REVISIONS
LTR
A
DESCRIPTION
Add one vendor, CAGE 18324. Inactivate Military drawing part
numbers 5962-8778801FX, 5962-8778801EX, for new design. Add
paragraph 4.5 and make editorial changes throughout.
Changed generic number and vendor similar part number. Changes
to table I. Remove programming procedures for method A. Deleted
programming waveforms and table III. Editorial changes throughout.
Updated drawing to current requirements. Editorial changes
throughout. – gap
Boilerplate update, part of 5 year review.
ksr
DATE (YR-MO-DA)
88-09-16
APPROVED
M. A. Frye
B
90-01-17
M. A. Frye
C
D
E
01-04-03
07-01-30
13-05-28
Raymond Monnin
Joseph Rodenbeck
Charles Saffle
Updated boilerplate in accordance with the latest MIL-PRF-38535
requirements. glg
THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED.
REV
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OF SHEETS
PMIC N/A
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SHEET
PREPARED BY
E
1
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Monica L. Grosel
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
CHECKED BY
Ray Monnin
APPROVED BY
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
http://www.landandmaritime.dla.mil
Michael A. Frye
DRAWING APPROVAL DATE
88-03-01
AMSC N/A
REVISION LEVEL
MICROCIRCUIT, MEMORY,
DIGITAL, 256 X 4-BIT,
BIPOLAR PROM,
MONOLITHIC SILICON
SIZE
A
SHEET
CAGE CODE
E
67268
1 OF
11
5962-87788
5962-E440-13
DSCC FORM 2233
APR 97
1. SCOPE
1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in
accordance with MIL-PRF-38535, appendix A.
1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example:
5962-87788
01
E
X
Drawing number
Device type
(see 1.2.1)
Case outline
(see 1.2.2)
Lead finish
(see 1.2.3)
1.2.1 Device type(s). The device type(s) identify the circuit function as follows:
Device type
01
02
Generic number
27S21, 82S129
27S21A, 82S129A
Circuit function
256 x 4-bit bipolar PROM (three-state)
256 x 4-bit bipolar PROM (three-state)
Access time
60 ns
40 ns
1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
E
F
2
Descriptive designator
GDIP1-T16 or CDIP2-T16
GDFP2-F16 or CDFP3-F16
CQCC1-N20
Terminals
16
16
20
Package style
Dual-in-line
Flat package
Square leadless chip carrier
1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A.
1.3 Absolute maximum ratings.
Supply voltage range ...............................................................................................
Input voltage range ..................................................................................................
Storage temperature range .......................................................................................
Maximum power dissipation (P
D
) per device 1/ .......................................................
Lead temperature (soldering, 10 seconds) ..............................................................
Thermal resistance, junction-to-case (θ
JC
) 2/ ..........................................................
Junction temperature (T
J
) ........................................................................................
DC voltage applied to outputs range (except
during programming) .............................................................................................
DC voltage applied to outputs during programming .................................................
Output current into outputs during programming
(maximum duration of 1 second) ...........................................................................
DC input current range .............................................................................................
1.4 Recommended operating conditions.
Supply voltage range (V
CC
) .........................................................................
Minimum high level input voltage (V
IH
) ........................................................
Maximum low level input voltage (V
IL
) ........................................................
Case operating temperature range (T
C
) ......................................................
_______
1/ Must withstand the added P
D
due to short circuit test, e.g., I
OS
.
2/ Heat sinking is recommended to reduce the junction temperature.
4.5 V dc minimum to 5.5 V dc maximum
2.0 V dc
0.8 V dc
-55°C to +125°C
-0.5 V dc to +7.0 V dc
-0.5 V dc to +5.5 V dc
-65°C to +150°C
715 mW
+300°C
See MIL-STD-1835
+175°C
-0.5 V dc to +5.5 V dc maximum
21 V dc
250 mA
-30 mA to +5.0 mA
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-87788
SHEET
E
2
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 -
MIL-STD-1835 -
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 -
MIL-HDBK-780 -
List of Standard Microcircuit Drawings.
Standard Microcircuit Drawings.
(Copies of these documents are available online at
http://quicksearch.dla.mil/
or from the Standardization Document Order
Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-
JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer
Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-
PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying
activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan
may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device.
These modifications shall not affect the PIN as described herein. A "Q" or "QML" certification mark in accordance with MIL-
PRF-38535 is required to identify when the QML flow option is used.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38535, appendix A and herein.
3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.
3.2.2 Truth table. The truth table shall be as specified on figure 2.
3.2.2.1 Unprogrammed devices. The truth table for unprogrammed devices shall be as specified on figure 2.
3.2.2.2 Programmed devices. The requirements for supplying programmed devices are not part of this drawing.
3.2.3 Logic diagram(s). The logic diagram(s) shall be as specified on figure 3.
3.2.4 Switching test circuit. The switching test circuit shall be as specified on figure 4.
3.2.5 Switching waveforms. The switching waveforms shall be as specified on figure 5.
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are
as specified in table I and shall apply over the full case operating temperature range.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-87788
SHEET
E
3
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are described in table I.
3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN
listed in 1.2 herein. In addition, the manufacturer's PIN may also be marked. For packages where marking of the entire SMD
PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the "5962-" on the device.
3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance
to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a "Q" or "QML" certification mark in
accordance with MIL-PRF-38535 to identify when the QML flow option is used.
3.6 Processing options. Since the PROM is an unprogrammed memory capable of being programmed by either the
manufacturer or the user to result in a wide variety of PROM configurations, two processing options are provided for selection in
the contract, using an altered item drawing.
3.6.1 Unprogrammed PROM delivered to the user. All testing shall be verified through group A testing as defined in 4.3.1. It
is recommended that users perform subgroups 7 and 9 after programming to verify the specific program configuration.
3.6.2 Manufacturer-programmed PROM delivered to the user. All testing requirements and quality assurance provisions
herein, including the requirements of the altered item drawing shall be satisfied by the manufacturer prior to delivery.
3.7 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an
approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DLA Land and
Maritime-VA prior to listing as an approved source of supply shall affirm that the manufacturer's product meets the
requirements of MIL-PRF-38535, appendix A and the requirements herein.
3.8 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided
with each lot of microcircuits delivered to this drawing.
3.9 Notification of change. Notification of change to DLA Land and Maritime-VA shall be required for any change that
affects this drawing.
3.10 Verification and review. DLA Land and Maritime, DLA Land and Maritime's agent, and the acquiring activity retain the
option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made
available onshore at the option of the reviewer.
4. VERIFICATION
4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535,
appendix A.
4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices
prior to quality conformance inspection. The following additional criteria shall apply:
a. Burn-in test, method 1015 of MIL-STD-883.
(1) Test condition C or D. The test circuit shall be maintained by the manufacturer under document revision level
control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify
the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method
1015 of MIL-STD-883.
(2) T
A
= +125°C, minimum.
b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter
tests prior to burn-in are optional at the discretion of the manufacturer.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-87788
SHEET
E
4
TABLE I. Electrical performance characteristics.
Conditions
-55°C
≤
T
C
≤
+125°C
4.5 V
≤
V
CC
≤
5.5 V
unless otherwise specified
Output high voltage
Output low voltage
Input high level
current
Input low level
current
Power supply current
Input clamp voltage
High output leakage
current
I
OZL
Output short circuit
current
Functional tests
Address access time
t
AVQV
I
OS
I
CC
V
IC
I
OZH
V
CC
= 5.5 V, V
IN
= 0.0 V
V
CC
= 4.5 V, I
IN
= -18 mA
V
CC
= 5.5 V
V
IH
= 2.0 V
V
IL
= 0.8 V
V
CS
= 2.4 V
V
CC
= 5.5 V
V
OUT
= 0.0 V
See 4.3.1d
C
L
= 50 pF
S1 is closed
See figures 4 and 5
Enable access time
Enable recovery time
t
GVQV
t
GVQZ
See figures 4 and 5 2/
See figures 4 and 5 2/
9, 10, 11
9, 10, 11
02
01
02
01
02
40
30
25
30
25
ns
ns
1/
7, 8
9, 10, 11
01
60
ns
1, 2, 3
-15
90
mA
V
O
= 0.4 V
-40
V
O
= 4.5 V
1, 2, 3
1, 2, 3
1, 2, 3
130
-1.2
40
mA
V
µA
I
IL
V
CC
= 5.5 V, V
IN
= 0.45 V
1, 2, 3
-250
µA
V
OH
V
OL
I
IH
V
CC
= 4.5 V, I
OH
= -2.0 mA
V
IH
= 2.0 V, V
IL
= 0.8 V
V
CC
= 4.5 V, I
OL
= 16 mA
V
IH
= 2.0 V, V
IL
= 0.8 V
V
CC
= 5.5 V, V
IN
= 5.5 V
1, 2, 3
40
µA
1, 2, 3
.5
V
1, 2, 3
All
Test
Symbol
Group A
subgroups
Device
type
Min
2.4
Limits
Max
Unit
V
1/ Not more than one output should be shorted at a time and the duration of the short circuit condition should not exceed one
second.
2/ t
GVQV
is tested with C
L
= 50 pF to the 1.5 V level; S1 is open for high impedance to high tests and closed for high impedance
to low tests. t
GVQZ
is tested with C
L
= 5 pF. High to high impedance tests are made with S1 open to an output voltage of
V
OH
- 0.5 V. Low to high impedance tests are made with S1 closed to the V
OL
+ 0.5 V level.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-87788
SHEET
E
5
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