9
8
7
6
5
4
3
2
1
14.00
0.90
TYP.
0.45
E
9.00
PIN19
PIN1
PIN18
8.00
15.00
D
PIN2
NOTES:
1.MATERIAL:
HOUSING: LCP,COLOR:BLACK;
CAP:LCP,COLOR:BLACK;
SHELL:BRASS,ALLOY.
TERMINAL: BRASS,ALLOY.
2.PLATING:
TERMINAL:
CONTACT AREA:SEE TABLE;
SOLDER AREA: GOLD FLASH;
UNDER PLATE:1.27 MICROMETER MIN. NICKEL PLATING OVERALL.
SHELL: 1.27MICROMETER MIN. SOLDERABLE NICKEL PLATING OVERALL.
3.COMPLANARITY OF SOLDER TAIL:0.10mm MAX.
4.DATE CODE:YY=YEAR, MM=MONTH,DD=DATE;
5.PRODUCT SPEC. REFER TO 2086580001(PS);
6.PACKAGE SPEC. REFER TO 476595000;
E
4.55
5.55
D
14.50
0.30 (19X)
1.00
2.30 (19X)
DATE CODE
Y
1.80 (19X)
CL
CL
YYMMDD
C
⌀
1.30
(2X)
⌖
0.05
B
PIN19 PIN1
C
8.50
0.95
0.05
±
0.05
3.30
X
1.90
(3X)
0.50
(2X)
B
0.90
7.25
14.50
17.50
0.78
1.00
2.85
⌖
⌀
0.05
X Y
⌀
1.30
0.00
4.21
RECOMMENDED PCB LAYOUT
CONNCETOR SIDE
THICKNESS=1.60mm
GENERAL TOLRANCE +/-0.05
0.50
PITCH
⌀
1.90
(3X)
B
0.65
3.30
6.05
SYMBOLS
=
0
=
0
THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
DIMENSION UNITS
SCALE
CURRENT REV DESC: NEW RELEASE
mm
ANGULAR TOL
±
±
±
±
±
±
5:1
3.0 °
GENERAL TOLERANCES
(UNLESS SPECIFIED)
A
=
0
EC NO:
612733
0.20 (19X)
4.79
0.50
PITCH
DOCUMENT STATUS
FORMAT: master-tb-prod-A3
REVISION: H
DATE: 2018/01/18
47659-1012
47659-1011
47659-1010
P/N
10:11:11
GLOD FLASH
0.38 MICROMETER MIN. GOLD PLATING
0.76 MICROMETER MIN. GOLD PLATING
CONTACT AREA PLATING
C
=
0
=
0
=
0
=
0
=
0
=
0
4 PLACES
3 PLACES
2 PLACES
1 PLACE
0 PLACES
0.25
0.25
DRWN:
JFAN18
CHK'D: XQZHANG
APPR:
XQZHANG
INITIAL REVISION:
DRWN:
JFAN18
APPR:
XQZHANG
THIRD ANGLE PROJECTION
DRAWING
2018/07/26
2019/03/05
2019/03/05
2018/07/26
2019/03/05
SERIES
HDMI FOR INSERT MODLING TYPE
A
PRODUCT CUSTOMER DRAWING
DOCUMENT NUMBER
DOC TYPE
DOC PART
REVISION
476591010
MATERIAL NUMBER
CUSTOMER
PSD
000
A
P1
RELEASE DATE
2019/03/05
DRAFT WHERE APPLICABLE
MUST REMAIN
WITHIN DIMENSIONS
SHEET NUMBER
A3-SIZE
47659
SEE TABLE
1 OF 1
9
8
7
6
5
4
3
2
1
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
