Cover
32
User’s Manual
RX64M Group, RX71M Group
Flash Memory
User’s Manual: Hardware Interface
RENESAS 32-Bit MCU
RX Family / RX600 Series, RX700 Series
All information contained in these materials, including products and product specifications,
represents information on the product at the time of publication and is subject to change by
Renesas Electronics Corp. without notice. Please review the latest information published by
Renesas Electronics Corp. through various means, including the Renesas Electronics Corp.
website (http://www.renesas.com).
www.renesas.com
Rev.1.10
Jan 2015
Notice
1.
Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of
semiconductor products and application examples. You are fully responsible for the incorporation of these circuits, software,
and information in the design of your equipment. Renesas Electronics assumes no responsibility for any losses incurred by you
or third parties arising from the use of these circuits, software, or information.
Renesas Electronics has used reasonable care in preparing the information included in this document, but Renesas Electronics
does not warrant that such information is error free. Renesas Electronics assumes no liability whatsoever for any damages
incurred by you resulting from errors in or omissions from the information included herein.
Renesas Electronics does not assume any liability for infringement of patents, copyrights, or other intellectual property rights of
third parties by or arising from the use of Renesas Electronics products or technical information described in this document. No
license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights of
Renesas Electronics or others.
You should not alter, modify, copy, or otherwise misappropriate any Renesas Electronics product, whether in whole or in part.
Renesas Electronics assumes no responsibility for any losses incurred by you or third parties arising from such alteration,
modification, copy or otherwise misappropriation of Renesas Electronics product.
Renesas Electronics products are classified according to the following two quality grades: “Standard” and “High Quality”. The
recommended applications for each Renesas Electronics product depends on the product’s quality grade, as indicated below.
“Standard”:
Computers; office equipment; communications equipment; test and measurement equipment; audio and visual
equipment; home electronic appliances; machine tools; personal electronic equipment; and industrial robots etc.
2.
3.
4.
5.
“High Quality”: Transportation equipment (automobiles, trains, ships, etc.); traffic control systems; anti-disaster systems; anti-
crime systems; and safety equipment etc.
Renesas Electronics products are neither intended nor authorized for use in products or systems that may pose a direct threat to
human life or bodily injury (artificial life support devices or systems, surgical implantations etc.), or may cause serious property
damages (nuclear reactor control systems, military equipment etc.). You must check the quality grade of each Renesas
Electronics product before using it in a particular application. You may not use any Renesas Electronics product for any
application for which it is not intended. Renesas Electronics shall not be in any way liable for any damages or losses incurred
by you or third parties arising from the use of any Renesas Electronics product for which the product is not intended by Renesas
Electronics.
6.
You should use the Renesas Electronics products described in this document within the range specified by Renesas Electronics,
especially with respect to the maximum rating, operating supply voltage range, movement power voltage range, heat radiation
characteristics, installation and other product characteristics. Renesas Electronics shall have no liability for malfunctions or
damages arising out of the use of Renesas Electronics products beyond such specified ranges.
Although Renesas Electronics endeavors to improve the quality and reliability of its products, semiconductor products have
specific characteristics such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. Further,
Renesas Electronics products are not subject to radiation resistance design. Please be sure to implement safety measures to
guard them against the possibility of physical injury, and injury or damage caused by fire in the event of the failure of a Renesas
Electronics product, such as safety design for hardware and software including but not limited to redundancy, fire control and
malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures. Because the evaluation
of microcomputer software alone is very difficult, please evaluate the safety of the final products or systems manufactured by
you.
Please contact a Renesas Electronics sales office for details as to environmental matters such as the environmental compatibility
of each Renesas Electronics product. Please use Renesas Electronics products in compliance with all applicable laws and
regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive.
Renesas Electronics assumes no liability for damages or losses occurring as a result of your noncompliance with applicable laws
and regulations.
Renesas Electronics products and technology may not be used for or incorporated into any products or systems whose
manufacture, use, or sale is prohibited under any applicable domestic or foreign laws or regulations. You should not use
Renesas Electronics products or technology described in this document for any purpose relating to military applications or use
by the military, including but not limited to the development of weapons of mass destruction. When exporting the Renesas
Electronics products or technology described in this document, you should comply with the applicable export control laws and
regulations and follow the procedures required by such laws and regulations.
7.
8.
9.
10. It is the responsibility of the buyer or distributor of Renesas Electronics products, who distributes, disposes of, or otherwise
places the product with a third party, to notify such third party in advance of the contents and conditions set forth in this
document, Renesas Electronics assumes no responsibility for any losses incurred by you or third parties as a result of
unauthorized use of Renesas Electronics products.
11. This document may not be reproduced or duplicated in any form, in whole or in part, without prior written consent of Renesas
Electronics.
12. Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this document
or Renesas Electronics products, or if you have any other inquiries.
(Note 1) “Renesas Electronics” as used in this document means Renesas Electronics Corporation and also includes its majority-
owned subsidiaries.
(Note 2) “Renesas Electronics product(s)” means any product developed or manufactured by or for Renesas Electronics.
(2012.4)
General Precautions in the Handling of MPU/MCU Products
The following usage notes are applicable to all MPU/MCU products from Renesas. For detailed usage notes on the
products covered by this document, refer to the relevant sections of the document as well as any technical updates that
have been issued for the products.
1. Handling of Unused Pins
Handle unused pins in accordance with the directions given under Handling of Unused Pins in the
manual.
⎯
The input pins of CMOS products are generally in the high-impedance state. In operation with an
unused pin in the open-circuit state, extra electromagnetic noise is induced in the vicinity of LSI, an
associated shoot-through current flows internally, and malfunctions occur due to the false
recognition of the pin state as an input signal become possible. Unused pins should be handled as
described under Handling of Unused Pins in the manual.
2. Processing at Power-on
The state of the product is undefined at the moment when power is supplied.
⎯
The states of internal circuits in the LSI are indeterminate and the states of register settings and
pins are undefined at the moment when power is supplied.
In a finished product where the reset signal is applied to the external reset pin, the states of pins
are not guaranteed from the moment when power is supplied until the reset process is completed.
In a similar way, the states of pins in a product that is reset by an on-chip power-on reset function
are not guaranteed from the moment when power is supplied until the power reaches the level at
which resetting has been specified.
3. Prohibition of Access to Reserved Addresses
Access to reserved addresses is prohibited.
⎯
The reserved addresses are provided for the possible future expansion of functions. Do not access
these addresses; the correct operation of LSI is not guaranteed if they are accessed.
4. Clock Signals
After applying a reset, only release the reset line after the operating clock signal has become stable.
When switching the clock signal during program execution, wait until the target clock signal has
stabilized.
⎯
When the clock signal is generated with an external resonator (or from an external oscillator)
during a reset, ensure that the reset line is only released after full stabilization of the clock signal.
Moreover, when switching to a clock signal produced with an external resonator (or by an external
oscillator) while program execution is in progress, wait until the target clock signal is stable.
5. Differences between Products
Before changing from one product to another, i.e. to a product with a different part number, confirm
that the change will not lead to problems.
⎯
The characteristics of an MPU or MCU in the same group but having a different part number may
differ in terms of the internal memory capacity, layout pattern, and other factors, which can affect
the ranges of electrical characteristics, such as characteristic values, operating margins, immunity
to noise, and amount of radiated noise. When changing to a product with a different part number,
implement a system-evaluation test for the given product.
Contents
1.
2.
3.
4.
Features ........................................................................................................................................... 6
Module Configuration ....................................................................................................................... 7
Address Space ................................................................................................................................. 8
Registers .......................................................................................................................................... 9
4.1
4.2
4.3
4.4
4.5
4.6
4.7
4.8
4.9
4.10
4.11
4.12
4.13
4.14
4.15
4.16
4.17
4.18
4.19
5.
6.
Flash P/E Protect Register (FWEPROR) ............................................................................. 10
Flash Access Status Register (FASTAT) ............................................................................. 11
Flash Access Error Interrupt Enable Register (FAEINT) ..................................................... 13
Flash Ready Interrupt Enable Register (FRDYIE) ............................................................... 14
FACI Command Start Address Register (FSADDR) ............................................................ 15
FACI Command End Address Register (FEADDR) ............................................................. 16
FCURAM Enable Register (FCURAME) .............................................................................. 17
Flash Status Register (FSTATR) ......................................................................................... 18
Flash P/E Mode Entry Register (FENTRYR) ....................................................................... 22
Flash Protection Register (FPROTR) .................................................................................. 23
Flash Sequencer Set-Up Initialization Register (FSUINITR) ............................................... 24
Lock Bit Status Register (FLKSTAT) ................................................................................... 25
FACI Command Register (FCMDR) .................................................................................... 26
Flash P/E Status Register (FPESTAT) ................................................................................ 27
Data Flash Blank Check Control Register (FBCCNT) ......................................................... 27
Data Flash Blank Check Status Register (FBCSTAT) ......................................................... 28
Data Flash Programming Start Address Register (FPSADDR) ........................................... 28
Flash Sequencer Processing Switching Register (FCPSR) ................................................ 29
Flash Sequencer Processing Clock Notification Register (FPCKAR) .................................. 30
Operating Modes of the Flash Sequencer ..................................................................................... 31
FACI Commands ............................................................................................................................ 32
6.1
6.2
6.3
6.3.1
6.3.2
6.3.3
6.3.4
6.3.5
6.3.6
6.3.7
6.3.8
6.3.9
6.3.10
6.3.11
6.3.12
6.3.13
List of FACI Commands ....................................................................................................... 32
Relationship between the Flash Sequencer State and FACI Commands ........................... 33
Usage of FACI Commands .................................................................................................. 35
Overview of Command Usage in Code Flash memory P/E Mode ............................................. 35
Overview of Command Usage in Data Flash Memory P/E Mode ............................................. 37
Transferring the FCU Firmware ................................................................................................. 38
Transition to Code Flash Memory P/E Mode ............................................................................. 39
Transition to Data Flash Memory P/E Mode .............................................................................. 39
Transition to Read Mode ............................................................................................................ 40
Recovery from the Command-Locked State .............................................................................. 41
Programming Command ............................................................................................................. 43
Block Erase Command ............................................................................................................... 45
P/E Suspend Command .............................................................................................................. 46
P/E Resume Command ............................................................................................................... 51
Status Clear Command ............................................................................................................... 51
Forced Stop Command ............................................................................................................... 52
6.3.14
6.3.15
6.3.16
6.3.17
7.
Blank Check Command .............................................................................................................. 53
Configuration Set Command ...................................................................................................... 55
Lock-Bit Programming Command ............................................................................................. 57
Lock-Bit Read Command ........................................................................................................... 58
Safety Function .............................................................................................................................. 59
7.1
7.1.1
7.1.2
7.1.3
7.2
7.3
7.3.1
Software Protection ............................................................................................................. 59
Protection through FWEPROR .................................................................................................. 59
Protection through FENTRYR ................................................................................................... 59
Protection through Lock Bit ....................................................................................................... 59
Error Protection .................................................................................................................... 59
Boot Program Protection ..................................................................................................... 61
User Boot Protection .................................................................................................................. 61
8.
9.
Usage Notes .................................................................................................................................. 62
Electrical Characteristics ................................................................................................................ 63
9.1
AC Characteristics ............................................................................................................... 63
REVISION HISTORY ............................................................................................................................... 64
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
