•
CYStek reserves the right to make changes to its products without notice.
•
CYStek
semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
•
CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
MTP2603N6
CYStek Product Specification
嵌入式系统
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