Product Specification
11JUL07
108-5701
Rev. F
DDR S.O.DIMM Socket 200 Positions:w
1. Scope :
1.1 Contents
This specification covers the requirements for product performance, test methods and quality assurance provisions
of DDR S.O.DIMM Socket 200 Positions Combine to Gold Plating S.O.DIMM.
Applicable product description and part numbers are as shown in Appendix 1.
2. Applicable Documents:
The following documents form a part of this specification to the extent specified herein. In the event of conflict
between the requirements of this specification and the product drawing, the product drawing shall take precedence.
In the event of conflict between the requirements of this specification and the referenced documents, this
specification shall take precedence.
2.1 AMP Specifications :
A. 109-5000
B. 501-5361
501-5431
501-5435
501-5460
501-5488
Test Specification, General Requirements for Test Methods
Test Report (Standard profile)
Test Report (Standard profile)
Test Report (Low profile)
Test Report (6.5 Height)
Test Report (9.2 Height)
2.2
A.
Commercial Standards and Specifications :
MIL-STD-202
3. Requirements :
3.1 Design and Construction :
Product shall be of the design, construction and physical dimensions specified on the applicable product drawing.
3.2 Materials :
A.
Contact :
Copper Alloy
Finish:
Contact area: Gold Plated
Tine area
Underplate
B.
Housing :
Thermo plastic UL94V-0
:Gold Plated
:Nickel Plated
Tyco Electronics AMP K.K. (3-5-8 Hisamoto Takatsu-ku Kawasaki, 213-8535)
© Copyright 2007 Tyco Electronics AMP K.K. All international rights reserved.
:‘:w
Trademark
1 of 5
Product Specification
108-5701
C.
Latch :
Stainless Steal
D.
Floating Peg
Copper Alloy, Tin Plated
3.3
A.
B.
C.
Ratings :
Voltage Rating :
Current Rating :
25 VAC
0.5 A
C
C
Temperature Rating :9 55 ° to 85 °
3.4
Performance Requirements and Test Descriptions :
The product shall be designed to meet the electrical, mechanical and environmental performance
requirements specified in Fig. 1. All tests shall be performed in the room temperature, unless otherwise
specified.
3.5 Test Requirements and Procedures Summary
Para.
3.5.1
Test Items
Examination of Product
drawing
Electrical Requirements
3.5.2
Termination Resistance
(Low Level)
30 m Æ Max. (Initial)
∆R=20
m Æ Max. (Final)
Subject mated contacts assembled in
housing to closed circuit current of 10 mA
Max. at open circuit voltage of 20mV Max.
obtain resistance value by dividing the
measured reading into two.
Fig. 3-1,3-2.
AMP Spec. 109-5311-1
3.5.3
Dielectric withstanding
Voltage
No creeping discharge nor
flashover shall occur.
Current leakage : 0.5 mA Max.
250M Æ Min.(Initial)
50M Æ Min.(Final)
0.25 kVAC for 1 minute.
Test between adjacent circuits of unmated
connectors.
AMP Spec.
3.5.4
Insulation Resistance
109-5301
Impressed voltage 500 V DC.
Test between adjacent circuits of unmated
connectors.
AMP Spec. 109-5302
Para.
3.5.5
Test Items
Vibration
(Low Frequency)
Requirements
Mechanical Requirements
No electrical discontinuity
greater than 0.1 sec. shall
occur.
∆R=20
m Æ Max. (Final)
Subject mated connectors to 10-55-10 Hz
traversed in 1 minute at 1.52 mm
amplitude
2 hours each of 3 mutually perpendicular
planes.
100 mA applied.
AMP Spec.
109-5201
Procedures
Requirements
Meets requirements of product
Procedures
Visual inspection
No physical damage
Rev. F
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Product Specification
108-5701
3.5.6
Physical Shock
No electrical discontinuity
greater than 0.1
occur.
sec. shall
Accelerated Velocity : 490 m/s
2
(50 G)
Waveform
: Half sine
Duration : 11 m sec.
Number of Drops: 3 drops each to normal
and reversed directions of X, Y and Z
axes, totally 18 drops.
AMP Spec. 109-5208
Condition A
∆R=20
m Æ Max. (Final)
3.5.7
P.C.Board Mating Force
200 Pos. : 59.8N (6.1 kgf) Max.
Operation Speed : 100 mm/min.
Measure the force required to mate
connectors.(In this test, the force required
to turn PCB before it engages on lacking,
is excluded.)
AMP Spec. 109-5206
Condition B
Para.
3.5.8
Test
Items
Requirements
∆R=20
m Æ Max. (Final)
Procedures
Repeated insertion and extraction of P.C.B
to and from the connector with the turns to
lock it and then unlock it for 25 cycles.
Solder Temperature : 245 r 5 °
C
Immersion Duration : 5 r 0.5 seconds
Flux : Alpha 100
AMP Spec. 109-5203
Durability
(Repeated
Mate/Unmating)
Solder ability
3.5.9
Wet Solder Coverage :
95 % Min.
Environmental Requirements
3.5.10
Resistance to Reflow
Soldering Heat
No physical damage shall
occur
Test connector on P.C.Board
Pre-Heat150:* 180 ‘ :90 r 30sec.
Heat 230 ‘ Min.
:30 r 10sec.
Heat Peak260 ‘ Max. See Fig.4-2
OR
Apply to JEDEC standard
(J-STD-020C)
Mated connector
9 55°C / 30 min.,
85° / 30 min.
C
Making this a cycle, repeat 5 cycles.
AMP Spec. 109-5103 Condition A
Para.
3.5.12
Test
Items
4GSWKTGOGPVU
Procedures
Humidity-Temperature
Cycling
∆4
3.5.13
Salt Spray
∆4
O
Æ
O
Æ
+ P U W N C V K Q P T G U K U V C Pconnector, 25:* 65°C,
Mated E G
/Æ / K P H K P C N
90:* 95 % R. H. 5 cycles
/CZ
(KPCN
Cold shock 9 10° performed
C
AMP Spec. 109-5106
/CZ
(KPCN
Subject mated connectors to 5 % salt
concentration for 24 hours :
AMP Spec.
3.5.14
Industrial Gas (SO2)
∆4
O
Æ
/CZ
(KPCN
109-5101
Condition A
Mated connector
SO2 Gas : 10 ppm, 95 % R. H.
25°
C, 24 hours
AMP Spec.
109-5107
Condition A
3.5.11
Thermal Shock
∆R=20
m Æ Max. (Final)
Rev. F
3 of 5
Product Specification
108-5701
3.5.15
Temperature Life
(Heat Aging)
∆4
O
Æ
/CZ
(KPCN
Mated connector
85° Duration :2 days
C,
AMP Spec. 109-5104
Condition A
4. Product Qualification Test Sequence
Test Group
Test Examination
1 2(b) 3(b) 4
5
6
7
8
9
10 11 12
Test Sequence (a)
Examination of Product
Termination Resistance
(Low Level)
Dielectric withstanding
Voltage
Insulation Resistance
Vibration (Low Frequency)
Physical Shock
Connector Mating Force
Durability (Repeated
Mate/Unmating)
Solderability
Resistance to Reflow
Soldering Heat
Thermal Shock
Temperature Humidity
Cycling
Salt Spray
Industrial SO
2
Gas
Temperature Life
(Heat Aging)
FIG.2
(a) Numbers indicate sequence in which the tests are performed.
(b) Discontinuities shall nit take place in this test group, during tests.
4
3
3
3
3,6
2,5
3
3
2
3
2
2
3
3
1,7 1,5 1,5 1,3 1,5 1,3 1,3 1,5 1,5 1,5 1,5 1,5
2,4 2,4
2,4
2,4 2,4 2,4 2,4 2,4
Rev. F
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Product Specification
108-5701
Fig.3-1 Termination Resistance Mesuring Points.
Soldering temperature (
=Ä
)
300
260 Max.
250
230 Min.
200
180
150
100
50
Peak temperature
260=˜ Max.
Pre-Heating
90 + 30 sec
-
Heat
30 + 10 sec
-
Fig.4 Temperature Profile of Reflow Soldering
Rev. F
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Microchip MCU
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