Microprocessor Circuit, PDSO48, 0.300 INCH, MO-118, SSOP-48
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | IDT (Integrated Device Technology) |
| 零件包装代码 | SSOP |
| 包装说明 | 0.300 INCH, MO-118, SSOP-48 |
| 针数 | 48 |
| Reach Compliance Code | compliant |
| JESD-30 代码 | R-PDSO-G48 |
| JESD-609代码 | e3 |
| 长度 | 15.875 mm |
| 端子数量 | 48 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SSOP |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 260 |
| 认证状态 | Not Qualified |
| 座面最大高度 | 2.8 mm |
| 最大供电电压 | 3.465 V |
| 最小供电电压 | 3.135 V |
| 标称供电电压 | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | MATTE TIN |
| 端子形式 | GULL WING |
| 端子节距 | 0.635 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 7.5 mm |
| uPs/uCs/外围集成电路类型 | MICROPROCESSOR CIRCUIT |
| Base Number Matches | 1 |
| 9LPRS535BFLFT | 9LPRS535CFLF | 9LPRS535BFLF | 9LPRS535BGLF | 9LPRS535BGLFT | 9LPRS535CFLFT | 9LPRS535CGLF | 9LPRS535CGLFT | |
|---|---|---|---|---|---|---|---|---|
| 描述 | Microprocessor Circuit, PDSO48, 0.300 INCH, MO-118, SSOP-48 | Microprocessor Circuit, PDSO48, 0.300 INCH, MO-118, SSOP-48 | Microprocessor Circuit, PDSO48, 0.300 INCH, MO-118, SSOP-48 | Microprocessor Circuit, PDSO48, 6.10 MM, 0.50 MM PITCH, MO-153, TSSOP-48 | Microprocessor Circuit, PDSO48, 6.10 MM, 0.50 MM PITCH, MO-153, TSSOP-48 | Microprocessor Circuit, PDSO48, 0.300 INCH, MO-118, SSOP-48 | Microprocessor Circuit, PDSO48, 6.10 MM, 0.50 MM PITCH, MO-153, TSSOP-48 | Microprocessor Circuit, PDSO48, 6.10 MM, 0.50 MM PITCH, MO-153, TSSOP-48 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 零件包装代码 | SSOP | SSOP | SSOP | TSSOP | TSSOP | SSOP | TSSOP | TSSOP |
| 包装说明 | 0.300 INCH, MO-118, SSOP-48 | 0.300 INCH, MO-118, SSOP-48 | 0.300 INCH, MO-118, SSOP-48 | 6.10 MM, 0.50 MM PITCH, MO-153, TSSOP-48 | 6.10 MM, 0.50 MM PITCH, MO-153, TSSOP-48 | SSOP, | 6.10 MM, 0.50 MM PITCH, MO-153, TSSOP-48 | 6.10 MM, 0.50 MM PITCH, MO-153, TSSOP-48 |
| 针数 | 48 | 48 | 48 | 48 | 48 | 48 | 48 | 48 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | unknown | unknown |
| JESD-30 代码 | R-PDSO-G48 | R-PDSO-G48 | R-PDSO-G48 | R-PDSO-G48 | R-PDSO-G48 | R-PDSO-G48 | R-PDSO-G48 | R-PDSO-G48 |
| 长度 | 15.875 mm | 15.875 mm | 15.875 mm | 12.5 mm | 12.5 mm | 15.875 mm | 12.5 mm | 12.5 mm |
| 端子数量 | 48 | 48 | 48 | 48 | 48 | 48 | 48 | 48 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SSOP | SSOP | SSOP | TSSOP | TSSOP | SSOP | TSSOP | TSSOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 2.8 mm | 2.8 mm | 2.8 mm | 1.2 mm | 1.2 mm | 2.8 mm | 1.2 mm | 1.2 mm |
| 最大供电电压 | 3.465 V | 3.465 V | 3.465 V | 3.465 V | 3.465 V | 3.465 V | 3.465 V | 3.465 V |
| 最小供电电压 | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V |
| 标称供电电压 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.635 mm | 0.635 mm | 0.635 mm | 0.5 mm | 0.5 mm | 0.635 mm | 0.5 mm | 0.5 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 7.5 mm | 7.5 mm | 7.5 mm | 6.1 mm | 6.1 mm | 7.5 mm | 6.1 mm | 6.1 mm |
| uPs/uCs/外围集成电路类型 | MICROPROCESSOR CIRCUIT | MICROPROCESSOR CIRCUIT | MICROPROCESSOR CIRCUIT | MICROPROCESSOR CIRCUIT | MICROPROCESSOR CIRCUIT | MICROPROCESSOR CIRCUIT | MICROPROCESSOR CIRCUIT | MICROPROCESSOR CIRCUIT |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | - | - |
| 厂商名称 | IDT (Integrated Device Technology) | - | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
| JESD-609代码 | e3 | e3 | e3 | e3 | e3 | e3 | - | - |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | 260 | 260 | - | - |
| 端子面层 | MATTE TIN | MATTE TIN | MATTE TIN | MATTE TIN | MATTE TIN | Matte Tin (Sn) | - | - |
| 处于峰值回流温度下的最长时间 | 30 | 30 | 30 | 30 | 30 | 30 | - | - |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
