Negative Voltage Hot Swap Controllers
参数名称 | 属性值 |
Brand Name | Linear Technology |
是否Rohs认证 | 不符合 |
零件包装代码 | MSOP |
包装说明 | TSSOP, TSSOP8,.19 |
针数 | 8 |
制造商包装代码 | MS8 |
Reach Compliance Code | _compli |
ECCN代码 | EAR99 |
可调阈值 | NO |
模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT |
JESD-30 代码 | S-PDSO-G8 |
JESD-609代码 | e0 |
长度 | 3 mm |
湿度敏感等级 | 1 |
信道数量 | 1 |
功能数量 | 1 |
端子数量 | 8 |
最高工作温度 | 70 °C |
最低工作温度 | |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | TSSOP |
封装等效代码 | TSSOP8,.19 |
封装形状 | SQUARE |
封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
峰值回流温度(摄氏度) | 235 |
认证状态 | Not Qualified |
座面最大高度 | 1.1 mm |
最大供电电流 (Isup) | 2 mA |
最大供电电压 (Vsup) | 14.5 V |
最小供电电压 (Vsup) | 11.5 V |
标称供电电压 (Vsup) | 13 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING |
端子节距 | 0.65 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | 20 |
宽度 | 3 mm |
Base Number Matches | 1 |
LTC4252-1CMS8 | LTC4252-1CMS | LTC4252-1IMS | LTC4252-1IMS8 | LTC4252-2CMS | LTC4252-2CMS8 | LTC4252-2IMS8 | LTC4252-2IMS | |
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描述 | Negative Voltage Hot Swap Controllers | Negative Voltage Hot Swap Controllers | Negative Voltage Hot Swap Controllers | Negative Voltage Hot Swap Controllers | Negative Voltage Hot Swap Controllers | Negative Voltage Hot Swap Controllers | Negative Voltage Hot Swap Controllers | Negative Voltage Hot Swap Controllers |
Brand Name | Linear Technology | Linear Technology | Linear Technology | Linear Technology | Linear Technology | Linear Technology | Linear Technology | Linear Technology |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
零件包装代码 | MSOP | MSOP | MSOP | MSOP | MSOP | MSOP | MSOP | MSOP |
包装说明 | TSSOP, TSSOP8,.19 | TSSOP, TSSOP10,.19,20 | TSSOP, TSSOP10,.19,20 | TSSOP, TSSOP8,.19 | TSSOP, TSSOP10,.19,20 | TSSOP, TSSOP8,.19 | TSSOP, TSSOP8,.19 | TSSOP, TSSOP10,.19,20 |
针数 | 8 | 10 | 10 | 8 | 10 | 8 | 8 | 10 |
制造商包装代码 | MS8 | MS | MS | MS8 | MS | MS8 | MS8 | MS |
Reach Compliance Code | _compli | _compli | _compli | _compli | not_compliant | _compli | _compli | _compli |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
可调阈值 | NO | YES | YES | NO | YES | NO | NO | YES |
模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT |
JESD-30 代码 | S-PDSO-G8 | S-PDSO-G10 | S-PDSO-G10 | S-PDSO-G8 | S-PDSO-G10 | S-PDSO-G8 | S-PDSO-G8 | S-PDSO-G10 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
长度 | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm |
湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
信道数量 | 1 | 2 | 2 | 1 | 2 | 1 | 1 | 2 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 8 | 10 | 10 | 8 | 10 | 8 | 8 | 10 |
最高工作温度 | 70 °C | 70 °C | 85 °C | 85 °C | 70 °C | 70 °C | 85 °C | 85 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | TSSOP | TSSOP | TSSOP | TSSOP | TSSOP | TSSOP | TSSOP | TSSOP |
封装等效代码 | TSSOP8,.19 | TSSOP10,.19,20 | TSSOP10,.19,20 | TSSOP8,.19 | TSSOP10,.19,20 | TSSOP8,.19 | TSSOP8,.19 | TSSOP10,.19,20 |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
峰值回流温度(摄氏度) | 235 | 235 | 235 | 235 | 235 | 235 | 235 | 235 |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1.1 mm | 1.1 mm | 1.1 mm | 1.1 mm | 1.1 mm | 1.1 mm | 1.1 mm | 1.1 mm |
最大供电电流 (Isup) | 2 mA | 2 mA | 2 mA | 2 mA | 2 mA | 2 mA | 2 mA | 2 mA |
最大供电电压 (Vsup) | 14.5 V | 14.5 V | 14.5 V | 14.5 V | 14.5 V | 14.5 V | 14.5 V | 14.5 V |
最小供电电压 (Vsup) | 11.5 V | 11.5 V | 11.5 V | 11.5 V | 11.5 V | 11.5 V | 11.5 V | 11.5 V |
标称供电电压 (Vsup) | 13 V | 13 V | 13 V | 13 V | 13 V | 13 V | 13 V | 13 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 0.65 mm | 0.5 mm | 0.5 mm | 0.65 mm | 0.5 mm | 0.65 mm | 0.65 mm | 0.5 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
宽度 | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm |
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