High Density Card Edge
.050” [1.27 mm] Contact Centers, .488” [12.40 mm] Insulator Height, Ultra Thin,
Dip Solder/Card Extender/SMT
SPECIFICATIONS
High Density Card Edge
•
•
•
•
•
•
•
Accommodates .062” ± .008” [1.57 mm ± 0.20 mm] PC board
PPS or PA9T insulator
Contact Material: Phosphor Bronze, Beryllium Copper or Spinodal
Molded-in key available
1 Amp current rating per contact for contacts fully energized
UL Flammability Rating: 94V-0
Operating Temperature: -65°C up to +200°C
READOUT
MOUNTING STYLE
.134” [3.41]
.025” [0.64]
DUAL (D)
NO MOUNTING EARS
(N)
METAL BOARD LOCK
(with no mounting ears)
(R)
TERMINATION TYPE
.100” [2.54]
.125” [3.18]
.140” [3.56]
.175” [4.44]
.200” [5.08]
3X .100”
[2.54]
ACCEPTS .062” [1.57] PCB
DIP SOLDER
(YH)
DIP SOLDER
(YS)
CARD EXTENDER
(YR)
SURFACE MOUNT
(YF)
PCB LAYOUT
A
.100” [2.54]
.050” [1.27]
PIN 1
Ø.032” [0.81] .050” [1.27]
MIN.
3X .100”
[2.54] .200” [5.08]
A
.050” [1.27]
A
.062” [1.57]
.200” [5.08]
F
A
.050” [1.27]
.290” [7.37]
MIN.
.160” [4.06]
MAX.
2X
Ø.096” [2.44]
(FOR 'R' MOUNTING)
Ø .030” [0.76]
MIN.
.040” [1.02]
.040” [1.02]
MAX.
PCB LAYOUT
(YH)
PCB LAYOUT
(YS)
PCB LAYOUT
(YR)
PCB LAYOUT
(YF)
18
www.sullinscorp.com
|
760-744-0125
|
toll-free 888-774-3100
|
fax 760-744-6081
|
info@sullinscorp.com
High Density Card Edge
.050” [1.27 mm] Contact Centers, .488” [12.40 mm] Insulator Height, Ultra Thin,
Dip Solder/Card Extender/SMT
PART NUMBER OPTIONS
G C B 20 D YH N - S1355
MODIFICATION CODE
(Consult Factory)
S1355
=
for YH Termination Only
S1675
=
for YS, YR & YF Terminations
MOUNTING STYLE
N =
No Mounting
R
=
Metal Board Locks
(for YF Termination Only)
TERMINATION TYPE (See Opposite Page)
YH
=
Dip Solder, Alternate Bent In & Out
YS
=
Dip Solder
YR
=
Card Extender
YF
=
Surface Mount
READOUT
D =
Dual
MATERIALS (INSULATOR/CONTACT)
R
=
PPS/Phosphor Bronze
G
=
PA9T/Phosphor Bronze
A =
PPS/Beryllium Copper
J =
PA9T/Beryllium Copper
F
=
PPS/Spinodal**
Refer to Page 7 for Operating/Processing Temperatures
High Density Card Edge
CONTACT FINISH - RoHS Compliant
All platings are Lead Free and have .000050” Nickel underplate
Contact Surface
B
=
.000010” Gold
C
=
.000030” Gold
M =
.000030” Gold
Termination
.000100” Pure Tin, Matte
.000100” Pure Tin, Matte
.000010” Gold Overall
CONTACT CENTERS
B
=
.050” [1.27 mm]
NUMBER OF CONTACT POSITIONS
See Chart Below
**Consult factory for special soldering guidelines. 'M' plating only.
DIMENSIONS
Dimensions in [ ] are in millimeters, all others are in inches.
C
B
A
FIRST POSITION
INDICATOR
.320[8.13]
.250[6.35]
.488
[12.40]
.155 [3.94]
INSERTION DEPTH
.060 [1.52]
.050 [1.27] TYP.
.016 [0.41] SQ.
POSITIONS/
CONTACTS
5/10
6/12*
10/20*
15/30
20/40
25/50*
30/60
40/80
50/100
79/158
INCHES
A±.005
0.200
0.250
0.450
0.700
0.950
1.200
1.450
1.950
2.450
3.900
B±.005
0.300
0.350
0.550
0.800
1.050
1.300
1.550
2.050
2.550
4.000
C±.015
0.425
0.475
0.675
0.925
1.175
1.425
1.675
2.175
2.675
4.125
F±.010
0.350
0.400
0.600
0.850
1.100
1.350
1.600
2.100
2.600
4.050
A±0.13
5.08
6.35
11.43
17.78
24.13
30.48
36.83
49.53
62.23
99.06
MILLIMETERS
B±0.13
7.62
8.89
13.97
20.32
26.67
33.02
39.37
52.07
64.77
101.60
C±0.38
10.80
12.07
17.15
23.50
29.85
36.20
42.55
55.25
67.95
104.78
F±0.25
8.89
10.16
15.24
21.59
27.94
34.29
40.64
53.34
66.04
102.87
* Consult factory for availability.
www.sullinscorp.com
|
760-744-0125
|
toll-free 888-774-3100
|
fax 760-744-6081
|
info@sullinscorp.com
19
MEMS传感器
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
