D Flip-Flop, LS Series, 1-Func, Positive Edge Triggered, 8-Bit, True Output, TTL, CQCC20, CERAMIC, LCC-20
参数名称 | 属性值 |
零件包装代码 | QLCC |
包装说明 | QCCN, |
针数 | 20 |
Reach Compliance Code | unknown |
系列 | LS |
JESD-30 代码 | S-CQCC-N20 |
负载电容(CL) | 50 pF |
逻辑集成电路类型 | D FLIP-FLOP |
位数 | 8 |
功能数量 | 1 |
端子数量 | 20 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
输出极性 | TRUE |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
封装代码 | QCCN |
封装形状 | SQUARE |
封装形式 | CHIP CARRIER |
最大电源电流(ICC) | 27 mA |
传播延迟(tpd) | 42 ns |
认证状态 | Not Qualified |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | TTL |
温度等级 | MILITARY |
端子形式 | NO LEAD |
端子位置 | QUAD |
触发器类型 | POSITIVE EDGE |
最小 fmax | 30 MHz |
Base Number Matches | 1 |
54LS273/B2A | 54LS273/BRA | 54LS273/BSA | 54S273/BSA | 54S273/B2A | 54S273/BRA | |
---|---|---|---|---|---|---|
描述 | D Flip-Flop, LS Series, 1-Func, Positive Edge Triggered, 8-Bit, True Output, TTL, CQCC20, CERAMIC, LCC-20 | D Flip-Flop, LS Series, 1-Func, Positive Edge Triggered, 8-Bit, True Output, TTL, CDIP20, CERAMIC, DIP-20 | D Flip-Flop, LS Series, 1-Func, Positive Edge Triggered, 8-Bit, True Output, TTL, CDFP20, CERAMIC, FP-20 | D Flip-Flop, S Series, 1-Func, Positive Edge Triggered, 8-Bit, True Output, TTL, CDFP20 | D Flip-Flop, S Series, 1-Func, Positive Edge Triggered, 8-Bit, True Output, TTL, CQCC20 | D Flip-Flop, S Series, 1-Func, Positive Edge Triggered, 8-Bit, True Output, TTL, CDIP20 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
系列 | LS | LS | LS | S | S | S |
JESD-30 代码 | S-CQCC-N20 | R-CDIP-T20 | R-CDFP-F20 | R-CDFP-F20 | S-CQCC-N20 | R-CDIP-T20 |
负载电容(CL) | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
逻辑集成电路类型 | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP |
位数 | 8 | 8 | 8 | 8 | 8 | 8 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 20 | 20 | 20 | 20 | 20 | 20 |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
封装形状 | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR |
封装形式 | CHIP CARRIER | IN-LINE | FLATPACK | FLATPACK | CHIP CARRIER | IN-LINE |
最大电源电流(ICC) | 27 mA | 27 mA | 27 mA | 150 mA | 150 mA | 150 mA |
传播延迟(tpd) | 42 ns | 42 ns | 42 ns | 23 ns | 23 ns | 23 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | NO | YES | YES | YES | NO |
技术 | TTL | TTL | TTL | TTL | TTL | TTL |
温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
端子形式 | NO LEAD | THROUGH-HOLE | FLAT | FLAT | NO LEAD | THROUGH-HOLE |
端子位置 | QUAD | DUAL | DUAL | DUAL | QUAD | DUAL |
触发器类型 | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE |
最小 fmax | 30 MHz | 30 MHz | 30 MHz | 75 MHz | 75 MHz | 75 MHz |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | - |
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