BRUS7
MINIBRIDGE
50 ns. ULTRA-FAST RECOVERY
Approximately 25 AMPERES*
SINGLE-PHASE, FULL-WAVE BRIDGES
SPACE SAVING
IN-LINE DESIGN
INTEGRALLY MOLDED
HEAT SINKS
PROVIDE LOW
THERMAL RESISTANCE
This product has recognition under the component program of Underwriters Laboratories, inc.
PRV/LEG
TYPE NUMBER
50V
BRUS705
100V
BRUS710
200V
BRUS720
400V
BRUS740
500V
BRUS750
600V
BRUS760
ELECTRICAL CHARACTERISTICS PER LEG
(at T
A
=25 C U nle ss O the rwis e Sp eci fie d)
C
Average Output Current, lo @ 60 C T
O
BRUS7
25
1.5
10
200
50
320
1.5 typ.
-55 to+150
-55 to+150
UNITS
Amps
Volts
Max.Forward Voltage Drop, V
F
@
I
F
=12A pk
Max.DC Reverse Current @ PRV and 25
C
, I
R
Max.DC Reverse Current @ PRV and 100
C
,I
R
Max.Reverse Recovery Time,T
rr
(Fig.3)
Max.Peak Surge Current, l
FSM
(8.3ms)
-
Thermal Resistance (Total Bridge), R
0
j
-
c
A
A
Nanosec.
Amps
o
C/W
o
Storage Temperature Range, T
STG
Ambient Operating Temperature Range,T
A
C
C
o
Note 1:Derate Io by 20% for capacitive loads
NOTE: Maximum lead and terminal temperature for soldering, 3/8 inch from case,5 seconds at 250
O
C.
EDI reserves the right to change these specifications at any time without notice.
BRUS7
FIG.1
CURRENT DERATING
60
lO.AVERAGE FORWARD CURRENT(AMP)
L
REDUCE RATING B Y 20% FOR C APACATIVE LOADS
FIG.2
NON-REPETITIVE SURGE CURRENT
1000
500
MAX.PEAK SURGE CURRENT I
FSM
50
BRIDGE OUTPUT
RES.-IND. LOADS
40
200
100
30
20
50
10
20
0
0
25
50
75
100
O
10
125
150
1
2
5
10
20
50
100
T
C
=TEMPERATURE
( C)
NUMBER OF CYCLES AT 60 CPS
FIG. 3
REVERSE RECOVERY TEST METHOD
T RR
ZERO
0.5A
REFERENCE
R1
50 OHM
D.U.T.
PULSE
GENERATOR
R2
1 OHM
SCOPE
1.0A
0.25A
-
R1, R2 NON-INDUCTIVE RESISTORS
PULSE GENERATOR - HEWLETT
PACKARD 214A OR EQUIV.
IKC REP.RA
TE, 10 SEC. PULSE WIDTH
ADJUST PULSE AMPLITUDE FOR PEAK IR
BRUS7 MECHANICAL OUTLINE
Dielectric test voltage 2500 volts rms, max. 50-60Hz.
.405
MAX
.193 DIA
THRU HOLE
+
1.125 SQ
METAL
HEAT SINK
_
AC
+
.625 MIN
.750 MIN
.050
DIA.TYP.
1/8 NOM.
.20TYP
ON CENTERS
ALL DIMENSIONS IN INCHES
NOTE:
1. Corrosion resistant terminals designed for .250 female quick connector, wrap around or solder.
2. A thin film of silicone thermal compound is recommended between the Minibridge
R
case and mounting surface for improved thermal conduction.
3. Higher dielectric strengths available. Consult factory.
ELECTRONIC DEVICES, INC.
DESIGNERS AND MANUFACTURERS OF SOLID STATE DEVICES SINCE 1951.
* YONKERS. NEW YORK 10710 914-965-4400
Ee-mail:sales@edidiodes.com
*
Wwebsite:
http://www.edidiodes.com
21 GRAY OAKS AVENUE
* FAX 914-965-5531
* 1-800-678-0828
微控制器 MCU
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
