Datasheet> 器件分类 > 嵌入式处理器和控制器> 微控制器和处理器> GD80960JC66

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GD80960JC66: 产品描述RISC Microprocessor, 32-Bit, 66MHz, CMOS, PBGA196, PLASTIC, BGA-196; 产品类别嵌入式处理器和控制器微控制器和处理器; 文件大小5MB，共90页; 制造商Intel(英特尔); 官网地址http://www.intel.com/

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GD80960JC66概述

RISC Microprocessor, 32-Bit, 66MHz, CMOS, PBGA196, PLASTIC, BGA-196

GD80960JC66规格参数

参数名称	属性值
是否Rohs认证	不符合
厂商名称	Intel(英特尔)
零件包装代码	BGA
包装说明	BGA, BGA196(UNSPEC)
针数	196
Reach Compliance Code	compliant
ECCN代码	3A991.A.2
地址总线宽度	32
位大小	32
边界扫描	YES
最大时钟频率	33.3 MHz
外部数据总线宽度	32
格式	FIXED POINT
集成缓存	YES
JESD-30 代码	S-PBGA-B196
低功率模式	YES
湿度敏感等级	1
端子数量	196
封装主体材料	PLASTIC/EPOXY
封装代码	BGA
封装等效代码	BGA196(UNSPEC)
封装形状	SQUARE
封装形式	GRID ARRAY
峰值回流温度（摄氏度）	225
电源	3.3,3.3/5 V
认证状态	Not Qualified
速度	66 MHz
最大压摆率	439 mA
最大供电电压	3.45 V
最小供电电压	3.15 V
标称供电电压	3.3 V
表面贴装	YES
技术	CMOS
端子形式	BALL
端子位置	BOTTOM
处于峰值回流温度下的最长时间	NOT SPECIFIED
uPs/uCs/外围集成电路类型	MICROPROCESSOR, RISC
Base Number Matches	1

文档解析

这份文档是一份关于Intel 80960Jx系列32位嵌入式微处理器的数据手册（datasheet）。以下是一些值得关注的技术信息：

产品特性：
- 与所有80960Jx系列处理器代码兼容。
- 高性能嵌入式架构，支持单指令/时钟执行。
- 多种指令和数据缓存配置，最大16 Kbyte指令缓存和4 Kbyte数据缓存。
- 支持高达3倍总线时钟频率的核心时钟速率。
- 多种寻址模式和用户/监控保护模型。
缓存系统：
- 两路组相联指令缓存。
- 直接映射数据缓存，支持写入通过操作。
系统总线：
- 3.3 V供电电压，5 V容错输入，TTL兼容输出。
- 高带宽突发总线，支持32位复用地址/数据，可编程内存配置。
中断控制器：
- 31个可编程优先级，支持多达240个向量。
定时器单元：
- 两个独立的32位计数器，支持内部中断源。
低功耗模式：
- 支持Halt模式以降低功耗。
测试功能：
- 支持IEEE 1149.1 (JTAG)边界扫描兼容性。
封装选项：
- 提供132引脚PGA、132引脚PQFP和196球Mini Plastic Ball Grid Array (MPBGA)封装。
电气规格：
- 包括绝对最大额定值、操作条件、连接建议等。
设备识别：
- 通过特定的设备识别寄存器来识别处理器型号和步进。
热规格：
- 提供热管理配件信息，包括散热器的热阻和最大环境温度参考。
总线功能波形：
- 描述了基本总线状态和边界扫描寄存器的时序。
修订历史：
- 记录了文档的修订历史，包括对数据手册的更新和更正。
产品系列：
- 列出了不同型号的80960Jx处理器及其核心时钟和总线速度。
法律声明：
- 有关Intel产品的法律声明，包括免责声明和产品使用限制。

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80960JA/JF/JD/JS/JC/JT 3.3 V

Embedded 32-Bit Microprocessor

Datasheet

Product Features

Code Compatible with all 80960Jx

Processors

High-Performance Embedded Architecture

— One Instruction/Clock Execution

— Core Clock Rate is:

1x the Bus Clock for 80960JA/JF/JS

2x the Bus Clock for 80960JD/JC

3x the Bus Clock for 80960JT

— Load/Store Programming Model

— Sixteen 32-Bit Global Registers

— Sixteen 32-Bit Local Registers (8 sets)

— Nine Addressing Modes

— User/Supervisor Protection Model

Two-Way Set Associative Instruction

Cache

— 80960JA - 2 Kbyte

— 80960JF/JD - 4 Kbyte

— 80960JS/JC/JT - 16 Kbyte

— Programmable Cache-Locking

Mechanism

Direct Mapped Data Cache

— 80960JA - 1 Kbyte

— 80960JF/JD - 2 Kbyte

— 80960JS/JC/JT - 4 Kbyte

— Write Through Operation

On-Chip Stack Frame Cache

— Seven Register Sets May Be Saved

— Automatic Allocation on Call/Return

— 0-7 Frames Reserved for High-Priority

Interrupts

On-Chip Data RAM

— 1 Kbyte Critical Variable Storage

— Single-Cycle Access

3.3 V Supply Voltage

— 5 V Tolerant Inputs

— TTL Compatible Outputs

High Bandwidth Burst Bus

— 32-Bit Multiplexed Address/Data

— Programmable Memory Configuration

— Selectable 8-, 16-, 32-Bit Bus Widths

— Supports Unaligned Accesses

— Big or Little Endian Byte Ordering

High-Speed Interrupt Controller

— 31 Programmable Priorities

— Eight Maskable Pins plus NMI#

— Up to 240 Vectors in Expanded Mode

Two On-Chip Timers

— Independent 32-Bit Counting

— Clock Prescaling by 1, 2, 4 or 8

— Internal Interrupt Sources

Halt Mode for Low Power

IEEE 1149.1 (JTAG) Boundary Scan

Compatibility

Packages

— 132-Lead Pin Grid Array (PGA)

— 132-Lead Plastic Quad Flat Pack

(PQFP)

— 196-Ball Mini Plastic Ball Grid Array

(MPBGA)

Order Number: 273159-006

August

2004

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL

PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY

ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN

INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS

ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES

RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER

INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving, life sustaining applications.

Intel may make changes to specifications and product descriptions at any time, without notice.

Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for

future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.

The 80960JA/JF/JD/JS/JC/JT 3.3 V Embedded 32-Bit Microprocessor may contain design defects or errors known as errata which may cause the

product to deviate from published specifications. Current characterized errata are available on request.

Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.

Copies of documents which have an ordering number and are referenced in this document, or other Intel literature may be obtained by calling

1-800-548-4725 or by visiting Intel’s website at http://www.intel.com.

AlertVIEW, AnyPoint, AppChoice, BoardWatch, BunnyPeople, CablePort, Celeron, Chips, CT Connect, CT Media, Dialogic, DM3, EtherExpress,

ETOX, FlashFile, i386, i486, i960, iCOMP, InstantIP, Intel, Intel logo, Intel386, Intel486, Intel740, IntelDX2, IntelDX4, IntelSX2, Intel Create & Share,

Intel GigaBlade, Intel InBusiness, Intel Inside, Intel Inside logo, Intel NetBurst, Intel NetMerge, Intel NetStructure, Intel Play, Intel Play logo, Intel

SingleDriver, Intel SpeedStep, Intel StrataFlash, Intel TeamStation, Intel Xeon, Intel XScale, IPLink, Itanium, LANDesk, LanRover, MCS, MMX, MMX

logo, Optimizer logo, OverDrive, Paragon, PC Dads, PC Parents, PDCharm, Pentium, Pentium II Xeon, Pentium III Xeon, Performance at Your

Command, RemoteExpress, Shiva, SmartDie, Solutions960, Sound Mark, StorageExpress, The Computer Inside., The Journey Inside,

TokenExpress, Trillium, VoiceBrick, Vtune, and Xircom are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United

States and other countries.

*Other names and brands may be claimed as the property of others.

2004

Datasheet

Contents

1.0

2.0

Introduction....................................................................................................................................

80960Jx Overview..........................................................................................................................

2.1

2.2

2.3

2.4

2.5

2.6

2.7

2.8

2.9

2.10

3.0

3.1

3.2

80960 Processor Core........................................................................................................ 10

Burst Bus ............................................................................................................................11

Timer Unit ...........................................................................................................................11

Priority Interrupt Controller..................................................................................................11

Instruction Set Summary ....................................................................................................12

Faults and Debugging.........................................................................................................12

Low Power Operation ......................................................................................................... 12

Test Features......................................................................................................................12

Memory-Mapped Control Registers ....................................................................................13

Data Types and Memory Addressing Modes......................................................................13

Available Processors and Packages ..................................................................................15

Pin Descriptions ..................................................................................................................16

3.2.1 Functional Pin Definitions ......................................................................................16

3.2.2 80960Jx 132-Lead PGA Pinout .............................................................................23

3.2.3 80960Jx 132-Lead PQFP Pinout ...........................................................................27

3.2.4 80960Jx 196-Ball MPBGA Pinout ..........................................................................30

Absolute Maximum Ratings ................................................................................................35

Operating Conditions ..........................................................................................................35

Connection Recommendations...........................................................................................36

VCC5 Pin Requirements (VDIFF) .......................................................................................36

VCCPLL Pin Requirements ................................................................................................37

D.C. Specifications .............................................................................................................38

A.C. Specifications..............................................................................................................42

4.7.1 A.C. Test Conditions and Derating Curves ............................................................45

4.7.1.1 Output Delay or Hold vs. Load Capacitance..........................................46

4.7.1.2 T

vs. AD Bus Load Capacitance.........................................................47

4.7.1.3 ICC Active vs. Frequency ......................................................................49

4.7.2 A.C. Timing Waveforms .........................................................................................53

80960JS/JC/JT Device Identification Register....................................................................60

80960JD Device Identification Register ..............................................................................61

80960JA/JF Device Identification Register .........................................................................62

Thermal Management Accessories ....................................................................................68

6.1.1 Heatsinks ...............................................................................................................68

Basic Bus States.................................................................................................................79

Boundary-Scan Register.....................................................................................................80

Packaging Information................................................................................................................15

4.0

Electrical Specifications

.............................................................................................................35

4.1

4.2

4.3

4.4

4.5

4.6

4.7

5.0

Device Identification....................................................................................................................59

5.1

5.2

5.3

6.0

Thermal Specifications

...............................................................................................................63

6.1

7.0

Bus Functional Waveforms

........................................................................................................69

7.1

7.2

Datasheet

Contents

Figures

80960Jx Microprocessor Package Options .................................................................................. 7

80960Jx Block Diagram.............................................................................................................. 10

132-Lead Pin Grid Array Top View-Pins Facing Down............................................................... 23

132-Lead Pin Grid Array Bottom View-Pins Facing Up .............................................................. 24

132-Lead PQFP - Top View ....................................................................................................... 27

196-Ball Mini Plastic Ball Grid Array Top View-Balls Facing Down ............................................ 30

196-Ball Mini Plastic Ball Grid Array Bottom View-Balls Facing Up ........................................... 31

VCC5 Current-Limiting Resistor ................................................................................................. 36

VCCPLL Lowpass Filter ............................................................................................................. 37

A.C. Test Load............................................................................................................................ 45

Output Delay or Hold vs. Load Capacitance–80960JS/JC/JT (3.3 V Signals) .......................... 46

Output Delay or Hold vs. Load Capacitance–80960JS/JC/JT (5 V Signals) ............................. 46

Output Delay or Hold vs. Load Capacitance–80960JA/JF/JD .................................................... 47

vs. AD Bus Load Capacitance–80960JS/JC/JT (3.3 V Signals) ......................................... 47

vs. AD Bus Load Capacitance–80960JS/JC/JT (5 V Signals) ............................................ 48

vs. AD Bus Load Capacitance–80960JA/JF/JD................................................................... 48

Active (Power Supply) vs. Frequency–80960JA/JF ............................................................. 49

80960JA/JF I

Active (Thermal) vs. Frequency ....................................................................... 49

80960JD I

Active (Power Supply) vs. Frequency ................................................................... 50

80960JD I

Active (Thermal) vs. Frequency ............................................................................ 50

80960JC I

Active (Power Supply) vs. Frequency ................................................................... 51

80960JC I

Active (Thermal) vs. Frequency ............................................................................ 51

80960JS I

Active (Power Supply) vs. Frequency ................................................................... 52

80960JS I

Active (Thermal) vs. Frequency ............................................................................ 52

CLKIN Waveform........................................................................................................................ 53

OV1

Output Delay Waveform .................................................................................................... 53

Output Float Waveform ....................................................................................................... 54

IS1

and T

IH1

Input Setup and Hold Waveform .......................................................................... 54

IS2

and T

IH2

Input Setup and Hold Waveform .......................................................................... 54

IS3

and T

IH3

Input Setup and Hold Waveform .......................................................................... 55

IS4

and T

IH4

Input Setup and Hold Waveform .......................................................................... 55

, T

LXL

and T

LXA

Relative Timings Waveform ........................................................................ 56

DT/R# and DEN# Timings Waveform......................................................................................... 56

TCK Waveform ........................................................................................................................... 57

BSIS1

and T

BSIH1

Input Setup and Hold Waveforms................................................................. 57

BSOV1

and T

BSOF1

Output Delay and Output Float Waveform ................................................. 57

BSOV2

and T

BSOF2

Output Delay and Output Float Waveform ................................................. 58

BSIS2

and T

BSIH2

Input Setup and Hold Waveform................................................................... 58

80960JS/JC/JT Device Identification Register Fields ................................................................. 60

80960JD Device Identification Register Fields ........................................................................... 61

80960JA/JF Device Identification Register Fields ...................................................................... 62

Non-Burst Read and Write Transactions Without Wait States, 32-Bit Bus................................. 69

Burst Read and Write Transactions Without Wait States, 32-Bit Bus ........................................ 70

Burst Write Transactions With 2,1,1,1 Wait States, 32-Bit Bus .................................................. 71

Burst Read and Write Transactions Without Wait States, 8-Bit Bus .......................................... 72

Burst Read and Write Transactions With 1, 0 Wait States

and Extra Tr State on Read, 16-Bit Bus ..................................................................................... 73

47 Double Word Read Bus Request, Misaligned One Byte From

Quad Word Boundary, 32-Bit Bus, Little Endian ........................................................................ 74

Datasheet

Contents

HOLD/HOLDA Waveform For Bus Arbitration ............................................................................75

Cold Reset Waveform.................................................................................................................76

Warm Reset Waveform ..............................................................................................................77

Entering the ONCE State............................................................................................................78

Bus States with Arbitration..........................................................................................................80

Summary of Aligned and Unaligned Accesses (32-Bit Bus).......................................................84

Summary of Aligned and Unaligned Accesses (32-Bit Bus) (Continued) ...................................85

Tables

80960Jx 3.3-V Microprocessor Family ......................................................................................... 7

80960Jx Instruction Set ..............................................................................................................14

80960Jx Processors Available in 132-Pin PGA Package...........................................................15

80960Jx Processors Available in 132-Pin PQFP Package.........................................................15

80960Jx Processors Available in Extended Temperature .........................................................16

80960Jx Processors Available in 196-Ball MPBGA Package.....................................................16

Pin Description Nomenclature ....................................................................................................17

Pin Description—External Bus Signals.......................................................................................18

Pin Description—Processor Control Signals, Test Signals, and Power .....................................21

Pin Description—Interrupt Unit Signals ......................................................................................22

132-Lead PGA Pinout—In Signal Order .....................................................................................25

132-Lead PGA Pinout—In Pin Order..........................................................................................26

132-Lead PQFP Pinout—In Signal Order...................................................................................28

132-Lead PQFP Pinout—In Pin Order........................................................................................29

196-Ball MPBGA Pinout—In Signal Order..................................................................................32

196-Ball MPBGA Pinout—In Pin Order ......................................................................................33

Absolute Maximum Ratings ........................................................................................................35

80960Jx Operating Conditions ...................................................................................................35

VDIFF Parameters......................................................................................................................37

80960Jx D.C. Characteristics .....................................................................................................38

80960Jx I

Characteristics .......................................................................................................39

80960Jx A.C. Characteristics .....................................................................................................42

Note Definitions for Table 22, 80960Jx AC Characteristics........................................................45

80960Jx Device Type and Stepping Reference .........................................................................59

80960JS/JC/JT Device ID Register Field Definitions..................................................................60

80960JS/JC/JT Device ID Model Types .....................................................................................60

80960JD Device ID Field Definitions ..........................................................................................61

80960JD Device ID Model Types ...............................................................................................61

80960JA/JF Device ID Field Definitions .....................................................................................62

80960JA/JF Device ID Model Types ..........................................................................................62

Thermal Resistance for q

and q

Reference Table ..............................................................63

Maximum Ambient Temperature Reference Table.....................................................................63

132-Lead PGA Package Thermal Characteristics ......................................................................64

80960JA/JF/JD 196-Ball MPBGA Package Thermal Characteristics .........................................64

80960JS/JC/JT 196-Ball MPBGA Package Thermal Characteristics .........................................65

132-Lead PQFP Package Thermal Characteristics....................................................................65

Maximum T

at Various Airflows in °C (80960JT) ......................................................................66

Maximum T

at Various Airflows in °C (80960JC)......................................................................66

Maximum T

at Various Airflows in °C (80960JD)......................................................................67

Maximum T

at Various Airflows in °C (80960JS) ......................................................................67

Maximum T

at Various Airflows in °C (80960JA/JF) .................................................................68

Datasheet

GD80960JC66相似产品对比

	GD80960JC66	GD80960JC66ET	GD80960JT100
描述	RISC Microprocessor, 32-Bit, 66MHz, CMOS, PBGA196, PLASTIC, BGA-196	RISC Microprocessor, 32-Bit, 66MHz, CMOS, PBGA196, PLASTIC, BGA-196	RISC Microprocessor, 32-Bit, 100MHz, CMOS, PBGA196, PLASTIC, BGA-196
是否Rohs认证	不符合	不符合	不符合
零件包装代码	BGA	BGA	BGA
包装说明	BGA, BGA196(UNSPEC)	BGA, BGA196,14X14,40	BGA, BGA196(UNSPEC)
针数	196	196	196
Reach Compliance Code	compliant	compliant	compliant
ECCN代码	3A991.A.2	3A991.A.2	3A991.A.2
地址总线宽度	32	32	32
位大小	32	32	32
边界扫描	YES	YES	YES
最大时钟频率	33.3 MHz	33.3 MHz	33.3 MHz
外部数据总线宽度	32	32	32
格式	FIXED POINT	FIXED POINT	FIXED POINT
集成缓存	YES	YES	YES
JESD-30 代码	S-PBGA-B196	S-PBGA-B196	S-PBGA-B196
低功率模式	YES	YES	YES
湿度敏感等级	1	1	1
端子数量	196	196	196
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	BGA	BGA	BGA
封装等效代码	BGA196(UNSPEC)	BGA196,14X14,40	BGA196(UNSPEC)
封装形状	SQUARE	SQUARE	SQUARE
封装形式	GRID ARRAY	GRID ARRAY	GRID ARRAY
峰值回流温度（摄氏度）	225	225	225
电源	3.3,3.3/5 V	3.3,3.3/5 V	3.3,3.3/5 V
认证状态	Not Qualified	Not Qualified	Not Qualified
速度	66 MHz	66 MHz	100 MHz
最大压摆率	439 mA	360 mA	600 mA
最大供电电压	3.45 V	3.45 V	3.45 V
最小供电电压	3.15 V	3.15 V	3.15 V
标称供电电压	3.3 V	3.3 V	3.3 V
表面贴装	YES	YES	YES
技术	CMOS	CMOS	CMOS
端子形式	BALL	BALL	BALL
端子位置	BOTTOM	BOTTOM	BOTTOM
处于峰值回流温度下的最长时间	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
uPs/uCs/外围集成电路类型	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC
Base Number Matches	1	1	1
厂商名称	Intel(英特尔)	Intel(英特尔)	-

GD80960JC66

GD80960JC66概述

GD80960JC66规格参数

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GD80960JC66相似产品对比

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