SAM D5x/E5x Family Data
Sheet
32-bit ARM
®
Cortex
®
-M4F MCUs with 1 Msps 12-bit ADC,
QSPI, USB, Ethernet, and PTC
Features
Operating Conditions:
• 1.71V to 3.63V, -40°C to +125°C, DC to 100 MHz
• 1.71V to 3.63V, -40°C to +105°C, DC to 120 MHz
• 1.71V to 3.63V, -40°C to +85°C, DC to 120 MHz
Core: 120 MHz Arm Cortex-M4
• 403 CoreMark
®
at 120 MHz
• 4 KB combined instruction cache and data cache
• 8-Zone Memory Protection Unit (MPU)
• Thumb
®
-2 instruction set
• Embedded Trace Module (ETM) with instruction trace stream
• Core Sight Embedded Trace Buffer (ETB)
• Trace Port Interface Unit (TPIU)
• Floating Point Unit (FPU)
Memories
• 1 MB/512 KB/256 KB in-system self-programmable Flash with:
– Error Correction Code (ECC)
– Dual bank with Read-While-Write (RWW) support
– EEPROM hardware emulation (SmartEEPROM)
• 128 KB, 192 KB, 256 KB SRAM main memory
– 64 KB, 96 KB, 128 KB of Error Correction Code (ECC) RAM option
• Up to 4 KB of Tightly Coupled Memory (TCM)
• Up to 8 KB additional SRAM
– Can be retained in backup mode
• Eight 32-bit backup registers
System
• Power-on Reset (POR) and Brown-out detection (BOD)
• Internal and external clock options
• External Interrupt Controller (EIC)
• 16 external interrupts
• One non-maskable interrupt
• Two-pin Serial Wire Debug (SWD) programming, test, and debugging interface
Power Supply
• Idle, Standby, Hibernate, Backup, and Off sleep modes
• SleepWalking peripherals
• Battery backup support
• Embedded Buck/LDO regulator supporting on-the-fly selection
©
2021 Microchip Technology Inc.
Datasheet
DS60001507G-page 1
SAM D5x/E5x Family Data Sheet
High-Performance Peripherals
• 32-channel Direct Memory Access Controller (DMAC)
– Built-in CRC with memory CRC generation/monitor hardware support
• Up to two SD/MMC Host Controller (SDHC)
– Up to 50 MHz operation
– 4-bit or 1-bit interface
– Compatibility with SD and SDHC memory card specification version 3.01
– Compatibility with SDIO specification version 3.0
– Compliant with JDEC specification, MMC memory cards V4.51
• One Quad I/O Serial Peripheral Interface (QSPI)
– eXecute-In-Place (XIP) support
– Dedicated AHB memory zone
• One Ethernet MAC (SAM E53 and SAM E54)
– 10/100 Mbps in MII and RMII with dedicated DMA
®
– IEEE 1588 Precision Time Protocol (PTP) support
– IEEE 1588 Time Stamping Unit (TSU) support
– IEEE802.3AZ energy efficiency support
– Support for 802.1AS and 1588 precision clock synchronization protocol
– Wake on LAN support
• Up to two Controller Area Network (CAN) (that is., SAM E51 and SAM E54)
– Support for CAN 2.0A/CAN 2.0B and CAN-FD (ISO 11898-1:2016)
• One Full-Speed (12 Mbps) Universal Serial Bus (USB) 2.0 interface
– Embedded host and device function
– Eight endpoints
– On-chip transceiver with integrated serial resistor
System Peripherals
• 32-channel Event System
• Up to eight Serial Communication Interfaces (SERCOM), each configurable to operate as either:
– USART with full-duplex and single-wire half-duplex configuration
– ISO7816
– I
2
C up to 3.4 MHz
– SPI
– LIN master/slave
– RS485
– SPI inter-byte space
• Up to eight 16-bit Timers/Counters (TC) each configurable as:
– 16-bit TC with two compare/capture channels
– 8-bit TC with two compare/capture channels
– 32-bit TC with two compare/capture channels, by pairing two TCs
• Two 24-bit Timer/Counters for Control (TCC), with extended functions:
– Up to six compare channels with optional complementary output
– Generation of synchronized pulse width modulation (PWM) pattern across port pins
– Deterministic fault protection, fast decay and configurable dead-time between complementary output
– Dithering that increase resolution with up to 5 bit and reduce quantization error
• Up to Three 16-bit Timer/Counters for Control (TCC) with extended functions:
– Up to three compare channels with optional complementary output
• PWM Modes using TC and TCC peripherals:
– Up to six PWM channels on each 24-bit TCC
– Up to three PWM channels on each 16-bit TCC
©
2021 Microchip Technology Inc.
Datasheet
DS60001507G-page 2
SAM D5x/E5x Family Data Sheet
– Up to two PWM channels on each 16-bit TC
32-bit Real Time Counter (RTC) with clock/calendar function
Up to 5 wake-up pins with tamper detection and debouncing filter
Watchdog Timer (WDT) with Window mode
CRC-32 generator
One two-channel Inter-IC Sound Interface (I
2
S)
Position Decoder (PDEC)
Frequency meter (FREQM)
One Four-LUTs Configurable Custom Logic (CCL)
Dual 12-bit, 1 MSPS Analog-to-Digital Converter (ADC) with up to 16 channels each:
– Differential and single-ended input
– Automatic offset and gain error compensation
– Oversampling and decimation in hardware to support 13-bit, 14-bit, 15-bit, or 16-bit resolution
Dual 12-bit, 1 MSPS output Digital-to-Analog Converter (DAC)
Two Analog Comparators (AC) with Window Compare function
Two temperature sensors
Parallel Capture Controller (PCC)
– Up to 14-bit parallel capture mode
Peripheral Touch Controller (PTC)
– Capacitive Touch buttons, sliders, and wheels
– Wake-up on touch
– Up to 32 self-capacitance and up to 256 mutual-capacitance channels
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Cryptography
• One Advanced Encryption System (AES) with 256-bit key length and up to 2 MB/s data rate
– Five confidential modes of operation (ECB, CBC, CFB, OFB, CTR)
– Supports counter with CBC-MAC mode
– Galois Counter Mode (GCM)
• True Random Number Generator (TRNG)
• Public Key Cryptography Controller (PUKCC) and associated Classical Public Key Cryptography Library
(PUKCL)
– RSA, DSA
– Elliptic Curves Cryptography (ECC) ECC GF(2n), ECC GF(p)
• Integrity Check Module (ICM) based on Secure Hash Algorithm (SHA1, SHA224, SHA256), DMA assisted
Oscillators
• 32.768 kHz crystal oscillator (XOSC32K)
– Clock failure detection
• Up to two 8 MHz to 48 MHz crystal oscillator (XOSC)
– Clock failure detection
• 32.768 kHz ultra low-power internal oscillator (OSCULP32K)
• 48 MHz Digital Frequency Locked Loop (DFLL48M)
• Two 96-200 MHz Fractional Digital Phased Locked Loop (FDPLL200M)
I/O
• Up to 99 programmable I/O pins
Qualification
•
AEC-Q100 Grade 1 (-40°C to 125°C)
©
2021 Microchip Technology Inc.
Datasheet
DS60001507G-page 3
SAM D5x/E5x Family Data Sheet
Packages
Table 1. Package Types
Parameter
VQFN
Pin Count
I/O Pins (up to)
Contact/Lead Pitch
Dimension
48
37
0.5
7x7x0.9
64
51
0.5
9x9x0.9
64
51
0.5
10x10x1.2
Package Type
TQFP
100
81
0.5
14x14x1.2
128
99
0.4
14x14x1.2
TFBGA
120
90
0.5
8x8x1.2
WLCSP
64
51
0.4
3.59x3.51x0.53
Note:
All dimensions are in millimeter (mm) unless specified.
©
2021 Microchip Technology Inc.
Datasheet
DS60001507G-page 4
SAM D5x/E5x Family Data Sheet
Table of Contents
Features......................................................................................................................................................... 1
1.
2.
3.
Configuration Summary........................................................................................................................ 17
Ordering Information............................................................................................................................. 19
Block Diagram.......................................................................................................................................20
3.1.
4.
SAM D5x/E5x Block Diagram.....................................................................................................20
Pinout.................................................................................................................................................... 22
4.1.
4.2.
4.3.
4.4.
4.5.
4.6.
48-Pin VQFN Package............................................................................................................... 22
64-Pin TQFP and VQFN Package............................................................................................. 23
64-Pin WLCSP Package............................................................................................................ 24
100-Pin TQFP Package............................................................................................................. 25
120-ball TFBGA Package...........................................................................................................26
128-Pin TQFP Package............................................................................................................. 27
5.
6.
Signal Descriptions List.........................................................................................................................28
I/O Multiplexing and Considerations..................................................................................................... 32
6.1.
6.2.
Multiplexed Signals.................................................................................................................... 32
Other Functions..........................................................................................................................36
7.
Power Supply and Start-Up Considerations..........................................................................................46
7.1.
7.2.
7.3.
7.4.
Power Domain Overview............................................................................................................46
Power Supply Considerations.................................................................................................... 46
Power-Up................................................................................................................................... 48
Power-On Reset and Brown-Out Detector................................................................................. 49
8.
9.
Product Memory Mapping Overview..................................................................................................... 51
Memories.............................................................................................................................................. 53
9.1.
9.2.
9.3.
9.4.
9.5.
9.6.
Embedded Memories................................................................................................................. 53
Physical Memory Map................................................................................................................ 53
SRAM Memory Configuration.....................................................................................................53
NVM User Row Mapping............................................................................................................56
NVM Software Calibration Area Mapping...................................................................................57
Serial Number............................................................................................................................ 59
10. Processor and Architecture...................................................................................................................60
10.1. Cortex M4 Processor..................................................................................................................60
10.2. Nested Vector Interrupt Controller..............................................................................................62
10.3. High-Speed Bus System............................................................................................................ 73
11. CMCC - Cortex M Cache Controller......................................................................................................77
11.1.
11.2.
11.3.
11.4.
Overview.................................................................................................................................... 77
Features..................................................................................................................................... 77
Block Diagram............................................................................................................................ 78
Signal Description...................................................................................................................... 79
©
2021 Microchip Technology Inc.
Datasheet
DS60001507G-page 5
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