2N3819
2N3819
N-Channel RF Amplifier
• This device is designed for RF amplifier and mixer applications
operating up to 450MHz, and for analog switching requiring low
capacitance.
• Sourced from process 50.
TO-92
1
1. Drain 2. Gate 3. Source
Epitaxial Silicon Transistor
Absolute Maximum Ratings*
T
C
=25°C unless otherwise noted
Symbol
V
DG
V
GS
I
D
I
GF
T
STG
Drain-Gate Voltage
Gate-Source Voltage
Drain Current
Forward Gate Current
Storage Temperature Range
Parameter
Ratings
25
-25
50
10
-55 ~ 150
Units
V
V
mA
mA
°C
* This ratings are limiting values above which the serviceability of any semiconductor device may be impaired.
NOTES:
1) These rating are based on a maximum junction temperature of 150 degrees C.
2) These are steady limits. The factory should be consulted on applications involving pulsed or low duty cycle operations.
Electrical Characteristics
T
C
=25°C unless otherwise noted
Symbol
Off Characteristics
V
(BR)GSS
I
GSS
V
GS
(off)
V
GS
I
DSS
gfs
goss
y
fs
C
iss
C
rss
Parameter
Test Condition
I
G
= 1.0µA, V
DS
= 0
V
GS
= -15V, V
DS
= 0
V
DS
= 15V, I
D
= 2.0nA
V
DS
= 15V, I
D
= 200µA
V
DS
= 15V, V
GS
= 0
V
DS
= 15V, V
GS
= 0, f = 1.0KHz
V
DS
= 15V, V
GS
= 0, f = 1.0KHz
V
DS
= 15V, V
GS
= 0, f = 1.0KHz
V
DS
= 15V, V
GS
= 0, f = 1.0KHz
V
DS
= 15V, V
GS
= 0, f = 1.0KHz
1600
8.0
4.0
-0.5
2.0
2000
Min.
25
2.0
8.0
-7.5
20
6500
50
Typ.
Max.
Units
V
nA
V
V
mA
µmhos
µmhos
µmhos
pF
pF
Gate-Source Breakdwon Voltage
Gate Reverse Current
Gate-Source Cutoff Voltage
Gate-Source Voltage
Zero-Gate Voltage Drain Current
Forward Transfer Conductance
Output Conductance
Forward Transfer Admittance
Input Capacitance
Reverse Transfer Capacitance
On Characteristics
Small Signal Characteristics
Thermal Characteristics
T
A
=25°C unless otherwise noted
Symbol
P
D
R
θJC
R
θJA
Parameter
Total Device Dissipation
Derate above 25°C
Thermal Resistance, Junction to Case
Thermal Resistance, Junction to Ambient
Max.
350
2.8
125
357
Units
mW
mW/°C
°C/W
°C/W
* Device mounted on FR-4 PCB 1.5”
×
1.6”
×
0.06”
©2002 Fairchild Semiconductor Corporation
Rev. A1, December 2002
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DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR
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As used herein:
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the body,
or (b) support or sustain life, or (c) whose failure to perform
when properly used in accordance with instructions for use
provided in the labeling, can be reasonably expected to
result in significant injury to the user.
2. A critical component is any component of a life support
device or system whose failure to perform can be
reasonably expected to cause the failure of the life support
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PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification
Advance Information
Product Status
Formative or In
Design
First Production
Definition
This datasheet contains the design specifications for
product development. Specifications may change in
any manner without notice.
This datasheet contains preliminary data, and
supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice in order to improve
design.
This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at
any time without notice in order to improve design.
This datasheet contains specifications on a product
that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.
Preliminary
No Identification Needed
Full Production
Obsolete
Not In Production
©2002 Fairchild Semiconductor Corporation
Rev. I1
stm32/stm8
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