The MAX20047 is an automotive-grade, low-cost, small-
footprint dual-port charger IC designed for automotive
charging applications. It combines a fully synchronous 6A
step-down buck converter with integrated high-side and low-
side FETs capable of operating with input voltages from 3.5V
to 36V and delivering 5.2V output voltage. The IC features
integrated iPod
®
/iPhone
®
1.0A and iPad
®
2.1A dedicated
charging modes.
The IC delivers up to 3A of charging current with 93%
efficiency per port through integrated switches with
programmable current limit and thermal foldback control.
The buck converter switching frequency is programmable
from 0.4MHz to 2.2MHz. Short-to-ground protection and
overcurrent protection are also provided on the protected
HVBUS outputs to protect the internal BUS power rail from
an overcurrent fault. The MAX20047 offers short-to-battery
up to +18V and can also be ordered with spread-spectrum
operation to reduce EMI.
Benefits and Features
●
40V Load-Dump Protection
●
Operating V
IN
Range of 3.5V to 36V
●
Synchronous DC-DC Converter with Integrated FETs
●
93% Charge Efficiency at 3A Charging
●
0.4MHz to 2.2MHz Programmable Switching
Frequency by External Pin Settings
●
Spread-Spectrum Operation
●
Fixed 8ms Internal Soft-Start
●
5.20V Output
●
99% Duty-Cycle Operation with Low Dropout
●
±2% Output-Voltage Accuracy
●
Input System Overvoltage and Short-Circuit
Protection
●
Accurate SRC_DMOS Current Limiting with Minimal
Voltage Drop
• Low R
ON
15mΩ Dual USB Power Switches
• Adjustable SRC_DMOS Current Limit by External
Pin Settings
• Integrated Current Sensing
●
Thermal Regulation and Thermal Shutdown
●
Dual Autonomous Battery-Charging Ports with
Portable Device Detection
• Integrated Apple
®
2.4A, 2.1A, 1.0A Detection
• Integrated Samsung
®
Detection
• Integrated DCP Detection
●
Robust for the Automotive Environment
• Short-to-Battery and Short-to-Ground Protection on
Protected SRC_DMOS Output
• Short-to-Battery and Short-to-PV Protection on
Protected HVDP1, HVDM1, HVDP2, and HVDM2
Inputs
• Tested to ISO 10605 and IEC 61000-4-2 ESD
Standards
• 20-Pin (5.0mm x 3.5mm) FC2-QFN Package
• -40°C to +125°C Operating Temperature Range
•
AEC-Q100 Qualified
Applications
●
USB Dedicated Charging Ports (DCP)
●
Automotive Cigarette Lighter Adapters
●
Power Supply for Linear Chargers
Ordering Information
appears at end of data sheet.
iPod, iPhone, iPad, and Apple are registered trademarks of
Apple Inc.
Samsung is a registered trademark of Samsung Electronics
Co., Ltd.
19-100165; Rev 0; 9/17
MAX20047
Dual 3A USB DCP Charger
Absolute Maximum Ratings
SUPSW, HVEN to PGND ......................................-0.3V to +40V
LX to PGND..........................................-0.3V to V
SUPSW
+ 0.3V
BIAS to Ground ....................................................-0.3V to +6.0V
COMP to Ground......................................-0.3V to V
BIAS
+ 0.3V
G_DMOS to Ground ...........................................-0.3V to +16.0V
AGND to PGND....................................................-0.3V to +0.3V
PV to PGND ..........................................................-03V to +6.0V
OUT to PGND .........................................................-0.3V to V
PV
BST to LX .............................................................-0.3V to +6.0V
S_DMOS1, S_DMOS2 to Ground ...........................-0.3V to V
PV
ILIM, CONFIG, FOSC to Ground ............. -0.3V to V
BIAS
+ 0.3V
HVDP1, HVDP2, HVPM1, HVDM2 to Ground ......-0.3V to +18V
LX Continuous Current ............................................................8A
Continuous Power Dissipation (T
A
= +70°C)
(Single-Layer Board
derate 13.2mW/°C over +70°C) .............................1052.6mW
Operating Temperature Range ......................... -40°C to +125°C
Maximum Junction Temperature .....................................+150°C
Storage Temperature Range ..............................-60°C to+150°C
Lead Temperature (soldering, 10s) ................................. +300°C
Soldering Temperature (reflow) .......................................+260°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Package Thermal Characteristics
(Note 1)
FC2-QFN
Junction-to-Ambient Thermal Resistance (θ
JA
) ..........36°C/W
Junction-to-Case Thermal Resistance (θ
JC
) .....................2°C/W
Note 1:
Thermal resistance can be lowered with improved board design.
Note 2:
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to
www.maximintegrated.com/thermal-tutorial.
Package Information
For the latest package outline information and land patterns (footprints), go to
www.maximintegrated.com/packages.
Note that a “+”,
“#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing
pertains to the package regardless of RoHS status.
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