Operational Amplifier,
Rail-to-Rail Output, 3 MHz
BW
TLV271, TLV272, NCV272,
TLV274, NCV274
The TLV/NCV27x operational amplifiers provide rail−to−rail
output operation. The output can swing within 320 mV to the positive
rail and 50 mV to the negative rail. This rail−to−rail operation enables
the user to make optimal use of the entire supply voltage range while
taking advantage of 3 MHz bandwidth. The opamp can operate on
supply voltage as low as 2.7 V over the temperature range of
−40°C
to
125°C. The high bandwidth provides a slew rate of 2.4 V/ms while
only consuming 550
mA
of quiescent current. Likewise the opamp can
run on a supply voltage as high as 16 V (single) and 36 V (dual quad)
making it ideal for a broad range of battery−operated applications.
Since this is a CMOS device it has high input impedance and low bias
currents making it ideal for interfacing to a wide variety of signal
sensors. In addition it comes in a variety of compact packages with
different pinout styles allowing for use in high−density PCB’s.
Features
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5
1
TSOP−5
CASE 483
8
1
Micro8
CASE 846A
SOIC−8
CASE 751
•
•
•
•
•
•
•
•
•
•
Rail−To−Rail Output
Wide Bandwidth: 3 MHz
High Slew Rate: 2.4 V/ms
Wide Power−Supply Range: 2.7 V to 16 V (TLV271),
36 V (TLV/NCV272/274)
Low Supply Current: 550
mA
Low Input Bias Current: 45 pA
Wide Temperature Range:
−40°C
to 125°C
TSOP−5, Micro−8, SOIC−8, SOIC−14, TSSOP−14 Packages
NCV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Notebook Computers
Portable Instruments
Signal Conditioning
Automotive
Power Supplies
Current Sensing
14
1
SOIC−14 NB
CASE 751A
14
1
TSSOP−14
CASE 948G
DEVICE MARKING INFORMATION
See general marking information in the device marking
section on page 2 of this data sheet.
ORDERING INFORMATION
See detailed ordering and shipping information on page 3 of
this data sheet.
Applications
•
•
•
•
•
•
©
Semiconductor Components Industries, LLC, 2013
July, 2020
−
Rev. 7
1
Publication Order Number:
TLV271/D
TLV271, TLV272, NCV272, TLV274, NCV274
MARKING DIAGRAMS
Single Channel Configuration
TLV271
5
XXXAYWG
G
1
TSOP−5
CASE 483
= ADG (TLV271SN1T1G)
= ADH (TLV271SN2T1G)
A
= Assembly Location
Y
= Year
W
= Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
XXX
Dual Channel Configuration
TLV272, NCV272
8
V272
AYWG
G
1
Micro8
CASE 846A
8
V272
ALYW
G
1
SOIC−8
CASE 751
Quad Channel Configuration
TLV274, NCV274
14
V274
ALYWG
G
1
TSSOP−14
CASE 948G
XXXXX
A
WL, L
Y
WW, W
G or
G
1
SOIC−14 NB
CASE 751A
= Specific Device Code
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
14
V274G
AWLYWW
(Note: Microdot may be in either location)
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2
TLV271, TLV272, NCV272, TLV274, NCV274
PIN CONNECTIONS
Single Channel Configuration
TLV271
OUT
V
DD
IN+
1
2
−
+
3
Style 1 Pinout (SN1T1)
(Top View)
4
5
V
EE
OUT
V
EE
IN−
IN+
1
2
3
Style 2 Pinout (SN2T1)
(Top View)
Quadruple Channel Configuration
TLV274, NCV274
+
−
4
5
V
DD
IN−
Dual Channel Configuration
TLV272, NCV272
OUT 1
IN− 1
IN+ 1
VSS
1
2
3
4
−
+
−
+
8
7
6
5
VDD
OUT 2
IN− 2
IN+ 2
OUT 1 1
IN− 1 2
IN+ 1 3
VDD 4
IN+ 2 5
IN− 2 6
OUT 2 7
+
−
−
+
14 OUT 4
−
13 IN− 4
+
12 IN+ 4
11 VSS
+
10 IN+ 3
−
9 IN− 3
8 OUT 3
ORDERING INFORMATION
Device
TLV271SN1T1G
(Style 1 Pinout)
TLV271SN2T1G
(Style 2 Pinout)
TLV272DR2G
TLV272DMR2G
TLV274DR2G
TLV274DTBR2G
NCV272DR2G*
NCV272DMR2G*
NCV274DR2G*
NCV274DTBR2G*
Configuration
Automotive
Marking
ADG
Single
ADH
Dual
No
V272
V272
V274
V274
V272
Yes
Quad
V272
V274
V274
SOIC−8
Micro−8/MSOP−8
SOIC−14
TSSOP−14
SOIC−8
Micro−8/MSOP−8
SOIC−14
TSSOP−14
TSOP−5
3000 / Tape and Reel
2500 / Tape and Reel
4000 / Tape and Reel
2500 / Tape and Reel
2500 / Tape and Reel
2500 / Tape and Reel
4000 / Tape and Reel
2500 / Tape and Reel
2500 / Tape and Reel
Package
Shipping
†
3000 / Tape and Reel
Quad
Dual
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP
Capable.
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3
TLV271, TLV272, NCV272, TLV274, NCV274
MAXIMUM RATINGS
Symbol
V
DD
V
ID
V
I
I
I
I
O
T
J
T
A
T
STG
ESD
HBM
ESD
CDM
Supply Voltage (Note 1)
Input Differential Voltage
Input Common Mode Voltage Range (Note 1)
Maximum Input Current
Output Current Range
Continuous Total Power Dissipation (Note 1)
Maximum Junction Temperature
Operating Ambient Temperature Range (free−air)
Storage Temperature Range
ESD Capability, Human Body Model
ESD Capability, Charged Device Model
TLV271
TLV/NCV272
TLV/NCV274
Rating
TLV271
TLV/NCV272/274
Value
16.5
36
$Supply
Voltage
−0.2
V to (V
DD
+
0.2 V)
$10
$100
200
150
−40
to 125
−65
to 150
2
TBD
2
1
260
Unit
V
V
V
V
mA
mA
mW
°C
°C
°C
kV
kV
kV
kV
°C
Mounting Temperature (Infrared or Convection
−
20 sec)
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functional-
ity should not be assumed, damage may occur and reliability may be affected.
1. Continuous short−circuit operation to ground at elevated ambient temperature can result in exceeding the maximum allowed junction
temperature of 150°C. Output currents in excess of 45 mA over long term may adversely affect reliability. Shorting output to either V+
or V− will adversely affect reliability.
THERMAL INFORMATION
Parameter
Symbol
Package
TSOP−5
Micro−8 / MSOP−8
Junction−to−Ambient
q
JA
SOIC−8
SOIC−14
TSSOP−14
Single Layer
Board (Note 2)
333
236
190
142
179
Multi−Layer
Board (Note 3)
195
167
131
101
128
°C/W
Unit
2. Values based on a 1S standard PCB according to JEDEC51−3 with 1.0 oz copper and a 300 mm
2
copper area
3. Values based on a 1S2P standard PCB according to JEDEC51−7 with 1.0 oz copper and a 100 mm
2
copper area
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4
TLV271, TLV272, NCV272, TLV274, NCV274
TLV271 DC ELECTRICAL CHARACTERISTICS
(V
DD
= 2.7V, 3.3V, 5V &
$5
V (Note 4), T
A
= 25°C, R
L
w
10 kW unless otherwise noted)
Parameter
Input Offset Voltage
Symbol
V
IO
ICV
OS
CMRR
Conditions
VIC = V
DD
/2, V
O
= V
DD
/2, R
L
= 10 kW, R
S
= 50
W
T
A
=
−40°C
to +105°C
Offset Voltage Drift
Common Mode
Rejection Ratio
VIC = V
DD
/2, V
O
= V
DD
/2, R
L
= 10 kW, R
S
= 50
W
0 V
v
VIC
v
V
DD
−
1.35 V, R
S
= 50
W
T
A
=
−40°C
to +105°C
0 V
v
VIC
v
V
DD
−
1.35 V, R
S
= 50
W
T
A
=
−40°C
to +105°C
0 V
v
VIC
v
V
DD
−
1.35 V, R
S
= 50
W
T
A
=
−40°C
to +105°C
Power Supply
Rejection Ratio
Large Signal
Voltage Gain
PSRR
V
DD
= 2.7 V to 16 V, VIC = V
DD
/2, No Load
T
A
=
−40°C
to +105°C
A
VD
V
O(pp)
= V
DD
/2, R
L
= 10 kW
T
A
=
−40°C
to +105°C
V
O(pp)
= V
DD
/2, R
L
= 10 kW
T
A
=
−40°C
to +105°C
V
O(pp)
= V
DD
/2, R
L
= 10 kW
T
A
=
−40°C
to +105°C
V
O(pp)
= V
DD
/2, R
L
= 10 kW
T
A
=
−40°C
to +105°C
Input Bias Current
I
B
I
IO
r
i(d)
C
IC
f = 21 kHz
V
DD
= 5 V, VIC = V
DD
/2, V
O
= V
DD
/2,
R
S
= 50
W
V
DD
= 5 V, VIC = V
DD
/2, V
O
= V
DD
/2,
R
S
= 50
W
T
A
= 25°C
T
A
= 105°C
T
A
= 25°C
T
A
= 105°C
1000
8
45
V
DD
=
$5
V
V
DD
= 5 V
V
DD
= 3.3 V
V
DD
= 2.7 V
V
DD
=
$5
V
V
DD
= 5 V
V
DD
= 2.7 V
58
55
65
62
69
66
70
65
97
76
97
76
100
86
100
90
45
150
1000
150
1000
GW
pF
pA
pA
130
127
123
106
dB
135
dB
140
130
2
70
Min
Typ
0.5
Max
5
7
mV/°C
dB
Unit
mV
Input Offset Current
Differential Input
Resistance
Common−mode
Input Capacitance
4. V
DD
=
±5
V is shorthand for V
DD
= +5 V and V
EE
=
−5
V.
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