Super Fast Recovery Diode
RF1001NS2DFH
Series
Standard Fast Recovery
Dimensions
(Unit : mm)
Datasheet
AEC-Q101 Qualified
Land
Size Figure
(Unit : mm)
Applications
General rectification
TO263S
Features
1) Cathode common dual type
2) Low switching loss
3) Low V
F
ROHM : TO263S (D2PAK)
JEITA : SC-83
1
Cathode
Structure
: Manufacture Date
Anode
Anode
Taping
Dimensions
(Unit : mm)
Construction
Silicon epitaxial planar type
Absolute
Maximum Ratings
(T
a
= 25°C)
Parameter
Repetitive peak reverse voltage
Reverse voltage
Average current
Non-repetitive forward surge current
Symbol
V
RM
V
R
I
o
I
FSM
T
j
T
stg
Conditions
Duty≦0.5
Direct reverse voltage
60Hz half sin wave , resistive load
1/2Io per diode
60Hz half sin wave, one cycle
non-repetitive at T
j
=25°C, per diode
Limits
200
200
10
80
150
55
to
150
Unit
V
V
A
A
°C
°C
Operating junction temperature
Storage temperature
-
-
Electrical
Characteristics
(T
j
= 25°C, per diode)
Parameter
Forward voltage
Reverse current
Reverse recovery time
Thermal resistance
Symbol
V
F
I
R
trr
R
th(j-c)
Conditions
I
F
=5A
V
R
=200V
I
F
=0.5A, I
R
=1A, Irr=0.25×I
R
Junction to case
Min.
-
-
-
-
Typ. Max. Unit
0.85 0.93
0.01
15
-
10
25
V
A
ns
3.0
°C / W
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© 2015 ROHM Co., Ltd. All rights reserved.
1/4
2016.06 - Rev.A
RF1001NS2DFH
Electrical
Characteristic Curves
Data Sheet
100
10000
T
j
= 150°C
REVERSE CURRENT : I
R
(nA)
FORWARD CURRENT : I
F
(A)
10
1000
T
j
= 125°C
1
T
j
= 150°C
0.1
T
j
= 125°C
T
j
= 75°C
T
j
= 25°C
0.001
0
200 400 600 800 1000 1200 1400 1600
per diode
100
T
j
= 75°C
10
T
j
= 25°C
1
per diode
0.1
0
50
100
150
200
0.01
FORWARD VOLTAGE : V
F
(mV)
V
F
-I
F
CHARACTERISTICS
REVERSE VOLTAGE : V
R
(V)
V
R
-I
R
CHARACTERISTICS
1000
1000
PEAK SURGE
FORWARD CURRENT : I
FSM
(A)
CAPACITANCE BETWEEN
TERMINALS : C
t
(pF)
f = 1MHz
T
a
= 25°C
per diode
T
j
= 25°C
per diode
100
100
10
I
FSM
8.3ms
8.3ms
1cyc.
10
0
5
10
15
20
25
30
1
1
10
100
REVERSE VOLTAGE : V
R
(V)
V
R
-C
t
CHARACTERISTICS
NUMBER OF CYCLES
I
FSM
-CYCLE CHARACTERISTICS
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© 2015 ROHM Co., Ltd. All rights reserved.
2/4
2016.06 - Rev.A
RF1001NS2DFH
Electrical
Characteristic Curves
Data Sheet
1000
100
T
j
= 25°C
per diode
TRANSIENT
THERMAL IMPEDANCE : R
th
(°C/W)
PEAK SURGE
FORWARD CURRENT : I
FSM
(A)
R
th
(j-a)
10
100
R
th
(j-c)
1
10
I
FSM
time
T
j
= 25°C
1
1
10
100
0.1
0.001
0.01
0.1
1
10
100
1000
TIME : t(ms)
I
FSM
-t CHARACTERISTICS
TIME : t(s)
R
th
-t CHARACTERISTICS
0A
0V
t
Io
V
R
T
Io
V
R
D=t/T
V
R
=V
Rmax
T
j
=150°C
18
0A
18
16
AVERAGE RECTIFIED
FORWARD CURRENT : I
o
(A)
AVERAGE RECTIFIED
FORWARD CURRENT : I
o
(A)
16
14
12
10
D.C.
0V
t
T
D=t/T
V
R
=V
Rmax
T
j
=150°C
D.C.
14
12
10
half sin wave
8
6
4
2
0
0
30
60
90
120
150
D = 0.2
D = 0.1
D = 0.5
D = 0.5
half sin wave
8
6
4
2
0
0
30
60
90
120
150
D = 0.2
D = 0.1
AMBIENT TEMPERATURE : T
a
(°C)
DERATING CURVE (I
o
-T
a
)
CASE TEMPERATURE : T
c
(°C)
DERATING CURVE (I
o
-T
c
)
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© 2015 ROHM Co., Ltd. All rights reserved.
3/4
2016.06 - Rev.A
RF1001NS2DFH
Electrical
Characteristic Curves
Data Sheet
16
14
D.C.
D = 0.5
half sin wave
D = 0.2
D = 0.1
FORWARD POWER
DISSIPATION : P
f
(W)
12
10
8
6
4
2
T
j
= 150°C
0
0
2
4
6
8
10
12
14
16
18
AVERAGE RECTIFIED
FORWARD CURRENT : I
o
(A)
I
o
-P
f
CHARACTERISTICS
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© 2015 ROHM Co., Ltd. All rights reserved.
4/4
2016.06 - Rev.A
Notice
Precaution on using ROHM Products
1.
If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment
,
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl
2
,
H
2
S, NH
3
, SO
2
, and NO
2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
The Products are not subject to radiation-proof design.
Please verify and confirm characteristics of the final or mounted products in using the Products.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
Confirm that operation temperature is within the specified range described in the product specification.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
(Note 1)
3.
4.
5.
6.
7.
8.
9.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
2.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.003
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