BOARD/WIRE-TO-BOARD
CONNECTORS
DDR4 MEMORY MODULE SOCKETS
OVERVIEW
Vertical DDR4 DIMM sockets from FCI provide 288 contacts
on 0.85mm pitch and are designed to accept DDR4 memory
modules that conform to JEDEC MO-309. The sockets
facilitate convenient memory expansion in servers,
workstations, desktop PCs, and embedded applications in
communications and industrial equipment.
The low-resistance contacts also support the use of
RDIMM (registered DIMM), which helps to further reduce
power consumption in datacenter hardware such as
servers, storage and networking equipment. The low
2.4mm module seating plane and slim ejector designs
reduce the overall profile of the connector and installed
module to help optimize airflow.
Surface-mount (SMT), plated-through-hole (PTH) solder,
and press-fit (PF) connector termination options
are offered.
FEATURES & BENEFITS
• Sockets provide mechanical voltage keying and
end latches for module retention and ejection
• Low insertion-force design requires less than
24 pounds force for module installation
• Available solder tail options support use on 1.6mm or
2.4mm thick motherboards
• Press-fit termination option supports use on 1.6mm
min. host-PCBs
• Contact design protects against stubbing and
supports high-speed serial differential signaling
at data rates extending to 3.2Gb/s for DDR4
• Low contact resistance supports RDIMM modules
• Slim latch design optimizes airflow
• RoHS-Compliant and lead-free process-compatible
options aid compliance with lead
elimination initiatives
TARGET MARKETS/APPLICATIONS
• Data
•
Servers
•
Storage Systems
•
Supercomputers
•
Workstations
•
Desktop PCs
• Communications
•
Switches
•
Routers
•
Wireless Infrastructure
• Industrial
•
Embedded Systems
DDR4 MEMORY MODULE SOCKETS
TECHNICAL INFORMATION
MATERIALS
• Contact : Copper alloy
• Contact finish:
•
Contact area: 15μin. , 20μin. or 30μin. Gold, 30μin.
GXT or Gold flash over nickel
•
Termination area: Tin over nickel
• Forklock: Copper alloy
• Housing: High temperature thermoplastic, UL94V-0
• Ejector: High performance thermoplastic, UL94V-0
• JEDEC
•
Module Outline: MO-309
•
Socket Outlines:
•
PTH solder: SO-016
•
Surface-mount: SO-017
•
Press-fit: SO-019
MECHANICAL PERFORMANCE
• Durability: 25 cycles
SPECIFICATIONS
• FCI
•
Product specification: GS-12-1092
•
Packaging specification: GS-14-2267
ELECTRICAL PERFORMANCE
• Contact resistance: 10mΩ initial, 10mΩ increase
after environmental test
• Current rating: 0.75A/contact (De-rated) with 30 °C
temperature rise above ambient
PACKAGING
• Tray
APPROVALS & CERTIFICATIONS
• UL and CSA approvals pending
PART NUMBERS
Type
Surface Mount (SMT) termination
with forklocks or solder tabs
Color Options
Housing: Black
Ejectors: Black
Part References
10124677
10124632
Plated-Through-Hole (PTH) Solder- Housing: Black, Ivory and Blue
termination with forklocks
Additional Colors available
Ejectors: Black, Ivory and Blue
Press fit (PF) termination
with molded post
Housing: Black, Ivory and Blue
Additional Colors available
Ejectors: Black, Ivory and Blue
10124806
For more information,
please contact: Communications@fci.com
or visit us at
www.fci.com
Disclaimer
Please note that the above information is subject to change without notice.
BWBDDR4MMS0613EA4
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