LAN Controller, 8 Channel(s), 12.5MBps, CMOS, PBGA352, 35 X 35 MM, 2.33 MM HEIGHT, PLASTIC, MS-034, BGA-352
| 参数名称 | 属性值 |
| 厂商名称 | Zarlink Semiconductor (Microsemi) |
| 包装说明 | BGA, |
| Reach Compliance Code | unknown |
| 地址总线宽度 | 11 |
| 边界扫描 | NO |
| 总线兼容性 | 80186; 80386; 80486; MPC801 |
| 最大时钟频率 | 50 MHz |
| 最大数据传输速率 | 12.5 MBps |
| 外部数据总线宽度 | 16 |
| JESD-30 代码 | S-PBGA-B352 |
| JESD-609代码 | e0 |
| 长度 | 35 mm |
| 低功率模式 | NO |
| 串行 I/O 数 | 8 |
| 端子数量 | 352 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | BGA |
| 封装形状 | SQUARE |
| 封装形式 | GRID ARRAY |
| 认证状态 | Not Qualified |
| 座面最大高度 | 2.46 mm |
| 最大供电电压 | 3.6 V |
| 最小供电电压 | 3 V |
| 标称供电电压 | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | TIN LEAD |
| 端子形式 | BALL |
| 端子节距 | 1.27 mm |
| 端子位置 | BOTTOM |
| 宽度 | 35 mm |
| uPs/uCs/外围集成电路类型 | SERIAL IO/COMMUNICATION CONTROLLER, LAN |
| Base Number Matches | 1 |
| EA218C5BTAV001 | EA218C0BTAV | EA218C5BTAV | EA218C0BTAV001 | |
|---|---|---|---|---|
| 描述 | LAN Controller, 8 Channel(s), 12.5MBps, CMOS, PBGA352, 35 X 35 MM, 2.33 MM HEIGHT, PLASTIC, MS-034, BGA-352 | LAN Controller, 8 Channel(s), 12.5MBps, CMOS, PBGA352, 35 X 35 MM, 2.33 MM HEIGHT, PLASTIC, MS-034, BGA-352 | LAN Controller, 8 Channel(s), 12.5MBps, CMOS, PBGA352, 35 X 35 MM, 2.33 MM HEIGHT, PLASTIC, MS-034, BGA-352 | LAN Controller, 8 Channel(s), 12.5MBps, CMOS, PBGA352, 35 X 35 MM, 2.33 MM HEIGHT, PLASTIC, MS-034, BGA-352 |
| 厂商名称 | Zarlink Semiconductor (Microsemi) | Zarlink Semiconductor (Microsemi) | Zarlink Semiconductor (Microsemi) | Zarlink Semiconductor (Microsemi) |
| 包装说明 | BGA, | BGA, BGA352,26X26,50 | BGA, BGA352,26X26,50 | BGA, |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| 地址总线宽度 | 11 | 11 | 11 | 11 |
| 边界扫描 | NO | NO | NO | NO |
| 总线兼容性 | 80186; 80386; 80486; MPC801 | 80186; 80386; 80486; MPC801 | 80186; 80386; 80486; MPC801 | 80186; 80386; 80486; MPC801 |
| 最大时钟频率 | 50 MHz | 40 MHz | 50 MHz | 40 MHz |
| 最大数据传输速率 | 12.5 MBps | 12.5 MBps | 12.5 MBps | 12.5 MBps |
| 外部数据总线宽度 | 16 | 16 | 16 | 16 |
| JESD-30 代码 | S-PBGA-B352 | S-PBGA-B352 | S-PBGA-B352 | S-PBGA-B352 |
| JESD-609代码 | e0 | e0 | e0 | e0 |
| 长度 | 35 mm | 35 mm | 35 mm | 35 mm |
| 低功率模式 | NO | NO | NO | NO |
| 串行 I/O 数 | 8 | 8 | 8 | 8 |
| 端子数量 | 352 | 352 | 352 | 352 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | BGA | BGA | BGA | BGA |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 2.46 mm | 2.46 mm | 2.46 mm | 2.46 mm |
| 最大供电电压 | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 | 3 V | 3 V | 3 V | 3 V |
| 标称供电电压 | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | TIN LEAD | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | TIN LEAD |
| 端子形式 | BALL | BALL | BALL | BALL |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
| 宽度 | 35 mm | 35 mm | 35 mm | 35 mm |
| uPs/uCs/外围集成电路类型 | SERIAL IO/COMMUNICATION CONTROLLER, LAN | SERIAL IO/COMMUNICATION CONTROLLER, LAN | SERIAL IO/COMMUNICATION CONTROLLER, LAN | SERIAL IO/COMMUNICATION CONTROLLER, LAN |
| Base Number Matches | 1 | 1 | 1 | - |
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