Si5330
1 . 8 / 2 . 5 / 3 . 3 V L
O W
- J
I T T E R
, L
O W
- S
K EW
C
L O C K
B
U F F E R
/ L
E V E L
T
R A N S L A T O R
Features
18
17
16
15
14
13
7
8
9
10
11
12
Supports single-ended or
differential input clock signals
Generates four differential
(LVPECL, LVDS, HCSL) or eight
single-ended (CMOS, SSTL,
HSTL) outputs
Provides signal level translation
Differential to single-ended
Single-ended to differential
Differential to differential
Single-ended to single-ended
Wide frequency range
LVPECL, LVDS: 5 to 710 MHz
HCSL: 5 to 250 MHz
SSTL, HSTL: 5 to 350 MHz
CMOS: 5 to 200 MHz
Additive jitter: 150 fs RMS typ
RSVD_GND
CLK0A
CLK0B
VDD
VDDO0
20
Small size: 24-lead, 4 x 4 mm
QFN
24
23
22
21
19
OEB
CLK1A
CLK1B
VDDO1
VDDO2
CLK2A
CLK2B
RSVD_GND
Output-output skew: 100 ps
Propagation delay: 2.5 ns typ
Single core supply with excellent
PSRR: 1.8, 2.5, or 3.3 V
Output driver supply voltage
independent of core supply: 1.5,
1.8, 2.5, or 3.3 V
Loss of Signal (LOS) indicator
allows system clock monitoring
Output Enable (OEB) pin allows
glitchless control of output clocks
Low power: 10 mA typical core
current
Industrial temperature range:
–40 to +85
°
C
Ordering Information:
See page 14.
Pin Assignments
IN1
IN2
IN3
1
Applications
2
3
High Speed Clock Distribution
Ethernet Switch/Router
SONET / SDH
PCI Express 2.0/3.0
Fibre Channel
MSAN/DSLAM/PON
Telecom Line Cards
RSVD_GND
RSVD_GND
RSVD_GND
GND
GND
CLK3B
Functional Block Diagram
V
DD
V
DDO0
CLK0
Si5330
V
DDO1
CLK1
Single-ended
or
Differential
IN
V
DDO2
CLK2
Single-ended
or
Differential
V
DDO3
LOS
OEB
Control
CLK3
Rev. 1.0 4/12
Copyright © 2012 by Silicon Laboratories
VDDO3
VDD
LOS
CLK3A
4
5
6
Si5330
Si5330
1. Functional Block Diagrams Based on Orderable Part Number
*
1:4 Differential to Differential Buffer
Si5330A/B/C
V
DDO0
CLK0A
CLK0B
IN1
IN2
IN3
V
DDO1
CLK1A
CLK1B
V
DDO2
CLK2A
CLK2B
LOS
OEB
Control
V
DDO3
CLK3A
CLK3B
LOS
OEB
Control
IN1
IN2
IN3
1:8 Single-Ended to Single-Ended Buffer
Si5330F
V
DDO0
CLK0A
CLK0B
V
DDO1
CLK1A
CLK1B
V
DDO2
CLK2A
CLK2B
V
DDO3
CLK3A
CLK3B
1:8 Differential to Single-Ended Buffer
Si5330G/H/J
V
DDO0
CLK0A
CLK0B
IN1
IN2
IN3
V
DDO1
CLK1A
CLK1B
V
DDO2
CLK2A
CLK2B
LOS
OEB
1:4 Single-Ended to Differential Buffer
Si5330K/L/M
V
DDO0
CLK0A
CLK0B
IN3
IN1
IN2
V
DDO1
CLK1A
CLK1B
V
DDO2
CLK2A
CLK2B
LOS
OEB
Control
V
DDO3
CLK3A
CLK3B
Control
V
DDO3
CLK3A
CLK3B
Figure 1. Si5330 Functional Block Diagrams
*Note:
See Table 11 for detailed ordering information.
2
Rev. 1.0
Si5330
T
ABLE
Section
OF
C
ONTENTS
Page
1. Functional Block Diagrams Based on Orderable Part Number* . . . . . . . . . . . . . . . . . . .2
2. Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4
3. Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
3.1. VDD and VDDO Supplies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
3.2. Loss Of Signal Indicator (LOS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
3.3. Output Enable (OEB) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
3.4. Input Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
3.5. Output Driver Formats . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
3.6. Input and Output Terminations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
4. Ordering the Si5330 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
5. Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
6. Orderable Part Numbers and Device Functionality . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
7. Package Outline: 24-Lead QFN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
8. Recommended PCB Layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
9. Top Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
9.1. Si5330 Top Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
9.2. Top Marking Explanation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18
Document Change List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19
Contact Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20
Rev. 1.0
3
Si5330
2. Electrical Specifications
Table 1. Recommended Operating Conditions
(V
DD
= 1.8 V –5% to +10%, 2.5 V ±10%, or 3.3 V ±10%, T
A
= –40 to 85°C)
Parameter
Ambient Temperature
Symbol
T
A
Test Condition
Min
–40
2.97
Typ
25
3.3
2.5
1.8
—
Max
85
3.63
2.75
1.98
3.63
Unit
°C
V
V
V
V
Core Supply Voltage
V
DD
2.25
1.71
Output Buffer Supply
Voltage
V
DDOn
1.4
Note:
All minimum and maximum specifications are guaranteed and apply across the recommended operating conditions.
Typical values apply at nominal supply voltages and an operating temperature of 25 °C unless otherwise noted.
Table 2. DC Characteristics
(V
DD
= 1.8 V –5% to +10%, 2.5 V ±10%, or 3.3 V ±10%, T
A
= –40 to 85°C)
Parameter
Core Supply Current
Symbol
I
DD
Test Condition
50 MHz refclk
LVPECL, 710 MHz
LVDS, 710 MHz
HCSL, 250 MHz
2 pF load capacitance
Min
—
—
—
—
—
—
—
—
Typ
10
—
—
—
—
—
—
—
Max
—
30
8
20
19
28
28
19
Unit
mA
mA
mA
mA
mA
mA
mA
mA
Output Buffer Supply Current
I
DDOx
SSTL, 350 MHz
CMOS, 50 MHz
15 pF load capacitance
CMOS, 200 MHz
2 pF load capacitance
HSTL, 350 MHz
4
Rev. 1.0
Si5330
Table 3. Performance Characteristics
(V
DD
= 1.8 V –5% to +10%, 2.5 V ±10%, or 3.3 V ±10%, T
A
= –40 to 85°C)
Parameter
CLKIN Loss of Signal Assert
Time
CLKIN Loss of Signal De-Assert
Time
Input-to-Output Propagation
Delay
Output-Output Skew
POR to Output Clock Valid
Symbol
t
LOS
t
LOS_B
t
PROP
t
DSKEW
t
START
Test Condition
Min
—
Typ
2.6
0.2
2.5
—
—
Max
5
1
4.0
100
2
Unit
µs
µs
ns
ps
ms
After initial start-up time has
expired
0.01
—
Outputs at same signal
format
Start-up time for output
clocks
—
—
Table 4. Input and Output Clock Characteristics
(V
DD
= 1.8 V –5% to +10%, 2.5 V ±10%, or 3.3 V ±10%, T
A
= –40 to 85 °C)
Parameter
Symbol
Test Condition
Min
Typ
Max
Units
Input Clock (AC Coupled Differential Input Clocks on Pin IN1/2)
Frequency
Differential Voltage Swing
Rise/Fall Time
Duty Cycle
Input Impedance
Input Capacitance
f
IN
V
PP
t
R
/t
F
DC
R
IN
C
IN
710 MHz input
20%–80%
< 1 ns tr/tf
5
0.4
—
40
10
—
—
—
—
50
—
3.5
710
2.4
1.0
60
—
—
MHz
V
PP
ns
%
k
pF
Input Clock (DC-Coupled Single-Ended Input Clock on Pin IN3)
Frequency
Input Voltage
Input Voltage Swing
(CMOS Standard)
Rise/Fall Time
Duty Cycle
Input Capacitance
Output Clocks (Differential)
Frequency
f
OUT
LVPECL, LVDS
HCSL
5
5
—
—
710
250
MHz
MHz
t
R
/t
F
DC
C
IN
f
IN
V
I
200 MHz, Tr/Tf = 1.3 ns
20%–80%
< 2 ns tr/tf
CMOS
HSTL, SSTL
5
5
–0.1
0.8
—
40
—
—
—
—
—
—
50
2
200
350
VDD
—
4
60
—
MHz
MHz
V
Vpp
ns
%
pF
Rev. 1.0
5
嵌入式系统
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