voltage regulators - switching regulators pmics w/dynamic core for pdas
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Maxim(美信半导体) |
| 零件包装代码 | QFN |
| 包装说明 | HVQCCN, LCC48,.27SQ,20 |
| 针数 | 48 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| Factory Lead Time | 6 weeks |
| Is Samacsys | N |
| 可调阈值 | YES |
| 模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT |
| JESD-30 代码 | S-XQCC-N48 |
| JESD-609代码 | e3 |
| 长度 | 7 mm |
| 湿度敏感等级 | 1 |
| 信道数量 | 1 |
| 功能数量 | 1 |
| 端子数量 | 48 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | HVQCCN |
| 封装等效代码 | LCC48,.27SQ,20 |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 3/5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 0.8 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 2.6 V |
| 标称供电电压 (Vsup) | 3.6 V |
| 表面贴装 | YES |
| 技术 | BICMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) |
| 端子形式 | NO LEAD |
| 端子节距 | 0.5 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 7 mm |
| Base Number Matches | 1 |
| MAX1586AETM+ | MAX1587AETL+ | MAX1586BETM+ | MAX1587CETL+T | MAX1586AEVKIT | |
|---|---|---|---|---|---|
| 描述 | voltage regulators - switching regulators pmics w/dynamic core for pdas | voltage regulators - switching regulators pmics w/dynamic core for pdas | voltage regulators - switching regulators pmics w/dynamic core for pdas | voltage regulators - switching regulators pmics w/dynamic core for pdas | EVAL BOARD FOR MAX1586A |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | - |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | - |
| 厂商名称 | Maxim(美信半导体) | - | Maxim(美信半导体) | Maxim(美信半导体) | - |
| 零件包装代码 | QFN | QFN | QFN | QFN | - |
| 包装说明 | HVQCCN, LCC48,.27SQ,20 | HVQCCN, LCC40,.24SQ,20 | HVQCCN, LCC48,.27SQ,20 | 6 X 6 MM, 0.80 MM HEIGHT, MO-220-WJJD-2, TQFN-40 | - |
| 针数 | 48 | 40 | 48 | 40 | - |
| Reach Compliance Code | compliant | compli | compli | compli | - |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | - |
| Factory Lead Time | 6 weeks | 6 weeks | 6 weeks | 6 weeks | - |
| Is Samacsys | N | - | N | N | - |
| 可调阈值 | YES | YES | YES | YES | - |
| 模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | - |
| JESD-30 代码 | S-XQCC-N48 | S-XQCC-N40 | S-XQCC-N48 | S-XQCC-N40 | - |
| JESD-609代码 | e3 | e3 | e3 | e3 | - |
| 长度 | 7 mm | 6 mm | 7 mm | 6 mm | - |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | - |
| 信道数量 | 1 | 1 | 1 | 1 | - |
| 功能数量 | 1 | 1 | 1 | 1 | - |
| 端子数量 | 48 | 40 | 48 | 40 | - |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | - |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | - |
| 封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | - |
| 封装代码 | HVQCCN | HVQCCN | HVQCCN | HVQCCN | - |
| 封装等效代码 | LCC48,.27SQ,20 | LCC40,.24SQ,20 | LCC48,.27SQ,20 | LCC40,.24SQ,20 | - |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | - |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | - |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | - |
| 电源 | 3/5 V | 3/5 V | 3/5 V | 3/5 V | - |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |
| 座面最大高度 | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | - |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | - |
| 最小供电电压 (Vsup) | 2.6 V | 2.6 V | 2.6 V | 2.6 V | - |
| 标称供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | - |
| 表面贴装 | YES | YES | YES | YES | - |
| 技术 | BICMOS | BICMOS | BICMOS | BICMOS | - |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | - |
| 端子面层 | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | - |
| 端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD | - |
| 端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | - |
| 端子位置 | QUAD | QUAD | QUAD | QUAD | - |
| 处于峰值回流温度下的最长时间 | 30 | 30 | 30 | 30 | - |
| 宽度 | 7 mm | 6 mm | 7 mm | 6 mm | - |
| Base Number Matches | 1 | 1 | 1 | 1 | - |
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