电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

TMS-SCE-3/4-2.0-S1-5

产品描述绿色 热收缩 标签 0.75" x 1.97"(19.0mm x 50.0mm)
产品类别电线/电缆    电线与电缆   
文件大小87KB,共2页
制造商TE Connectivity(泰科)
官网地址http://www.te.com
标准
下载文档 详细参数 全文预览

TMS-SCE-3/4-2.0-S1-5概述

绿色 热收缩 标签 0.75" x 1.97"(19.0mm x 50.0mm)

TMS-SCE-3/4-2.0-S1-5规格参数

参数名称属性值
类别
厂商名称TE Connectivity(泰科)
系列TMS-SCE
包装带盒(TB)
标签类型热收缩
标签尺寸0.75" x 1.97"(19.0mm x 50.0mm)
颜色绿色
材料聚烯烃(PO),阻燃,辐照
配套使用/相关产品T200,T208M,T212M,T312M,T312Mi,T408M,T612M-DS,T6112DS,TE3112 和 TE3124 热转移打印机
工作温度-55°C ~ 135°C
基本产品编号TMS-SCE

文档预览

下载PDF文档
Wire and Harness ID Products
TMS-SCE
Military grade heat shrinkable
wire identification sleeves
TMS-SCE marker sleeves are designed to meet the wire and cable
marking needs of manufacturers with high performance
requirements. Made from durable, flame retarded, radiation-
crosslinked heat-shrinkable polyolefin, TMS-SCE marker sleeves
can be used in a wide variety of applications. The marker sleeves
meet the performance requirements of SAE-AMS- DTL-23053/5
classes 1 and 3 and the TMS-SCE-2X products are made from
tubing fully compliant with this specification. The marks are
permanent immediately after printing and remain legible even
when exposed to abrasion, aggressive cleaning solvents, and
military fuels and oils. The sleeves meet the mark permanence
requirements of MIL-M-81531 and MIL-STD-202 both before and
after shrinking.
Both 2:1 and 3:1 shrink ratios are available. The 2:1 products
provide a thick, rugged sleeve wall and are particularly easy to
handle. The lightweight 3:1 products provide extremely fast
shrinking and cover a wider range of wire diameters, thus
simplifying inventory.
The marker sleeves are designed to be printed by computer-driven
dot matrix or thermal transfer printers, providing several
advantages in terms of reduced errors, cycle time and cost.
Supplied in a thin, flat “ladder” format, the sleeves are held
horizontally between two hole-punched polyester strips. This
configuration feeds directly from the storage box into a Tyco-
recommended printer. Tyco-recommended ribbons should always
be used. The ladder format provides automatic kitting of the
marker sleeves in the desired sequence. A standard heat gun with
reflector is used to shrink the sleeves onto the wire or cable.
Temperature rating
Operating temperature range
Minimum recovery temperature
Maximum storage temperature
–55°C to +135°C
+85°C
+40°C
–67°F to +275°F
+185°F
+104°F
Specifications/approvals
Tyco
Military
RT-1805
SAE-AMS-DTL-23053/5 classes1 and 3,
MIL-M-81531, MIL-STD-202F Method 215J
Industry
UL Recognized – Standard 224, file E35586
CSA Certified – File 31929
Heat Shrink/Cable Markers
Printer information
Features and benefits
s
s
s
s
s
s
s
s
Tyco printer
LQ870 (dot matrix)
T208M (thermal transfer, low volume)
Permanent identification sleeves.
Computer-printable.
Lightweight for aerospace applications.
Military specification material and print performance.
2:1 and 3:1 shrink ratio.
CSA Certified.
UL Recognized, VW all flame tubing test rated.
Quick recovery for heat sensitive areas.
Tyco ribbon
T312M (thermal transfer)
TMS-SIX-RIBBON-A (dot matrix)
TMS-101-RIBBON-4RPSCE (thermal transfer for T208M)
TMS-RJS-RIBBON-4RPSCE (thermal transfer for T312M))
Part numbering system
TMS-SCE-2X- F1K-
1
8
- 2.0-S1-9
Color
Scoring (optional)
Sleeve length
(2.0" nominal) (omit for 2X)
Inside diameter, as supplied
(in inches)
Standard Pack
(1,000 pieces)
Fanfolded (optional)
2X is optional
(2:1 shrink ratio: if left out,
product will be 3:1)
Product family
4
www.tycoident.com

推荐资源

【好消息】下载STM32在Altium(Protel)上的封装库
下载地址: 相关链接:http://www2.altium.com/forms/libraries/designer6/IntLib_contents_ad06.asp?lib=ST+Microcontroller+32-Bit+STM32.IntLib&man=ST-Microelectronics...
xag129 stm32/stm8
求助:如何使用CCS仿真I/O端口
我想仿真实现一个FIR滤波器,但是不知道如何实验。是通过tool 下面的port connect么?但进入对话框后,选择I/O会报错,选择data就没问题,但选择data并不能把数据读进来。还需要什么设置么?请 ......
ulysses1999 DSP 与 ARM 处理器
一个外部中断能控制电机正反停吗?
求:一个外部中断实现3三种功能的程序思路。用 if-else- if ;switch() case 没实现?请教...
wrlsohu 单片机
看一下汇编这样改成c是否可以
下面的fe_add(fe h,fe f,fe g)本来是汇编写的,因为需要移植到stm32里,2个片子寄存器结构不一样,怕改错,因此想改成c. 能否请看下这样改是否可以? typedef unsigned int fe; fe x ......
leonliu_1128 微控制器 MCU
msp430F4152的DCOCLK怎么设定大小
请问msp430F4152的DCOCLK怎么设定大小,谢谢! eeworldpostqq...
戈多 微控制器 MCU
最近在试验FLASH+AP的应用架构,不知道有谁成熟地应用在产品上
目前平台SIRFIV+WINCE6.0 不知道哪位兄弟可否告知已经这条方法是否比较成熟 ...
lowei 嵌入式系统

热门文章更多

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 342  1100  2773  352  2900  7  23  56  8  59 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved