HCPL-T251
0.4 Amp Output Current IGBT Gate Drive Optocoupler
Data Sheet
Lead (Pb) Free
RoHS 6 fully
compliant
RoHS 6 fully compliant options available;
-xxxE denotes a lead-free product
Description
The HCPL‑T251 contains GaAsP LED. The LED is optically
coupled to an integrated circuit with a power output stage.
This optocoupler is ideally suited for driving power IGBTs
and MOSFETs used in motor control inverter applications.
The high operating voltage range of the output stage
provides the drive voltages required by gate controlled
devices. The voltage and current supplied by this opto‑
coupler makes it ideally suited for directly driving small
or medium power IGBTs.
Features
•
Supply current (I
CC
): 11 mA (max.)
•
Supply voltage (V
CC
): 10‑30 V
•
Output current (I
O
): ±0.4 A (min.)
•
Switching time (t
PLH
/t
PHL
): 1 µs (max.)
•
Isolation voltage (V
ISO
): 3750 Vrms (min.)
•
UL 577 Recognized: File No. E55361
•
CSA Approved
•
10 kV/µs Minimum Common Mode Rejection (CMR)
at Vcm = 600 V
•
Creepage distance: 7.4 mm
Clearance: 7.1 mm
Truth Table
LED
V
out
OFF
LOW
HIGH
ON
Functional Diagram
N/C
ANODE
CATHODE
N/C
1
2
3
4
8
7
6
5
V
CC
N/C
V
O
V
EE
Applications
•
IGBT/MOSFET gate drive
•
AC/brushless DC motor drives
•
Industrial inverters
•
Switch mode power supplies
SHIELD
A 0.1 µF bypass capacitor must be
connected between pins 5 and 8.
CAUTION: It is advised that normal static precautions be taken in handling and assembly
of this component to prevent damage and/or degradation which may be induced by ESD.
HCPL-T251
HCPL‑T251 is UL Recognized with 3750 Vrms for 1 minute per UL1577.
Option
Part
Number
HCPL‑T251
RoHS
Compliant
‑000E
‑300E
‑500E
Non RoHS
Compliant
No option
#300
#500
Package
300mil
DIP‑8
Surface
Mount
X
X
Gull
Wing
X
X
Tape
& Reel
X
Quantity
50 per tube
50 per tube
1000 per reel
To order, choose a part number from the part number column and combine with the desired option from the option
column to form an order entry.
Example 1:
HCPL‑T251‑500E to order product of 300 mil DIP Gull Wing Surface Mount package in Tape and Reel and RoHS com‑
pliant.
Example 2:
HCPL‑T251 to order product of 300 mil DIP package in tube packaging and non RoHS compliant.
Option datasheets are available. Contact your Avago sales representative or authorized distributor for information.
Remarks: The notation ‘#XXX’ is used for existing products, while (new) products launched since 15
th
July 2001 and
RoHS compliant option will use ‘‑XXXE‘.
2
Package Outline Drawings
Standard DIP Package
9.65 ± 0.25
(0.380 ± 0.010)
8
7
6
A T251
YYWW
PIN ONE 1
1.19 (0.047) MAX.
2
3
4
1.78 (0.070) MAX.
+ 0.076
- 0.051
+ 0.003)
(0.010 - 0.002)
0.254
DATE CODE
5
7.62 ± 0.25
(0.300 ± 0.010)
6.35 ± 0.25
(0.250 ± 0.010)
5° TYP.
3.56 ± 0.13
(0.140 ± 0.005)
4.70 (0.185) MAX.
0.51 (0.020) MIN.
2.92 (0.115) MIN.
DIMENSIONS IN MILLIMETERS AND (INCHES).
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
1.080 ± 0.320
(0.043 ± 0.013)
0.65 (0.025) MAX.
2.54 ± 0.25
(0.100 ± 0.010)
Gull Wing Surface Mount Option 300
LAND PATTERN RECOMMENDATION
9.65 ± 0.25
(0.380 ± 0.010)
8
7
6
5
1.016 (0.040)
6.350 ± 0.25
(0.250 ± 0.010)
10.9 (0.430)
1
2
3
4
1.27 (0.050)
1.780
(0.070)
MAX.
9.65 ± 0.25
(0.380 ± 0.010)
7.62 ± 0.25
(0.300 ± 0.010)
2.0 (0.080)
1.19
(0.047)
MAX.
3.56 ± 0.13
(0.140 ± 0.005)
+ 0.076
0.254 - 0.051
+ 0.003)
(0.010 - 0.002)
1.080 ± 0.320
(0.043 ± 0.013)
2.54
(0.100)
BSC
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
0.635 ± 0.130
(0.025 ± 0.005)
0.635 ± 0.25
(0.025 ± 0.010)
12° NOM.
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
3
Regulatory Information
The HCPL‑T251 is under approval by the following organizations:
UL
Approval under UL 1577, Component Recognition Pro‑
gram, File E55361.
CSA
Approval under CSA Component Acceptance Notice #5,
File CA 88324.
Insulation and Safety Related
Parameter
Minimum External Air Gap
(Clearance)
Minimum External Tracking
(Creepage)
Minimum Internal Plastic Gap
(Internal Clearance)
Tracking Resistance
(Comparative Tracking Index)
Isolation Group
Symbol
L(101)
L(102)
CTI
Value
7.1
7.4
0.08
≥175
IIIa
Units
mm
mm
mm
Volts
Conditions
Measured from input terminals to output
terminals, shortest distance through air.
Measured from input terminals to output
terminals, shortest distance path along body.
Insulation thickness between emitter and detector;
also known as distance through insulation
DIN IEC 112/VDE 0303 Part 1
Material Group (DIN VDE 0110, 1/89, Table 1)
Absolute Maximum Ratings
(Compared with HCPL‑3140)
HCPL-3140
Parameter
Operating Temperature
“High” Peak Output Current
“High” Peak Output Current
Storage Temperature
Average Input Current
Peak Transient Input Current
(<1 µs Pulse Width, 300 pps)
Reverse Input Voltage
Supply Voltage
Output Voltage
Output Power Dissipation
HCPL-T251
Min.
‑20
‑55
‑0.5
0
Symbol
T
A
I
OH(PEAK)
I
OL(PEAK)
T
S
I
F(AVG)
I
F(TRAN)
V
R
(V
CC
‑ V
EE
)
V
O
P
O
Units
°C
A
A
°C
mA
A
V
V
V
mW
Min.
‑ 40
‑55
‑0.5
0
Max.
100
0.6
0.6
125
25
1.0
5
35
V
CC
250
Max.
85
0.4
0.4
125
20
1.0
5
35
V
CC
250
Note
1
2
3
Lead Solder Temperature 260°C for 10 sec., 1.6 mm below seating plane
Solder Reflow Temperature Profile See Package
Outline Drawings section
Notes:
1. Maximum pulse width = 10 µs, maximum duty cycle = 0.2%.
2. Derate linearly above 70°C free‑air temperature at a rate of 0.3 mA/°C.
3. Derate lineraly above 70°C free‑air temperature at a rate of 4.8 mW/°C.
4
Recommended Operating Conditions
Parameter
Power Supply Voltage
Input Current (ON)
Input Voltage (OFF)
Symbol
V
CC
‑ V
EE
I
F(ON)
V
F(OFF)
Min.
15
8
0
Max.
30
12
0.8
Units
V
mA
V
DC Electrical Specifications
(Compared with HCPL‑3140)
Over recommended operating conditions (I
F(ON)
= 8 to 12 mA, V
F(OFF)
= 0 to 0.8 V, V
CC
= 15 to 30 V, V
EE
= Ground) un‑
less otherwise specified.
Parameter
Input Forward
Voltage
Temperature
Coefficient of
Forward Voltage
Input Reverse
Current
Input Capacitance
High Level
Output Current
Low Level
Output Current
High Level
Output Voltage
Low Level
Output Voltage
Symbol
V
F
∆V
F
/∆T
A
Units
V
mV/°C
HCPL-3140
Min.
Typ.*
Max.
1.2
1.5
‑1.6
1.8
Min.
HCPL-T251
Typ.*
Max.
1.6
‑2.0
1.8
Test
Conditions
I
F
= 10 mA
I
F
= 10 mA
Note
I
R
C
IN
I
OH
I
OL
V
OH
V
OL
µA
pF
A
A
V
V
mA
mA
mA
V
0.2
0.4
0.2
0.4
60
0.5
0.4
0.5
10
1
3
3
6
N.A.
0.1
N.A.
45
0.25
0.2
10
250
11
11
7
V
R
= 5 V
V
F
= 0 V,
F = 1 MHz
V
O
= V
CC
‑ 4 V
V
O
= V
CC
‑ 15 V
V
O
= V
CC
‑ 4 V
V
O
= V
CC
‑ 15 V
I
O
= ‑100 mA
I
O
= 100 mA
Output Open
I
F
= 7 to 16 mA
Output Open
V
F
= ‑3.0 to
+0.8 V
I
O
= 0 mA,
V
O
> 5 V
V
CC
‑ 4 V
CC
‑ 1.8
0.8
0.4
0.7
1 ‑ 2
V
CC
‑ 4 V
CC
‑ 1.8
0.8
0.5
7.5
8
High Level
I
CCH
Supply CurrentntSupply Current
Low Level
Supply Current
Threshold Input
Current Low to
High
Threshold Input
Voltage High
to Low
Supply Voltage
Capacitance
(Input‑Output)
Resistance
(Input‑Output)
I
CCL
I
FLH
V
FHL
V
CC
C
I‑0
R
I‑0
V
pF
Ω
10
60
10
12
30
10
60
10
12
30
*All typical values at T
A
= 25°C and V
CC
‑ V
EE
= 3° V, unless otherwise noted.
5
嵌入式系统
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
