Agilent HCPL-3140/HCPL-0314
0.6 Amp Output Current IGBT
Gate Drive Optocoupler
Data Sheet
Functional Diagram
N/C
1
8
V
CC
N.C.
Truth Table
LED
OFF
V
O
LOW
HIGH
ANODE
CATHODE
N/C
2
3
4
7
6
5
V
O
V
EE
ON
SHIELD
HCPL-3140/HCPL-0314
Description
The HCPL-3140/HCPL-0314 family
of devices consists of a GaAsP LED
optically coupled to an integrated
circuit with a power output stage.
These optocouplers are ideally
suited for driving power IGBTs
and MOSFETs used in motor
control inverter applications. The
high operating voltage range of the
output stage provides the drive
voltages required by gate
controlled devices. The voltage
and current supplied by this
optocoupler makes it ideally
suited for directly driving small
or medium power IGBTs. For
IGBTs with higher ratings, the
HCPL-3150 (0.6 A) or
HCPL-3120 (2.5 A) optocouplers
can be used.
Features
• 0.6 A maximum peak output
current
• 0.4 A minimum peak output
current
• High speed response:
0.7
µs
maximum propagation delay
over temperature range
• Ultra high CMR:
minimum 10 kV/µs at V
CM
= 1 kV
• Bootstrappable supply current:
maximum 3 mA
• Wide operating temperature
range: –40°C to 100°C
• Wide V
CC
operating range:
10 V to 30 V over temp. range
• Available in DIP8 and SO8
package
• Safety approvals: UL approval,
3750 V
rms
for 1 minute. CSA
approval. IEC/EN/DIN EN 60747-5-2
approval V
IORM
= 630 V
peak
(HCPL-
3140)
Applications
•
Isolated IGBT/Power MOSFET
gate drive
•
AC and brushless DC motor drives
•
Inverters for home appliances
•
Industrial inverters
•
Switch Mode Power Supplies
(SMPS)
A 0.1
µF
bypass capacitor must be connected between pins V
CC
and V
EE
.
CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to prevent damage
and/or degradation which may be induced by ESD.
Ordering Information
Specify part number followed by option number (if desired).
Example:
HCPL-3140#XXXX
No option = Standard DIP package, 50 per tube.
300 = Gull Wing Surface Mount Option, 50 per tube.
500 = Tape and Reel Packaging Option.
060 = IEC/EN/DIN EN 60747-5-2, V
IORM
= 630 V
PEAK
.
XXXE = Lead Free Option.
HCPL-0314#XXXX
No option = SOIC-8 surface mount in tube, 100 per tube.
500 = Tape and Reel Packaging Option.
060 = IEC/EN/DIN EN 60747-5-2, V
IORM
= 566 V
PEAK
.
XXXE = Lead Free Option.
Remarks: The notation “#” is used for existing products, while (new) products launched since 15th July
2001 and lead free option will use “-”
Package Outline Drawings
HCPL-3140 Standard DIP Package
9.65 ± 0.25
(0.380 ± 0.010)
TYPE NUMBER
8
7
6
5
7.62 ± 0.25
(0.300 ± 0.010)
6.35 ± 0.25
(0.250 ± 0.010)
OPTION CODE*
DATE CODE
A XXXXZ
YYWW RU
1
1.19 (0.047) MAX.
2
3
4
UL
RECOGNITION
1.78 (0.070) MAX.
+ 0.076
0.254 - 0.051
+ 0.003)
(0.010 - 0.002)
5° TYP.
3.56 ± 0.13
(0.140 ± 0.005)
4.70 (0.185) MAX.
0.51 (0.020) MIN.
2.92 (0.115) MIN.
1.080 ± 0.320
(0.043 ± 0.013)
0.65 (0.025) MAX.
2.54 ± 0.25
(0.100 ± 0.010)
DIMENSIONS IN MILLIMETERS AND (INCHES).
* MARKING CODE LETTER FOR OPTION NUMBERS
"V" = OPTION 060
OPTION NUMBERS 300 AND 500 NOT MARKED.
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
2
HCPL-3140 Gull Wing Surface Mount Option 300 Outline Drawing
LAND PATTERN RECOMMENDATION
9.65 ± 0.25
(0.380 ± 0.010)
8
7
6
5
1.016 (0.040)
6.350 ± 0.25
(0.250 ± 0.010)
10.9 (0.430)
1
2
3
4
1.27 (0.050)
2.0 (0.080)
1.19
(0.047)
MAX.
1.780
(0.070)
MAX.
9.65 ± 0.25
(0.380 ± 0.010)
7.62 ± 0.25
(0.300 ± 0.010)
+ 0.076
0.254 - 0.051
+ 0.003)
(0.010 - 0.002)
3.56 ± 0.13
(0.140 ± 0.005)
1.080 ± 0.320
(0.043 ± 0.013)
0.635 ± 0.130
2.54
(0.025 ± 0.005)
(0.100)
BSC
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
0.635 ± 0.25
(0.025 ± 0.010)
12° NOM.
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
HCPL-0314 Small Outline SO-8 Package
LAND PATTERN RECOMMENDATION
8
7
6
5
3.937 ± 0.127
(0.155 ± 0.005)
XXX
YWW
5.994 ± 0.203
(0.236 ± 0.008)
TYPE NUMBER
(LAST 3 DIGITS)
DATE CODE
4
7.49 (0.295)
PIN ONE
1
0.406 ± 0.076
(0.016 ± 0.003)
2
3
1.9 (0.075)
1.270 BSC
(0.050)
0.64 (0.025)
*
5.080 ± 0.127
(0.200 ± 0.005)
7°
45° X
0.432
(0.017)
3.175 ± 0.127
(0.125 ± 0.005)
0 ~ 7°
1.524
(0.060)
0.203 ± 0.102
(0.008 ± 0.004)
0.228 ± 0.025
(0.009 ± 0.001)
*
TOTAL PACKAGE LENGTH (INCLUSIVE OF MOLD FLASH)
5.207 ± 0.254 (0.205 ± 0.010)
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES) MAX.
0.305 MIN.
(0.012)
NOTE: FLOATING LEAD PROTRUSION IS 0.15 mm (6 mils) MAX.
3
Solder Reflow Temperature Profile
300
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.
PEAK
TEMP.
245°C
PEAK
TEMP.
240°C
PEAK
TEMP.
230°C
2.5°C ± 0.5°C/SEC.
160°C
150°C
140°C
3°C + 1°C/–0.5°C
30
SEC.
30
SEC.
SOLDERING
TIME
200°C
TEMPERATURE (°C)
200
Regulatory Information
The HCPL-3140/HCPL-0314 have
been approved by the following
organizations:
IEC/EN/DIN EN 60747-5-2
Approved under:
IEC 60747-5-2:1997 + A1:2002
EN 60747-5-2:2001 + A1:2002
DIN EN 60747-5-2 (VDE 0884
Teil 2):2003-01
(Option 060 only)
UL
Approval under UL 1577,
component recognition program
up to V
ISO
= 2500 V
rms
. File
E55361.
CSA
Approval under CSA Component
Acceptance Notice #5, File CA
88324.
100
PREHEATING TIME
150°C, 90 + 30 SEC.
50 SEC.
TIGHT
TYPICAL
LOOSE
ROOM
TEMPERATURE
0
0
50
100
150
200
250
TIME (SECONDS)
Recommended Pb-Free IR Profile
t
p
T
p
T
L
TEMPERATURE
T
smax
T
smin
t
s
PREHEAT
60 to 180 SEC.
25
t 25 °C to PEAK
TIME
NOTES:
THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX.
T
smax
= 200 °C, T
smin
= 150 °C
t
L
60 to 150 SEC.
260 +0/-5 °C
217 °C
RAMP-UP
3 °C/SEC. MAX.
150 - 200 °C
RAMP-DOWN
6 °C/SEC. MAX.
TIME WITHIN 5 °C of ACTUAL
PEAK TEMPERATURE
20-40 SEC.
IEC/EN/DIN EN 60747-5-2 Insulation Characteristics (HCPL-3140 Option 060)
Description
Installation classification per DIN VDE 0110/1.89, Table 1
for rated mains voltage
≤
150 V
rms
for rated mains voltage
≤
300 V
rms
for rated mains voltage
≤
600 V
rms
Climatic Classification
Pollution Degree (DIN VDE 0110/1.89)
Maximum Working Insulation Voltage
Input to Output Test Voltage, Method b*
V
IORM
x 1.875=V
PR
, 100% Production Test with
t
m
=1 sec, Partial discharge < 5 pC
Input to Output Test Voltage, Method a*
V
IORM
x 1.5=V
PR
, Type and Sample Test, t
m
=60 sec,
Partial discharge < 5 pC
Highest Allowable Overvoltage
(Transient Overvoltage t
ini
= 10 sec)
Safety-limiting values - maximum values allowed in the
event of a failure.
Case Temperature
Input Current**
Output Power**
Insulation Resistance at T
S
, V
IO
= 500 V
V
IORM
V
PR
Symbol
Characteristic
I - IV
I - III
I-II
55/100/21
2
630
1181
V
peak
V
peak
Unit
V
PR
V
IOTM
945
6000
V
peak
V
peak
T
S
I
S,INPUT
P
S, OUTPUT
R
S
175
230
600
>10
9
°C
mA
mW
Ω
* Refer to the optocoupler section of the Isolation and Control Components Designer’s Catalog, under Product Safety Regulations section IEC/EN/
DIN EN 60747-5-2 for a detailed description of Method a and Method b partial discharge test profiles.
** Refer to the following figure for dependence of P
S
and I
S
on ambient temperature.
4
OUTPUT POWER – P
S
, INPUT CURRENT – I
S
800
700
600
500
400
300
200
100
0
0
25
50
75 100 125 150 175 200
P
S
(mW)
I
S
(mA)
T
S
– CASE TEMPERATURE – °C
Insulation
and Safety Related Specifications
Parameter
Minimum External Air Gap
(Clearance)
Minimum External Tracking
(Creepage)
Minimum Internal Plastic Gap
(Internal Clearance)
Symbol
L(101)
HCPL-3140
7.1
HCPL-0314
4.9
Units
mm
Conditions
Measured from input terminals
to output terminals, shortest
distance through air.
Measured from input terminals
to output terminals, shortest
distance path along body.
Through insulation distance
conductor to conductor, usually
the straight line distance
thickness between the emitter
and detector.
DIN IEC 112/VDE 0303 Part 1
Material Group (DIN VDE
0110, 1/89, Table 1)
L(102)
7.4
4.8
mm
0.08
0.08
mm
Tracking Resistance
(Comparative Tracking Index)
Isolation Group
CTI
>175
IIIa
>175
IIIa
V
Absolute Maximum Ratings
Parameter
Storage Temperature
Operating Temperature
Average Input Current
Peak Transient Input Current (<1
µs
pulse
width, 300pps)
Reverse Input Voltage
“High” Peak Output Current
“Low” Peak Output Current
Supply Voltage
Output Voltage
Output Power Dissipation
Input Power Dissipation
Lead Solder Temperature
Solder Reflow Temperature Profile
Symbol
T
S
T
A
I
F(AVG)
I
F(TRAN)
V
R
I
OH(PEAK)
I
OL(PEAK)
V
CC
-V
EE
V
O(PEAK)
P
O
P
I
-0.5
-0.5
Min.
-55
-40
Max.
125
100
25
1.0
5
0.6
0.6
35
V
CC
250
105
Units
°C
°C
mA
A
V
A
A
V
V
mW
mW
3
4
2
2
1
Note
260°C for 10 sec., 1.6 mm below seating plane
See Package Outline Drawings section
5
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