TAPE AND REEL
PACKAGING
Introduction
The electronics industry is making a tremendous investment in surface-
mount technology. The reasons for this investment include cost savings
resulting from automated component placement and increased density
of PCB layout due to smaller package sizes.
Today’s placement machines can pick and place thousands of components
per hour with a very high degree of accuracy. To achieve this performance,
the component delivery system must be capable of feeding parts at high
speeds in a consistent orientation, positively indexed to the demands of the
machine. The leads of the components must be protected from damage
during shipment, handling, and placement.
The preferred packing material available today for these demands is
tape and reel. Analog Devices’ tape and reel system is fully compat-
ible with the detaping equipment that is standard in most automated
placement equipment.
In the tape and reel format, the components are placed in specifically
designed pockets embossed in a plastic carrier tape. The cover tape
is sealed to the carrier tape to keep the parts in place in these pockets. A
row of sprocket holes is provided along one edge of the embossed tape to
facilitate positive indexing. The tape is then wound onto a rigid plastic reel
that provides mechanical protection during handling and storage. These
reels are dust-free and compatible with a clean environment.
Specifications
Analog Devices’ tape and reel specifications are in conformance with the
EIA Standard 481 “Taping of Surface-Mount Components for Automatic
Placement.”
ESD Protection
Analog Devices’ tape and reel delivery system is designed to offer a very
high degree of protection against electrostatic discharge (ESD). All tape
and reel materials are static-dissipative. In addition, drypacked reels
are shipped in moisture barrier bags; nondrypacked reels are shipped in
a box with ESD conductive coating or in a conductive ESD bag. To retain
the benefits of this protection, the bags should be opened only at ESD
controlled workstations by trained personnel.
Peel Back Strength
The peel back force will be between 10
g
and 100
g
for 8 mm wide tape
and 10
g
to 130
g
for tapes 12 mm and wider when tested at room
temperature and pulled at a 175° to 180° angle with a peel-off speed
of 300 ± 10 mm/min.
Direction of Feed
Direction of feed is defined as the direction in which the end user unreels
the tape. The direction of feed for all products is counterclockwise when
the reel is held with the round sprocket holes facing the observer.
Figure 1. Direction of feed.
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Tape and Reel Packaging
Pin 1 Orientation
Devices are reeled so that Pin 1 is oriented properly with the direction of feed and round sprocket holes. Pin 1 orientation is
denoted as C1 to C4, or M1, with respect to the direction of feed and round sprocket holes, as illustrated below.
Direction of Feed
Round
Sprocket
Holes
M1
C1
C4
C2
C3
Figure 2. Pin 1 orientation reference.
SOIC_N (C1)
SOIC_W (C1)
Direction of Feed
SSOP, TSSOP, and MSOP/MINI_SO (C1)
Direction of Feed
TQFP, LQFP, MQFP, BGA, and Square Body LFCSP (C2)
Direction of Feed
SOT-23-3 (C4)
Direction of Feed
PLCC (M1)
Direction of Feed
SOT-23 (C4)
Direction of Feed
Direction of Feed
LFCSP and LGA_CAV (Rectangular Non-Microphone)
Upper Left Pin 1 (C1)
Upper Right Pin 1 (C2)
Direction of Feed
Direction of Feed
Figure 3. Examples of standard Pin 1 orientation.
MEMS传感器
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