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TS8000规格参数

参数名称属性值
类别
厂商名称Triad Semiconductor
包装卷带(TR)剪切带(CT)Digi-Reel® 得捷定制卷带
类型前端
输入类型模拟
输出类型数字
电流 - 供电2.5 mA
工作温度0°C ~ 85°C(TA)
安装类型表面贴装型
封装/外壳16-UFBGA,WLCSP
供应商器件封装16-WLCSP(1.66x1.66)

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TS8000 Ultrasonic to Digital Converter
Preliminary Data Sheet
Description
Triad Semiconductor’s TS8000 is a complete
ultrasonic receiver analog front end. Working with an
external transducer the TS8000 converts ultrasonic
sound waves into a digital time representation of the
received pulses. The TS8000 provides digitally
configurable noise filtering, gain amplification, and
carrier data slicing of the weak ultrasonic input
signals. The TS8000 is configured by a two-wire
digital interface.
The TS8000 is available in a tiny 16-bump wafer level
chip scale package (WLCSP, 1.66mm x 1.66mm,
0.4mm pitch). The device operates from a 3.3V
nominal supply input and is specified over a 0
o
C to
+85
o
C operating temperature range.
Features
Complete Ultrasonic Receiver Analog Front End
(AFE)
Receiver for 40kHz Ultrasonic Pulses
Built in system calibrated bandpass filter for
ambient noise rejection and operation in noisy
environments
Configurable high gain amplification of weak
ultrasonic signals
Configurable threshold data slicer for ultrasonic
carrier waveform digital output
Two-wire control bus for configuration, calibration,
and mode control
DVDD: 3.3V. Built in LDO for generation of clean
analog supply
Small Package Size simplifies industrial design of
tracked objects
o
o
16 Bump WLCSP Package
1.66mm x 1.66mm, 0.4mm pitch
3.3V
1µF
C1
LDO
OUT
LDO
OUT2
Applications
Ultrasonic range finder
Ultrasonic time of flight
Tracking of Physical Objects in VR
Ultrasonic communication
Object detection and security systems
C2
1µF
C4
AVDD
10nF
IN
DVDD
CLK
Ultrasonic
Sound
Waves
Ultrasonic
Receiver
R1
10kW
TS8000
RBIAS
BYPREF
AVSS
AVSS2
DATA
AOUT
C3
1µF
TS8000 Device Size
1.66mm x 1.66mm
Simplified Application Circuit
Copyright © 2017, Triad Semiconductor, Inc.
1 of 14
Document Rev: 1.2

 
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