SPC584Cx, SPC58ECx
SPC58 C Line - 32 bit Power Architecture automotive MCU
Dual z4 cores 180 MHz, 4 MBytes Flash, HSM, ASIL-B
Datasheet
-
production data
eTQFP64 (10 x 10 x 1.0 mm)
eTQFP100 (14 x 14 x 1.0 mm)
– Memory Error Management Unit (MEMU)
for collection and reporting of error events
in memories
– Cyclic redundancy check (CRC) unit
•
Crossbar switch architecture for concurrent
access to peripherals, Flash, or RAM from
multiple bus masters with end-to-end ECC
eTQFP144 (20 x 20 x 1.0 mm) eLQFP176 (24 x 24 x 1.4 mm)
•
Body cross triggering unit (BCTU)
– Triggers ADC conversions from any eMIOS
channel
– Triggers ADC conversions from up to 2
dedicated PIT_RTIs
•
Enhanced modular IO subsystem (eMIOS): up
to 64 timed I/O channels with 16-bit counter
resolution
•
Enhanced analog-to-digital converter system
with:
– 3 independent fast 12-bit SAR analog
converters
– 1 supervisor 12-bit SAR analog converter
– 1 10-bit SAR analog converter with STDBY
mode support
•
Communication interfaces
– 18 LINFlexD modules
– 8 deserial serial peripheral interface (DSPI)
modules
– 8 MCAN interfaces with advanced shared
memory scheme and ISO CAN-FD support
– Dual-channel FlexRay controller
– 1 ethernet controller 10/100 Mbps,
compliant IEEE 802.3-2008
•
Low power capabilities
– Versatile low power modes
– Ultra low power standby with RTC
– Smart Wake-up Unit for contact monitoring
– Fast wakeup schemes
•
Dual phase-locked loops with stable clock
domain for peripherals and FM modulation
domain for computational shell
FPBGA292 (17 x 17 x 1.8 mm)
Features
•
AEC-Q100 qualified
•
High performance e200z420n3 dual core
– 32-bit Power Architecture technology CPU
– Core frequency as high as 180 MHz
– Variable Length Encoding (VLE)
•
4224 KB (4096 KB code flash + 128 KB data
flash) on-chip flash memory: supports read
during program and erase operations, and
multiple blocks allowing EEPROM emulation
•
176 KB HSM dedicated flash memory (144 KB
code + 32 KB data)
•
384 KB on-chip general-purpose SRAM (in
addition to 128 KB core local data RAM: 64 KB
included in each CPU)
•
Multi-channel direct memory access controller
(eDMA) with 64 channels
•
1 interrupt controller (INTC)
•
Comprehensive new generation ASIL-B safety
concept
– ASIL-B of ISO 26262
– FCCU for collection and reaction to failure
notifications
May 2021
This is information on a product in full production.
DS11620 Rev 8
1/153
www.st.com
SPC584Cx, SPC58ECx
•
Nexus development interface (NDI) per IEEE-ISTO 5001-2003 standard, with some
support for 2010 standard
•
Boot assist Flash (BAF) supports factory programming using a serial bootload through the
asynchronous CAN or LIN/UART
•
Junction temperature range -40 °C to 150 °C
Table 1. Device summary
Part number
Package
2 MB
Single core
eTQFP64
Dual core
3 MB
Single core
Dual core
4 MB
Single core
Dual core
SPC584C70E1 SPC58EC70E1 SPC584C74E1 SPC58EC74E1 SPC584C80E1 SPC58EC80E1
eTQFP100 SPC584C70E3 SPC58EC70E3 SPC584C74E3 SPC58EC74E3 SPC584C80E3 SPC58EC80E3
eTQFP144 SPC584C70E5 SPC58EC70E5 SPC584C74E5 SPC58EC74E5 SPC584C80E5 SPC58EC80E5
eLQFP176 SPC584C70E7 SPC58EC70E7 SPC584C74E7 SPC58EC74E7 SPC584C80E7 SPC58EC80E7
FPBGA292 SPC584C70C3 SPC58EC70C3 SPC584C74C3 SPC58EC74C3 SPC584C80C3 SPC58EC80C3
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SPC584Cx, SPC58ECx
Contents
Contents
1
2
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.1
2.2
2.3
Device feature summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Features overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
3
4
Package pinouts and signal descriptions . . . . . . . . . . . . . . . . . . . . . . . 13
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
4.1
4.2
4.3
4.4
4.5
4.6
4.7
4.8
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
4.3.1
Power domains and power up/down sequencing . . . . . . . . . . . . . . . . . 19
Electrostatic discharge (ESD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Electromagnetic compatibility characteristics . . . . . . . . . . . . . . . . . . . . . . 21
Temperature profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Device consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
I/O pad specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
4.8.1
4.8.2
4.8.3
I/O input DC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
I/O output DC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
I/O pad current specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
4.9
4.10
Reset pad (PORST) electrical characteristics . . . . . . . . . . . . . . . . . . . . . 37
PLLs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
4.10.1
4.10.2
PLL0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
PLL1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Crystal oscillator 40 MHz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
Crystal Oscillator 32 kHz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
RC oscillator 16 MHz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Low power RC oscillator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
ADC input description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
4.11
Oscillators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
4.11.1
4.11.2
4.11.3
4.11.4
4.12
ADC system . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
4.12.1
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Contents
4.12.2
4.12.3
SPC584Cx, SPC58ECx
SAR ADC 12-bit electrical specification . . . . . . . . . . . . . . . . . . . . . . . . . 48
SAR ADC 10-bit electrical specification . . . . . . . . . . . . . . . . . . . . . . . . . 53
4.13
4.14
Temperature Sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
LFAST pad electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
4.14.1
4.14.2
4.14.3
LFAST interface timing diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
LFAST LVDS interface electrical characteristics . . . . . . . . . . . . . . . . . . 58
LFAST PLL electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
Power management integration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
Voltage regulators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
Voltage monitors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
4.15
Power management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
4.15.1
4.15.2
4.15.3
4.16
4.17
Flash . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
AC Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
4.17.1
4.17.2
4.17.3
4.17.4
4.17.5
4.17.6
4.17.7
Debug and calibration interface timing . . . . . . . . . . . . . . . . . . . . . . . . . 77
DSPI timing with CMOS pads . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
Ethernet timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93
FlexRay timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99
CAN timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103
UART timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103
I2C timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104
5
Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106
5.1
5.2
5.3
5.4
5.5
5.6
eTQFP64 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106
5.1.1
5.2.1
5.3.1
5.4.1
5.5.1
Package mechanical drawings and data information . . . . . . . . . . . . . 110
Package mechanical drawings and data information . . . . . . . . . . . . . 115
Package mechanical drawings and data information . . . . . . . . . . . . . 120
Package mechanical drawings and data information . . . . . . . . . . . . . 125
Package mechanical drawings and data information . . . . . . . . . . . . . 128
eTQFP100 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111
eTQFP144 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .116
eLQFP176 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121
FPBGA292 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126
Package thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 130
5.6.1
5.6.2
5.6.3
eTQFP64 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 130
eTQFP100 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 130
eTQFP144 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131
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DS11620 Rev 8
SPC584Cx, SPC58ECx
5.6.4
5.6.5
5.6.6
Contents
LQFP176 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132
FPBGA292 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 133
General notes for specifications at maximum junction temperature . . 133
6
7
Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 136
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 140
DS11620 Rev 8
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嵌入式系统
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