PRODUCT SPECIFICATION
SERIES 71308
C-GRID
SMT
.100" GRID DUAL ROW HEADERS
SERIES 71308
1.0
2.0
SCOPE
PRDUCT DESCRIPTION
2.1
PRODUCT NAME AND SERIES NUMBERS
2.2
DIMENSIONS, MATERIALS, PLATINGS AND MARKINGS
2.3
SAFETY AGENCY APPROVALS
APPLICABLE DOCUMENTS AND SPECIFICATIONS
3.1
MOLEX DOCUMENTS
3.2
OTHER DOCUMENTS
RATINGS
4.1
VOLTAGE
4.2
CURRENT
4.3
TEMPERATURE
PERFORMANCE
5.1
ELECTRICAL REQUIREMENTS
5.2
MECHANICAL REQUIREMENTS
5.3
ENVIRONMENTAL REQUIREMENTS
PACKAGING
3.0
4.0
5.0
6.0
REVISION:
ECR/ECN INFORMATION:
EC No:
UCP2013-0050
DATE:
2012/07/09
TITLE:
D4
.100" GRID VERTICAL DUAL
ROW SURFACE MOUNT
HEADERS
CHECKED BY:
SHEET No.
1
of
3
APPROVED BY:
DOCUMENT NUMBER:
CREATED / REVISED BY:
PS-71308
MMSTROH
MKIPPER
FSMITH
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC
PRODUCT SPECIFICATION
1.0
SCOPE:
This specification covers C-Grid
dual row surface mount headers. They utilize a gull wing
design for surface mounting. The mating pins are .025in (0.64mm) square on a .100in (2.54mm)
grid.
PRODUCT DESCRIPTION:
2.1
PRODUCT NAME AND SERIES NUMBER(S)
2.1.1 SERIES 71308: Low profile vertical surface mount header.
DIMENSIONS, MATERIALS, PLATINGS AND MARKINGS
C-Grid
series 71308 is available in circuit sizes of 4 through 100 circuits and is end to
end stackable. The wafer is made from glass filled Liquid Crystal Polymer, (LCP) having
a UL 94V-0 flammability rating. Mating pin lengths are .240in (6.0mm), and .320in
(8.1mm) with gold or tin plating. Integral mounting pegs are offered in two lengths for
each series as an option to aid assembly and/or retention during soldering. For further
details, refer to sales document in section 3.1.
2.2
SAFETY AGENCY APPROVALS
2.2.1 UNDERWRITERS' LABORATORIES (UL) FILE NUMBER: E29179
2.2.2 CANADIAN STANDARDS ASSOCIATION (CSA) FILE NUMBER: LR19980
APPLICABLE DOCUMENTS AND SPECIFICATIONS
3.1
MOLEX DOCUMENTS
SD--71308-001
SALES DRAWING FOR LOW PROFILE C-GRID
SMT HEADER
PK-70873-0353 PACKAGING SPECIFICATION FOR BULK PACKAGED PRODUCT
(CIRCUIT SIZES 4-8)
PK-70873-0041 PACKAGING SPECIFICATION FOR TUBE PACKAGED PRODUCT
(CIRCUIT SIZES 10-80)
PK-70873-0691 PACKAGING SPECIFICATION FOR TUBE PACKAGED PRODUCT
WITH PICK AND PLACE CAPS
PK-70873-0805 PACKAGING SPECIFICATION FOR TAPE AND REEL PRODUCT
WITH PICK AND PLACE CAPS
PS-45499-002
COSMETIC SPECIFICATION
3.2
OTHER DOCUMENTS
MIL STD 202F
RATINGS
4.1
VOLTAGE:
250 Volts DC
4.2
CURRENT:
3.0 Amps (DC) max
4.3
TEMPERATURE
4.3.1 PROCESSING TEMPERATURE: 245°C max. intermittent for bright tin plating
260°C max. intermittent for select gold plating.
4.3.2 OPERATING TEMPERATURE: –40°C to +120°C
PERFORMANCE
5.1
ELECTRICAL REQUIREMENTS
ECR/ECN INFORMATION:
EC No:
UCP2013-0050
DATE:
2012/07/09
TITLE:
2.0
3.0
4.0
5.0
REVISION:
D4
.100" GRID VERTICAL DUAL
ROW SURFACE MOUNT
HEADERS
CHECKED BY:
SHEET No.
2
of
3
APPROVED BY:
DOCUMENT NUMBER:
CREATED / REVISED BY:
PS-71308
MMSTROH
MKIPPER
FSMITH
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC
PRODUCT SPECIFICATION
5.1.1 INSULATION RESISTANCE: Greater than 1000MΩ
5.1.2 DIELECTRIC WITHSTANDING VOLTAGE: Greater than 600Volts at sea level.
5.1.3 TEMPERATURE RISE: 30°C max at rated current
MECHANICAL REQUIREMENTS
5.2.1 RETENTION PEGS (Optional Item)
5.2.1.1
INSERTION FORCE: 8.0 lbs average per peg (.062in PCB hole)
5.2.1.2
RETENTION FORCE: 4.0 lbs average per peg (.062in PCB hole)
ENVIRONMENTAL REQUIREMENTS
5.3.1 THERMAL SHOCK
10 Cycles from -40°C to105°C, ½ hour at each temperature setting.
5.3.2 CHEMICAL RESISTANCE
Per Mil. Std. 202F, Method 215A.
5.2
5.3
6.0
PACKAGING
Product is available in bulk pack, tube pack and tape and reel. Tape and reel packaging
includes a pick-n-place cap, ideal for high volume robotic placement. The pick-n-place cap is
optional for tube packaged product. Refer to section 3.1 for applicable packaging document.
REVISION:
ECR/ECN INFORMATION:
EC No:
UCP2013-0050
DATE:
2012/07/09
TITLE:
D4
.100" GRID VERTICAL DUAL
ROW SURFACE MOUNT
HEADERS
CHECKED BY:
SHEET No.
3
of
3
APPROVED BY:
DOCUMENT NUMBER:
CREATED / REVISED BY:
PS-71308
MMSTROH
MKIPPER
FSMITH
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC
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