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5962-8854503YA

产品描述Standard SRAM, 64KX4, 55ns, CMOS, CDFP28, CERAMIC, FLATPACK-28
产品类别存储    存储   
文件大小161KB,共12页
制造商Micross
官网地址https://www.micross.com
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5962-8854503YA概述

Standard SRAM, 64KX4, 55ns, CMOS, CDFP28, CERAMIC, FLATPACK-28

5962-8854503YA规格参数

参数名称属性值
厂商名称Micross
零件包装代码DFP
包装说明DFP,
针数28
Reach Compliance Codecompliant
ECCN代码3A001.A.2.C
最长访问时间55 ns
JESD-30 代码R-CDFP-F28
内存密度262144 bit
内存集成电路类型STANDARD SRAM
内存宽度4
功能数量1
端子数量28
字数65536 words
字数代码64000
工作模式ASYNCHRONOUS
最高工作温度125 °C
最低工作温度-55 °C
组织64KX4
封装主体材料CERAMIC, METAL-SEALED COFIRED
封装代码DFP
封装形状RECTANGULAR
封装形式FLATPACK
并行/串行PARALLEL
认证状态Not Qualified
筛选级别MIL-STD-883
座面最大高度3.302 mm
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)4.5 V
标称供电电压 (Vsup)5 V
表面贴装YES
技术CMOS
温度等级MILITARY
端子形式FLAT
端子节距1.27 mm
端子位置DUAL
宽度10.16 mm
Base Number Matches1

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SRAM
MT5C2564
64K x 4 SRAM
SRAM MEMORY ARRAY
AVAILABLE AS MILITARY
SPECIFICATIONS
• SMD 5962-88681
• SMD 5962-88545
• MIL-STD-883
PIN ASSIGNMENT
(Top View)
FEATURES
High Speed: 15, 20, 25, 35, 45, 55, and 70
Battery Backup: 2V data retention
Low power standby
High-performance, low-power, CMOS double-metal
process
• Single +5V (+10%) Power Supply
• Easy memory expansion with CE\
• All inputs and outputs are TTL compatible
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
CE\
Vss
1
2
3
4
5
6
7
8
9
10
11
12
24
23
22
21
20
19
18
17
16
15
14
13
Vcc
A15
A14
A13
A12
A11
A10
DQ4
DQ3
DQ2
DQ1
WE\
A1
A0
NC
Vcc
NC
3 2 1 28 27
A2 4
A3 5
A4 6
A5 7
A6 8
A7 9
A8 10
A9 11
CE\ 12
26
25
24
23
22
21
20
19
18
A15
A14
A13
A12
A11
A10
DQ4
DQ3
DQ2
24-Pin DIP (C)
(300 MIL)
28-Pin LCC (EC)
13 14 15 16 17
DQ1
WE\
NC
Vss
NC
28-Pin Flat Pack (F)
OPTIONS
• Timing
15ns access
20ns access
25ns access
35ns access
45ns access
55ns access
70ns access
• Package(s)
Ceramic DIP (300 mil)
Ceramic LCC
Ceramic Flatpack
MARKING
-15
-20
-25
-35
-45
-55*
-70*
NC
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
CE\
NC
Vss
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
Vcc
A15
A14
A13
A12
A11
A10
NC
NC
DQ3
DQ2
DQ1
DQ0
WE\
C
EC
F
No. 106
No. 204
GENERAL DESCRIPTION
• Operating Temperature Ranges
IT
Industrial (-40
o
C to +85
o
C)
o
o
Military (-55 C to +125 C)
XT
• 2V data retention/low power
L
The Austin Semiconductor SRAM family employs
high-speed, low-power CMOS and are fabricated using double-
layer metal, double-layer polysilicon technology.
For flexibility in high-speed memory applications,
Austin Semiconductor offers chip enable (CE\) on all
or-
ganizations. This enhancement can place the outputs in
High-Z for additional flexibility in system design. The x4
configuration features common data input and output.
Writing to these devices is accomplished when
write enable (WE\) and CE\ inputs are both LOW. Reading
is
accomplished when WE\ remains HIGH and CE\ goes
LOW. The device offers a reduced power standby mode when
disabled. This allows system designs to achieve low standby
power requirements.
These devices operate from a single +5V power
supply and all inputs and outputs are fully TTL compatible.
Micross Components reserves the right to change products or specifications without notice.
*Electrical characteristics identical to those provided for the 45ns
access devices.
For more products and information
please visit our web site at
www.micross.com
MT5C2564
Rev. 3.2 01/10
1

 
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