HC/UH SERIES, HEX 1-INPUT NON-INVERT GATE, PDIP16, PLASTIC, DIP-16
参数名称 | 属性值 |
厂商名称 | ST(意法半导体) |
零件包装代码 | DIP |
包装说明 | PLASTIC, DIP-16 |
针数 | 16 |
Reach Compliance Code | unknown |
其他特性 | WITH EXTENDED I/P VOLTAGE; IOH = 6MA @ VOH = 4.13V; IOL = 6MA @ VOL = 0.33V |
系列 | HC/UH |
JESD-30 代码 | R-PDIP-T16 |
负载电容(CL) | 50 pF |
逻辑集成电路类型 | BUFFER |
功能数量 | 6 |
输入次数 | 1 |
端子数量 | 16 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | DIP |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
传播延迟(tpd) | 21 ns |
认证状态 | Not Qualified |
座面最大高度 | 5.1 mm |
最大供电电压 (Vsup) | 6 V |
最小供电电压 (Vsup) | 2 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
宽度 | 7.62 mm |
Base Number Matches | 1 |
M74HC4050BB1N | M74HC4049BM1 | M74HC4049BB1N | M54HC4049BF1 | M74HC4050BM1 | M54HC4050BF1 | M74HC4050BF1 | M74HC4050BC1 | M74HC4049BF1 | M74HC4049BC1 | |
---|---|---|---|---|---|---|---|---|---|---|
描述 | HC/UH SERIES, HEX 1-INPUT NON-INVERT GATE, PDIP16, PLASTIC, DIP-16 | HC/UH SERIES, HEX 1-INPUT INVERT GATE, PDSO16, MICRO, PLASTIC, GULLWING, DIP-16 | HC/UH SERIES, HEX 1-INPUT INVERT GATE, PDIP16, PLASTIC, DIP-16 | HC/UH SERIES, HEX 1-INPUT INVERT GATE, CDIP16, FRIT SEALED, CERAMIC, DIP-16 | HC/UH SERIES, HEX 1-INPUT NON-INVERT GATE, PDSO16, MICRO, PLASTIC, GULLWING, DIP-16 | HC/UH SERIES, HEX 1-INPUT NON-INVERT GATE, CDIP16, FRIT SEALED, CERAMIC, DIP-16 | HC/UH SERIES, HEX 1-INPUT NON-INVERT GATE, CDIP16, FRIT SEALED, CERAMIC, DIP-16 | HC/UH SERIES, HEX 1-INPUT NON-INVERT GATE, PQCC20, PLASTIC, CC-20 | HC/UH SERIES, HEX 1-INPUT INVERT GATE, CDIP16, FRIT SEALED, CERAMIC, DIP-16 | HC/UH SERIES, HEX 1-INPUT INVERT GATE, PQCC20, PLASTIC, CC-20 |
零件包装代码 | DIP | SOIC | DIP | DIP | SOIC | DIP | DIP | QFN | DIP | QFN |
包装说明 | PLASTIC, DIP-16 | SOP, | DIP, | DIP, | MICRO, PLASTIC, GULLWING, DIP-16 | FRIT SEALED, CERAMIC, DIP-16 | FRIT SEALED, CERAMIC, DIP-16 | QCCJ, | FRIT SEALED, CERAMIC, DIP-16 | QCCJ, |
针数 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 20 | 16 | 20 |
Reach Compliance Code | unknown | unknow | unknow | unknow | unknown | unknown | unknown | unknown | not_compliant | unknown |
其他特性 | WITH EXTENDED I/P VOLTAGE; IOH = 6MA @ VOH = 4.13V; IOL = 6MA @ VOL = 0.33V | WITH EXTENDED I/P VOLTAGE; IOH = 6MA @ VOH = 4.13V; IOL = 6MA @ VOL = 0.33V | WITH EXTENDED I/P VOLTAGE; IOH = 6MA @ VOH = 4.13V; IOL = 6MA @ VOL = 0.33V | WITH EXTENDED I/P VOLTAGE; IOH = 6MA @ VOH = 4.1V; IOL = 6MA @ VOL = 0.4V | WITH EXTENDED I/P VOLTAGE; IOH = 6MA @ VOH = 4.13V; IOL = 6MA @ VOL = 0.33V | WITH EXTENDED I/P VOLTAGE; IOH = 6MA @ VOH = 4.1V; IOL = 6MA @ VOL = 0.4V | WITH EXTENDED I/P VOLTAGE; IOH = 6MA @ VOH = 4.13V; IOL = 6MA @ VOL = 0.33V | WITH EXTENDED I/P VOLTAGE; IOH = 6MA @ VOH = 4.13V; IOL = 6MA @ VOL = 0.33V | WITH EXTENDED I/P VOLTAGE; IOH = 6MA @ VOH = 4.13V; IOL = 6MA @ VOL = 0.33V | WITH EXTENDED I/P VOLTAGE; IOH = 6MA @ VOH = 4.13V; IOL = 6MA @ VOL = 0.33V |
系列 | HC/UH | HC/UH | HC/UH | HC/UH | HC/UH | HC/UH | HC/UH | HC/UH | HC/UH | HC/UH |
JESD-30 代码 | R-PDIP-T16 | R-PDSO-G16 | R-PDIP-T16 | R-GDIP-T16 | R-PDSO-G16 | R-GDIP-T16 | R-GDIP-T16 | S-PQCC-J20 | R-GDIP-T16 | S-PQCC-J20 |
负载电容(CL) | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
逻辑集成电路类型 | BUFFER | INVERTER | INVERTER | INVERTER | BUFFER | BUFFER | BUFFER | BUFFER | INVERTER | INVERTER |
功能数量 | 6 | 6 | 6 | 6 | 6 | 6 | 6 | 6 | 6 | 6 |
输入次数 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 20 | 16 | 20 |
最高工作温度 | 85 °C | 85 °C | 85 °C | 125 °C | 85 °C | 125 °C | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -55 °C | -40 °C | -55 °C | -40 °C | -40 °C | -40 °C | -40 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY |
封装代码 | DIP | SOP | DIP | DIP | SOP | DIP | DIP | QCCJ | DIP | QCCJ |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE |
封装形式 | IN-LINE | SMALL OUTLINE | IN-LINE | IN-LINE | SMALL OUTLINE | IN-LINE | IN-LINE | CHIP CARRIER | IN-LINE | CHIP CARRIER |
传播延迟(tpd) | 21 ns | 21 ns | 21 ns | 26 ns | 21 ns | 26 ns | 21 ns | 21 ns | 21 ns | 21 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 5.1 mm | 1.75 mm | 5.1 mm | 5 mm | 1.75 mm | 5 mm | 5 mm | 4.57 mm | 5 mm | 4.57 mm |
最大供电电压 (Vsup) | 6 V | 6 V | 6 V | 6 V | 6 V | 6 V | 6 V | 6 V | 6 V | 6 V |
最小供电电压 (Vsup) | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | YES | NO | NO | YES | NO | NO | YES | NO | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | MILITARY | INDUSTRIAL | MILITARY | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子形式 | THROUGH-HOLE | GULL WING | THROUGH-HOLE | THROUGH-HOLE | GULL WING | THROUGH-HOLE | THROUGH-HOLE | J BEND | THROUGH-HOLE | J BEND |
端子节距 | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | QUAD | DUAL | QUAD |
宽度 | 7.62 mm | 3.9 mm | 7.62 mm | 7.62 mm | 3.9 mm | 7.62 mm | 7.62 mm | 8.9662 mm | 7.62 mm | 8.9662 mm |
厂商名称 | ST(意法半导体) | - | - | - | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - |
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