Signal Descriptions ........................................................................................................................................... 7
Configuration and Memory Map ....................................................................................................................... 8
Memory Configuration and Block Diagram .................................................................................................... 8
Memory Map – 16Mb Density ........................................................................................................................... 9
Operating Features Overview .......................................................................................................................... 10
Sharing the Overhead of Modifying Data ..................................................................................................... 10
Easy Method to Modify Data ....................................................................................................................... 10
Fast Method to Modify Data ........................................................................................................................ 10
Polling During a WRITE, PROGRAM, or ERASE Cycle ................................................................................... 11
Active Power, Standby Power, and Deep Power-Down .................................................................................. 11
Status Register ............................................................................................................................................ 11
Serial Peripheral Interface Modes .................................................................................................................... 13
Command Set Overview ................................................................................................................................. 15
READ STATUS REGISTER ................................................................................................................................ 20
WIP Bit ...................................................................................................................................................... 21
WEL Bit ...................................................................................................................................................... 21
READ DATA BYTES ......................................................................................................................................... 22
READ DATA BYTES at HIGHER SPEED ............................................................................................................ 23
PAGE PROGRAM ............................................................................................................................................ 25
DEEP POWER-DOWN ..................................................................................................................................... 28
RELEASE from DEEP POWER-DOWN .............................................................................................................. 29
Power-Up and Power-Down ............................................................................................................................ 30
Maximum Ratings and Operating Conditions .................................................................................................. 32
AC Characteristics .......................................................................................................................................... 34
Package Information ...................................................................................................................................... 41
Device Ordering Information .......................................................................................................................... 43
Standard Parts ............................................................................................................................................ 43
Revision History ............................................................................................................................................. 44
Rev. C – 03/14 ............................................................................................................................................. 44
Rev. B – 06/13 ............................................................................................................................................. 44
Rev. A – 05/13 ............................................................................................................................................. 44
PDF: 09005aef845660f7
m45pe16.pdf - Rev. C 03/14 EN
2
Micron Technology, Inc. reserves the right to change products or specifications without notice.
Figure 9: READ STATUS REGISTER Command Sequence ................................................................................ 20
Figure 10: Status Register Format ................................................................................................................... 21
Figure 11: READ DATA BYTES Command Sequence ........................................................................................ 22
Figure 12: READ DATA BYTES at HIGHER SPEED Command Sequence ........................................................... 23
Table 10: DC Current Specifications ............................................................................................................... 33
Table 11: DC Voltage Specifications ................................................................................................................ 33
Table 12: AC Measurement Conditions ........................................................................................................... 34
Xilinx 三态以太网 MAC 核是可参数化内核,特别适于交换机和路由器等网络设备。
The TEMAC core is ideally suited for the development of high density Gigabit Ethernet communications an ......