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NPN - Low Noise Transistor Die
CP388X-BC108
The CP388X-BC108 is a silicon NPN transistor designed for low noise amplifier applications.
MECHANICAL SPECIFICATIONS:
Die Size
Die Thickness
Base Bonding Pad Size
Emitter Bonding Pad Size
Top Side Metalization
Back Side Metalization
Scribe Alley Width
Wafer Diameter
BACKSIDE COLLECTOR
R0
13 x 13 MILS
5.9 MILS
3.9 x 3.9 MILS
5.4 x 5.4 MILS
Al-Si – 17,000Å
Au – 9,000Å
1.8 MILS
5 INCHES
102,852
UNITS
V
V
V
mA
°C
UNITS
nA
V
V
0.25
0.6
0.7
1.0
0.55
40
200
240
150
4.5
10
800
500
MHz
pF
dB
0.83
1.05
0.7
0.77
V
V
V
V
V
V
Gross Die Per Wafer
SYMBOL
VCBO
VCEO
VEBO
IC
TJ, Tstg
MIN
25
5.0
MAXIMUM RATINGS:
(TA=25°C)
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Continuous Collector Current
Operating and Storage Junction Temperature
ELECTRICAL CHARACTERISTICS:
(TA=25°C)
SYMBOL
TEST CONDITIONS
ICBO
VCB=25V
BVCEO
IC=2.0mA
BVEBO
VCE(SAT)
VCE(SAT)
VBE(SAT)
VBE(SAT)
VBE(ON)
VBE(ON)
hFE
hFE
hfe
fT
Cob
NF
IE=10μA
IC=10mA, IB=0.5mA
IC=100mA, IB=5.0mA
IC=10mA, IB=0.5mA
IC=100mA, IB=5.0mA
VCE=5.0V,
VCE=5.0V,
VCE=5.0V,
VCE=5.0V,
IC=2.0mA
IC=10mA
IC=10μA
IC=2.0mA
30
25
5.0
200
-65 to +150
TYP
MAX
15
VCE=5.0V, IC=2.0mA, f=1.0kHz
VCE=5.0V, IC=10mA, f=100MHz
VCB=10V, IE=0, f=1.0MHz
VCE=5.0V, IC=0.2mA, RG=2.0kΩ,
f=1.0kHz, BW=200Hz
R0 (20-June 2016)
CP388X-BC108
Typical Electrical Characteristics
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R0 (20-June 2016)
BARE DIE PACKING OPTIONS
BARE DIE IN TRAY (WAFFLE) PACK
CT:
Singulated die in tray (waffle) pack.
(example: CP211-PART NUMBER-CT)
CM:
Singulated die in tray (waffle) pack 100% visually inspected as
per MIL-STD-750, (method 2072 transistors, method 2073 diodes).
(example: CP211-PART NUMBER-CM)
UNSAWN WAFER
WN:
Full wafer, unsawn, 100% tested with reject die inked.
(example: CP211-PART NUMBER-WN)
SAWN WAFER ON PLASTIC RING
WR:
Full wafer, sawn and mounted on plastic ring,
100% tested with reject die inked.
(example: CP211-PART NUMBER-WR)
Please note: Sawn Wafer on Metal Frame (WS)
is possible as a special order. Please contact your
Central Sales Representative at 631-435-1110.
Visit the Central website for a complete listing of specifications:
www.centralsemi.com/bdspecs
R2 (3-April 2017)
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OUTSTANDING SUPPORT AND SUPERIOR SERVICES
PRODUCT SUPPORT
Central’s operations team provides the highest level of support to insure product is delivered on-time.
• Supply management (Customer portals)
• Custom bar coding for shipments
• Inventory bonding
• Custom product packing
• Consolidated shipping options
DESIGNER SUPPORT/SERVICES
Central’s applications engineering team is ready to discuss your design challenges. Just ask.
• Free quick ship samples (2
nd
day air)
• Special wafer diffusions
• Online technical data and parametric search
• PbSn plating options
• SPICE models
• Package details
• Custom electrical curves
• Application notes
• Environmental regulation compliance
• Application and design sample kits
• Customer specific screening
• Custom product and package development
• Up-screening capabilities
REQUESTING PRODUCT PLATING
1.
2.
If requesting Tin/Lead plated devices, add the suffix “ TIN/LEAD” to the part number when
ordering (example: 2N2222A TIN/LEAD).
If requesting Lead (Pb) Free plated devices, add the suffix “ PBFREE” to the part number
when ordering (example: 2N2222A PBFREE).
CONTACT US
Corporate Headquarters & Customer Support Team
Central Semiconductor Corp.
145 Adams Avenue
Hauppauge, NY 11788 USA
Main Tel: (631) 435-1110
Main Fax: (631) 435-1824
Support Team Fax: (631) 435-3388
www.centralsemi.com
Worldwide Field Representatives:
www.centralsemi.com/wwreps
Worldwide Distributors:
www.centralsemi.com/wwdistributors
For the latest version of Central Semiconductor’s
LIMITATIONS AND DAMAGES DISCLAIMER,
which is part of Central’s Standard Terms and Conditions of sale, visit: www.centralsemi.com/terms
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