HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6417
Issued Date : 1992.11.25
Revised Date : 2002.02.18
Page No. : 1/3
HBC546
NPN EPITAXIAL PLANAR TRANSISTOR
Description
The HBC546 is primarily intended for use in driver stage of audio
amplifiers.
Features
•
High Breakdown Voltage: 65V
•
High DC Current Gain: 110-800 at IC=2mA VCE=5V
TO-92
Absolute Maximum Ratings
•
Maximum Temperatures
Storage Temperature ............................................................................................ -55 ~ +150
°C
Junction Temperature .................................................................................... +150
°C
Maximum
•
Maximum Power Dissipation
Total Power Dissipation (Ta=25°C) ................................................................................ 625 mW
•
Maximum Voltages and Currents (Ta=25°C)
VCBO Collector to Base Voltage ......................................................................................... 80 V
VCEO Collector to Emitter Voltage ...................................................................................... 65 V
VEBO Emitter to Base Voltage .............................................................................................. 6 V
IC Collector Current ....................................................................................................... 100 mA
Characteristics
(Ta=25°C)
Symbol
BVCBO
BVCEO
BVEBO
ICBO
VBE(on)1
VBE(on)2
*VCE(sat)1
*VCE(sat)2
*VBE(sat)1
*VBE(sat)2
*hFE
fT
Cob
Min.
80
65
6
-
-
580
-
-
-
-
110
-
-
Typ.
-
-
-
-
-
-
-
-
700
900
-
300
-
Max.
-
-
-
15
770
700
250
600
-
-
800
4.5
Unit
V
V
V
nA
mV
mV
mV
mV
mV
mV
MHz
PF
Test Conditions
IC=100uA, IE=0
IC=1mA, IB=0
IE=10uA, IC=0
VCB=30V, IE=0
IC=10mA, VCE=5V
IC=2mA, VCE=5V
IC=10mA, IB=0.5mA
IC=100mA, IB=5mA
IC=10mA, IB=0.5mA
IC=100mA, IB=5mA
VCE=5V, IC=2mA
VCE=5V, IC=10mA, f=100MHz
VCB=10V, IE=0, f=1MHz
*Pulse Test: Pulse Width
≤380us,
Duty Cycle≤2%
Classification of hFE
Rank
Range
HBC546
A
110-220
B
200-450
C
420-800
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Current Gain & Collector Current
1000
1000
Spec. No. : HE6417
Issued Date : 1992.11.25
Revised Date : 2002.02.18
Page No. : 2/3
Saturation Voltage & Collector Current
125 C
o
Saturation Voltage (mV)
75 C
o
75 C
100
o
o
hFE
125 C
25 C
o
25 C
V
CE(sat)
@ I
C
=20I
B
o
hFE @ V
CE
=5V
100
0.1
1
10
100
10
1
10
100
Collector Current-I
C
(mA)
Collector Current-I
C
(mA)
ON Voltage & Collector Current
1000
25 C
o
Capacitance & Reverse-Biased Voltage
10
125 C
o
75 C
o
Capacitance (pF)
ON Voltage (mV)
Cob
V
BE(ON)
@ V
CE
=5V
100
1
10
100
1
0.1
1
10
100
Collector Current-I
C
(mA)
Reverse-Biased Voltage (V)
Safe Operating Area
10000
PT=1ms
PD-Ta
700
600
Collector Current-I
C
(mA)
1000
Power Dissipation-PD (mW)
PT=100ms
PT=1s
500
400
300
200
100
0
100
10
1
1
10
100
0
50
100
o
150
200
Forward Voltage-V
CE
(V)
Ambient Temperature-Ta ( C)
HBC546
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
TO-92 Dimension
A
B
1
2
3
Date Code
Spec. No. : HE6417
Issued Date : 1992.11.25
Revised Date : 2002.02.18
Page No. : 3/3
α
2
Marking:
H
BC
5 4 6
Rank
Control Code
α
3
C
Style: Pin 1.Collector 2.Base 3.Emitter
D
H
I
E
F
G
α
1
3-Lead TO-92 Plastic Package
HSMC Package Code: A
*: Typical
DIM
A
B
C
D
E
F
Inches
Min.
Max.
0.1704 0.1902
0.1704 0.1902
0.5000
-
0.0142 0.0220
-
*
0.0500
0.1323 0.1480
Millimeters
Min.
Max.
4.33
4.83
4.33
4.83
12.70
-
0.36
0.56
-
*
1.27
3.36
3.76
DIM
G
H
I
α1
α2
α3
Inches
Min.
Max.
0.0142 0.0220
-
*
0.1000
-
*
0.0500
-
*
5°
-
*
2°
-
*
2°
Millimeters
Min.
Max.
0.36
0.56
-
*
2.54
-
*
1.27
-
*
5°
-
*
2°
-
*
2°
Notes:
1.Dimension and tolerance based on our Spec. dated Apr. 25,1996.
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material:
•
Lead: 42 Alloy; solder plating
•
Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
•
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
•
HSMC reserves the right to make changes to its products without notice.
•
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
•
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
•
Head Office
(Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
•
Factory 1:
No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
HBC546
HSMC Product Specification
嵌入式系统
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