Si8660/61/62/63 Data Sheet
Low Power Six-Channel Digital Isolator
KEY FEATURES
Silicon Lab's family of ultra-low-power digital isolators are CMOS devices offering sub-
stantial data rate, propagation delay, power, size, reliability, and external BOM advan-
tages over legacy isolation technologies. The operating parameters of these products
remain stable across wide temperature ranges and throughout device service life for
ease of design and highly uniform performance. All device versions have Schmitt trigger
inputs for high noise immunity and only require VDD bypass capacitors.
Data rates up to 150 Mbps are supported, and all devices achieve propagation delays of
less than 10 ns. Ordering options include a choice of isolation ratings (1.0, 2.5, 3.75 and
5 kV) and a selectable fail-safe operating mode to control the default output state during
power loss. All products >1 kV
RMS
are safety certified by UL, CSA, VDE, and CQC, and
products in wide-body packages support reinforced insulation withstanding up to 5
kV
RMS
.
Automotive Grade is available for certain part numbers. These products are built using
automotive-specific flows at all steps in the manufacturing process to ensure the robust-
ness and low defectivity required for automotive applications.
Industrial Applications
• Industrial automation systems
• Medical electronics
• Isolated switch mode supplies
• Isolated ADC, DAC
• Motor control
• Power inverters
• Communication systems
Safety Regulatory Approvals
• UL 1577 recognized
• Up to 5000 V
RMS
for 1 minute
• CSA component notice 5A approval
• IEC 60950-1, 62368-1, 60601-1 (re-
inforced insulation)
• VDE certification conformity
• VDE 0884-10
• EN60950-1 (reinforced insulation)
• CQC certification approval
• GB4943.1
Automotive Applications
• On-board chargers
• Battery management systems
• Charging stations
• Traction inverters
• Hybrid Electric Vehicles
• Battery Electric Vehicles
• High-speed operation
• DC to 150 Mbps
• No start-up initialization required
• Wide Operating Supply Voltage
• 2.5–5.5 V
• Up to 5000 V
RMS
isolation
• 60-year life at rated working voltage
• High electromagnetic immunity
• Ultra low power (typical)
• 5 V Operation
• 1.6 mA per channel at 1 Mbps
• 5.5 mA per channel at 100 Mbps
• 2.5 V Operation
• 1.5 mA per channel at 1 Mbps
• 3.5 mA per channel at 100 Mbps
• Schmitt trigger inputs
• Selectable fail-safe mode
• Default high or low output (ordering
option)
• Precise timing (typical)
• 10 ns propagation delay
• 1.5 ns pulse width distortion
• 0.5 ns channel-channel skew
• 2 ns propagation delay skew
• 5 ns minimum pulse width
• Transient Immunity 50 kV/µs
• AEC-Q100 qualification
• Wide temperature range
• –40 to 125 °C
• RoHS-compliant packages
• SOIC-16 wide body
• SOIC-16 narrow body
• QSOP-16
• Automotive-grade OPNs available
• AIAG compliant PPAP documentation
support
• IMDS and CAMDS listing support
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Rev. 1.71
Si8660/61/62/63 Data Sheet
Ordering Guide
1. Ordering Guide
Table 1.1. Ordering Guide for Valid OPNs
1,2, 3
Ordering Part Num-
ber (OPN)
QSOP-16 Packages
Si8660BB-B-IU
Si8660EB-B-IU
Si8661BB-B-IU
Si8661EB-B-IU
Si8662BB-B-IU
Si8662EB-B-IU
Si8663BB-B-IU
Si8663EB-B-IU
SOIC-16 Packages
Si8660BA-B-IS1
Si8660BB-B-IS1
Si8660BC-B-IS1
Si8660EC-B-IS1
Si8660BD-B-IS
Si8660ED-B-IS
Si8661BB-B-IS1
Si8661BC-B-IS1
Si8661EC-B-IS1
Si8661BD-B-IS
Si8661ED-B-IS
Si8661BD-B-IS2
6
6
6
6
6
6
5
5
5
5
5
5
0
0
0
0
0
0
1
1
1
1
1
1
150
150
150
150
150
150
150
150
150
150
150
150
Low
Low
Low
High
Low
High
Low
Low
High
Low
High
Low
1.0
2.5
3.75
3.75
5.0
5.0
2.5
3.75
3.75
5.0
5.0
5.0
–40 to 125 °C
–40 to 125 °C
–40 to 125 °C
–40 to 125 °C
–40 to 125 °C
–40 to 125 °C
–40 to 125 °C
–40 to 125 °C
–40 to 125 °C
–40 to 125 °C
–40 to 125 °C
–40 to 125 °C
NB SOIC-16
NB SOIC-16
NB SOIC-16
NB SOIC-16
WB SOIC-16
WB SOIC-16
NB SOIC-16
NB SOIC-16
NB SOIC-16
WB SOIC-16
WB SOIC-16
WB SOIC-16
(8 mm cree-
page)
4
NB SOIC-16
NB SOIC-16
NB SOIC-16
WB SOIC-16
WB SOIC-16
NB SOIC-16
NB SOIC-16
NB SOIC-16
WB SOIC-16
6
6
5
5
4
4
3
3
0
0
1
1
2
2
3
3
150
150
150
150
150
150
150
150
Low
High
Low
High
Low
High
Low
High
2.5
2.5
2.5
2.5
2.5
2.5
2.5
2.5
–40 to 125 °C
–40 to 125 °C
–40 to 125 °C
–40 to 125 °C
–40 to 125 °C
–40 to 125 °C
–40 to 125 °C
–40 to 125 °C
QSOP-16
QSOP-16
QSOP-16
QSOP-16
QSOP-16
QSOP-16
QSOP-16
QSOP-16
Number of
Inputs
VDD1 Side
Number of
Inputs
VDD2 Side
Max Data
Rate
(Mbps)
Default
Output
State
Isolation Rating
(kV)
Temp (°C)
Package
Si8662BB-B-IS1
Si8662BC-B-IS1
Si8662EC-B-IS1
Si8662BD-B-IS
Si8662ED-B-IS
Si8663BB-B-IS1
Si8663BC-B-IS1
Si8663EC-B-IS1
Si8663BD-B-IS
4
4
4
4
4
3
3
3
3
2
2
2
2
2
3
3
3
3
150
150
150
150
150
150
150
150
150
Low
Low
High
Low
High
Low
Low
High
Low
2.5
3.75
3.75
5.0
5.0
2.5
3.75
3.75
5.0
–40 to 125 °C
–40 to 125 °C
–40 to 125 °C
–40 to 125 °C
–40 to 125 °C
–40 to 125 °C
–40 to 125 °C
–40 to 125 °C
–40 to 125 °C
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Rev. 1.71 | 2
Si8660/61/62/63 Data Sheet
Ordering Guide
Ordering Part Num-
ber (OPN)
Si8663ED-B-IS
Number of
Inputs
VDD1 Side
3
Number of
Inputs
VDD2 Side
3
Max Data
Rate
(Mbps)
150
Default
Output
State
High
Isolation Rating
(kV)
5.0
Temp (°C)
Package
–40 to 125 °C
WB SOIC-16
Notes:
1. All packages are RoHS-compliant with peak reflow temperatures of 260 °C according to the JEDEC industry standard classifica-
tions and peak solder temperatures.
2. “Si” and “SI” are used interchangeably.
3. An "R" at the end of the part number denotes tape and reel packaging option.
4. The package designated IS2 has a design that eliminates tie bars, thus allowing for extra creepage distance while maintaining
standard WB SOIC-16 package dimensions and land pattern.
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Si8660/61/62/63 Data Sheet
Ordering Guide
Automotive Grade OPNs
Automotive-grade devices are built using automotive-specific flows at all steps in the manufacturing process to ensure robustness and
low defectivity. These devices are supported with AIAG-compliant Production Part Approval Process (PPAP) documentation, and fea-
ture International Material Data System (IMDS) and China Automotive Material Data System (CAMDS) listing. Qualifications are compli-
ant with AEC-Q100, and a zero-defect methodology is maintained throughout definition, design, evaluation, qualification, and mass pro-
duction steps.
Table 1.2. Ordering Guide for Automotive Grade OPNs
1, 2, 4, 5
Ordering Part
Number (OPN)
SOIC-16 Packages
Si8660BC-AS1
Si8661BB-AS1
Si8662BD-AS
Si8663BD-AS
6
5
4
3
0
1
2
3
150
150
150
150
Low
Low
Low
Low
3.75
2.5
5.0
5.0
–40 to 125 °C
–40 to 125 °C
–40 to 125 °C
–40 to 125 °C
NB SOIC-16
NB SOIC-16
WB SOIC-16
WB SOIC-16
Number of
Inputs
VDD1 Side
Number of
Inputs
VDD2 Side
Max Data
Rate
(Mbps)
Default
Output
State
Isolation rating
(kV)
Temp (°C)
Package
Note:
1. All packages are RoHS-compliant with peak reflow temperatures of 260 °C according to the JEDEC industry standard classifica-
tions.
2. “Si” and “SI” are used interchangeably.
3. An "R" at the end of the part number denotes tape and reel packaging option.
4. Automotive-Grade devices (with an "–A" suffix) are identical in construction materials, topside marking, and electrical parameters
to their Industrial-Grade (with a "–I" suffix) version counterparts. Automotive-Grade products are produced utilizing full automotive
process flows and additional statistical process controls throughout the manufacturing flow. The Automotive-Grade part number is
included on shipping labels.
5. Additional Ordering Part Numbers may be available in Automotive-Grade. Please contact your local Silicon Labs sales represen-
tative for further information.
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Table of Contents
1. Ordering Guide
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
2. Functional Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.1 Theory of Operation .
2.2 Eye Diagram .
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. 6
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3. Device Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
3.1 Device Startup
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. 8
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.10
3.2 Undervoltage Lockout .
3.3 Layout Recommendations. .
3.3.1 Supply Bypass . . .
3.3.2 Output Pin Termination.
3.4 Fail-Safe Operating Mode .
.
3.5 Typical Performance Characteristics .
4. Electrical Specifications
5. Pin Descriptions
. . . . . . . . . . . . . . . . . . . . . . . . . . 12
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
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31
6. Package Outline (16-Pin Wide Body SOIC)
7. Land Pattern (16-Pin Wide-Body SOIC) . . . . . . . . . . . . . . . . . . . . .
8. Package Outline (16-Pin Narrow Body SOIC)
. . . . . . . . . . . . . . . . . . 32
9. Land Pattern (16-Pin Narrow Body SOIC) . . . . . . . . . . . . . . . . . . . . 34
10. Package Outline (16-Pin QSOP) . . . . . . . . . . . . . . . . . . . . . . . 35
11. Land Pattern (16-Pin QSOP)
. . . . . . . . . . . . . . . . . . . . . . . . 37
. . . . . . . . . . . . . . . . . . . . 38
. . . . . . . . . . . . . . . . . . .39
12. Top Marking (16-Pin Wide Body SOIC)
13. Top Marking (16-Pin Narrow Body SOIC)
14. Top Marking (16-Pin QSOP)
. . . . . . . . . . . . . . . . . . . . . . . . 40
41
15. Revision History. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
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