Chip Beads & Inductors
■
Introduction
Chip Components Guide
SAMWHA’s CB□, CBA□,CM□, CD□ series of chip components consist of compact, high
performance beads and inductors. Their innovative components and case structures mean low DC
resistance and outstanding highfrequency characteristics. These series are designed for a variety
of applications, facilitating component selection for individual circuit requirements.
Products Guide
Product Name
Application
Signal Line
(G)
Material
General
Frequency
(A)
Part Number
CB□GA□
CB□GK□
CB□GM□
CB□PA□
CB□PM□
CB□UM□
Impedance/
Inductance range
10~4000Ω
60~1000Ω
5~1000Ω
11~600Ω
50~600Ω
50~120Ω
30~1000Ω
60~1000Ω
30~1000Ω
0.047~33μ
H
1608
2012
1005
1608
3216
1608
2012
3216
Dimensions
Chip Ferrite
Beads
High Power Line Medium
Frequency
(P)
(K)
Ultra High
Power Line(U)
High
Frequency
(M)
Chip Ferrite
Beads Array
Signal Line
General
Frequency CBA□GA□
(A)
Medium
Frequency CBA□GK□
(K)
High
Frequency CBA□GM□
(M)
Ferrite
(F)
Ceramic
CM□F□
Chip Ferrite
Inductors
Chip Ceramic
Signal Line
Inductors
Signal Line
(C)
CD□C□
1.0~470nH
36
Chip Ferrite Beads Array
■
Features
1. Good reliability (Monolithic Structure)
2. High impedance characteristics
3. Flow/Reflow solder application
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Applications
1. Computer and its peripherals
2. CD-ROM, DVD, MD lines
3. I/O lines of notebook PCs, W/Ps
4. Digital TVs and VTRs
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Product Identifications
CBA 3216 G A 102 N4
① ② ③ ④ ⑤ ⑥
Series Code
CBA : Chip Ferrite Beads Array
E
⑦
Material Code
A : General frequency
K : Medium frequency
M : High frequency
Impedance Value Code
The first two digits are significant
The last digit is the number of zeros following
Dimension Code
The first two digits : length(mm)
The last two digits : width(mm)
Number of circuits
N4 = 4 array
Application Code
G : Signal line
Packaging Code
T : Reed paper packaging
E : Reed embossed tape packaging
B : Bulk packaging
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Shape & Dimensions
(Unit:mm)
Model
CBA3216
L
3.2±0.2
W
1.6±0.2
T
0.9±0.2
B
0.3±0.2
D
0.4±0.15
E
0.8±0.1
56
FPGA/CPLD
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