TS8
E
MBER
®
EM3
X
M
ODULE
T
ECHNICAL
S
PECIFICATION
Silicon Labs’ EM3x development kits contain various modules designed around the EM3x family of ICs. All of these
modules are designed and sold by Silicon Labs’ module partners Telegesis (UK) Limited and California Eastern
Laboratories (CEL). The module designs allow them to be integrated into any product without the need for RF
experience and expertise. Utilizing stacks such as Silicon Labs’ certified ZigBee network stack EmberZNet, these
modules enable a developer to add powerful wireless networking capability to products and quickly bring them to
market.
This document provides the technical specification of the EM3x modules on its Silicon Labs-specific carrier board.
For more information on the other Telegesis modules, contact Telegesis, Ltd directly at
www.telegesis.com.
For
more information on other CEL modules, contact CEL directly at
meshconnect.cel.com.
New in This Revision
Added CEL CE compliance information.
Contents
1
2
3
4
5
EM3x Module Definitions................................................................................................................................. 2
EM3x Module Features ................................................................................................................................... 3
Performance Characteristics ........................................................................................................................... 3
EM3x Configurations ....................................................................................................................................... 5
Mechanical Details .......................................................................................................................................... 7
5.1
EM3x Module Interface Connector ........................................................................................................... 8
Rev 1.4
Copyright © 2015 by Silicon Laboratories
TS8
TS8
1 EM3x Module Definitions
To accommodate the requirements of the different markets, Telegesis and CEL have developed a series of pin-
compatible modules based on the Ember EM341, EM346, EM357, and EM3588 chipsets. Table 1 defines the
Telegesis, CEL, and Silicon Labs part numbers for each module as well as describes the differences (Power
Amplifier (PA), Low Noise Amplifier (LNA), and RF connection) between each module.
Table 1. Silicon Labs and Module Partner Part Numbers
Silicon Labs
P/N
110-0740-000
110-0741-000
110-0742-000
110-0743-000
110-0720-000
110-0721-000
110-0722-000
110-0723-000
110-0730-000
110-0731-000
110-0732-000
110-0733-000
110-0734-000
110-0735-000
110-0736-000
110-0737-000
Silicon Labs Orderable
Part Number (OPN)
EM341-MOD-ANT-C
EM341-MOD-RF-C
EM346-MOD-ANT-C
EM346-MOD-RF-C
EM357-MOD-ANT-T
EM357-MOD-RF-T
EM357-MOD-LR-RF-T
EM357-MOD-LR-ANT-T
EM357-MOD-ANT-C
EM357-MOD-RF-C
EM357-MOD-LR-RF-C
EM357-MOD-LR-ANT-C
EM3588-M-AN-C
EM3588-MOD-RF-C
EM3588-MLR-RF-C
EM3588-MLR-AN-C
EM3x
IC
EM341
EM341
EM346
EM346
EM357
EM357
EM357
EM357
EM357
EM357
EM357
EM357
EM3588
EM3588
EM3588
EM3588
Module
Partner
CEL
CEL
CEL
CEL
Telegesis
Telegesis
Telegesis
Telegesis
CEL
CEL
CEL
CEL
CEL
CEL
CEL
CEL
Module Partner P/N
(Module only)
ZICM341SP0-1
ZICM341SP0-1C
ZICM346SP0-1
ZICM346SP0-1C
ETRX357
ETRX357HR
ETRX357HR-LRS
ETRX357-LRS
ZICM357SP0-1
ZICM357SP0-1C
ZICM357SP2-1C
ZICM357SP2-1
ZICM3588SP0-1
ZICM3588SP0-1C
ZICM3588SP2-1C
ZICM3588SP2-1
RF Connection
PA /
LNA?
(Long
Range)
No
No
No
No
No
No
Yes
Yes
No
No
Yes
Yes
No
No
Yes
Yes
Antenna
Connector
Antenna
Connector
SMT Antenna
Mini-RF Connector
Mini-RF Connector
SMT Antenna
SMT Antenna
Mini-RF Connector
Mini-RF Connector
SMT Antenna
SMT Antenna
Mini-RF Connector
Mini-RF Connector
SMT Antenna
All of these modules are available from Telegesis and CEL. Silicon Labs provides the CEL EM357 and EM3588
module types with the EM35x Development Kit (part number EM35X-DEV) and the EM341 and EM346 modules
with the EM34x Development Kit (part number EM34X-DEV).
For modules whose RF connection is a mini-RF connector, an RF adapter cable (Tyco/Amp part number 2032440-
1) can be used to interface the module to external test equipment. One of these RF adapter cables is included with
the development kits.
To connect to the EM35x breakout board (Silicon Labs P/N: 130-0680-000), each module shown in Table 1 is
soldered to a small carrier board. The carrier board connector is discussed in section 5.1, EM3x Module Interface
Connector.
2
Rev. 1.4
TS8
2 EM3x Module Features
Module features:
•
•
•
•
•
•
•
•
Small form factor, SMT module (25 mm x 19 mm)
Side castellation for easy soldering and inspection
Industry standard JTAG Programming and real-time network level debugging via the Packet Trace Port.
Wide supply voltage range (2.1 to 3.6 V)
Low sleep current (< 1 µA for EM35x and EM34x, < 2 µA for EM3588)
Access to all EM3x GPIO from the System-on-Chip (SoC)
Access to either a U.FL RF Connector or a SMT antenna allows flexibility in antenna selection process
FCC compliance
Telegesis:
FCC ID: S4GEM35XA
CEL:
FCC ID: W7Z-ZICM357SPO
FCC ID: W7Z-ZICM357SP2
CE compliance
Telegesis:
Radio: EN300 328 v1.7.1
EMC: EN301 489-17 v2.1.1
Safety: EN60950-1
CEL
•
•
•
•
•
Radio: EN 300 328 V1.8.1 (2006
‐
2012)
EMC: EN 301 489‐1 V1.8.1, V1.9.1
EN 301 489‐17 V2.2.1
Long Range versions with a link budget of up to 124 dB
Access to the Packet Trace Port connector (allows for direct connection to the Ember Debug Adapter
(ISA3) for programming and debugging)
Two debug LEDs
Access to all EM3x GPIO through a robust 0.05” pitch connector
Module with carrier board features:
3 Performance Characteristics
This section describes the characteristics of the module with carrier board. For more information on the EM35x and
EM34x SoC performance, refer to the EM35x, EM358x, EM341 and EM346 data sheets.
Unless specified, the data within each of the tables was gathered at room temperature (25 °C) and 3.0 V source
potential. Table 2 summarizes the recommended operating conditions for the modules.
Table 2. Recommended Operating Conditions for the EM3x Module
Parameter
VDD supply
RF Input Frequency
RF Input Power (at RF Port)
Operating Temperature Range
Min
2.1
2405
—
-40
Typ
—
—
—
—
Max
3.6
2480
0
85
Unit
V
MHz
dBm
°C
Rev. 1.4
3
TS8
Table 3 summarizes the DC characteristics at 25 °C and VDD of 3 V of the EM3x Module.
Table 3. DC Characteristics of the EM3x Module
Parameter
VDD supply
Sleep Current (RC oscillator)
Active Current (TX)
TX, Normal Mode, +3 dBm
TX, Boost Mode, +8 dBm
TX, Normal Mode, 0 dBm
Active Current (RX)
RX, Normal Mode
RX, Boost Mode
Wake Time from Deep Sleep
Shutdown Time
—
—
—
—
26
27
100
5
—
—
—
—
mA
mA
us
us
—
—
—
31
39
28.5
—
—
—
mA
mA
Min
2.1
—
Typ
—
0.4
Max
3.6
—
Unit
V
µA
Table 4 summarizes the digital I/Os at VCC = 3 V and 25 °C of the EM3x Module.
Table 4. Digital I/O Characteristics of the EM3x Module
Parameter
Input Logic Threshold
Schmitt threshold (high to low)
Schmitt threshold (low to high)
Input Current
Logic Low
Logic High
Output Voltage
Logic Low
Logic High
Output Current
Source, Standard Pad
Sink, Standard Pad
Source, High Current Pad
Sink, High Current Pad
Total Output Current
—
—
—
—
—
—
—
—
—
—
4
4
8
8
40
mA
mA
mA
mA
mA
—
—
—
0
0.82 x VDD
—
—
—
—
—
-0.5
0.5
—
0.18 x VDD
VDD
V
V
µA
µA
0.42 x VDD
0.62 x VDD
—
—
0.5 x VDD
0.8 x VDD
V
V
Min
Typ
Max
Unit
4
Rev. 1.4
TS8
Table 5 summarizes the RF parameters of the EM3x Module.
Table 5. RF Characteristics of the EM3x Module
Parameter
Frequency Range
Channel Spacing
RX Sensitivity (1% PER, 20-byte packet)
Normal Mode
Boost Mode
Adjacent Channel Rejection
High Side
Low Side
2
nd
High Side
2
nd
Low Side
All other channels
TX Power (Maximum)
Boost Mode
Normal Mode
Error Vector Magnitude (Offset EVM) (per IEEE 802.15.4-2003)
PSD (3.5 MHz from carrier)
Relative
Absolute
-20
-30
—
—
—
—
dB
dBm
—
—
—
8
3
5
—
—
15
dBm
dBm
%
—
—
—
—
—
35
35
43
43
40
—
—
—
—
—
dB
dB
dB
dB
dB
—
—
-100
-101
-94
-95
dBm
dBm
Min
2405
—
Typ
—
5
Max
2480
—
Unit
MHz
MHz
4 EM3x Configurations
The IC on the EM3x Module can be set to different RF frequency channels as well as different power levels. When
using the nodetest application on the module, the frequency channels and output power levels can be configured
through a command line interface (CLI).
In order to configure the output power, the setTXPower command can be used. Table 6 demonstrates the
setTXPower command and the expected power output. Note that these are the typical expected power output
levels based on the performance of the EM3x IC and actual results are dependent on the module provider design
implementation.
Note:
Table 6 refers to the non-PA versions of the modules. For the version with a PA, the output power should be
set to -5 dBm in order to achieve +20 dBm output power.
Table 6: List of TX output powers when using SetTxPower
SetTxPower
[signed hexadecimal]
SetTxPower 9
SetTxPower 8
SetTxPower 7
SetTxPower 6
SetTxPower 5
Output Power
(dBm)
+3
+8
+7
+6
+5
Rev. 1.4
5
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