N25Q128A13ESEC0G,N25Q128A13ESEC0G pdf中文资料,N25Q128A13ESEC0G引脚图,N25Q128A13ESEC0G电路-Datasheet-电子工程世界

Datasheet> 器件分类 > 半导体> 存储器> N25Q128A13ESEC0G

N25Q128A13ESEC0G: 产品描述FLASH - NOR 存储器 IC 128Mb SPI 108 MHz 8-SOP2; 产品类别半导体存储器; 文件大小1MB，共83页; 制造商Micron Technology; 官网地址http://www.mdtic.com.tw/; 标准

下载文档详细参数全文预览

N25Q128A13ESEC0G概述

FLASH - NOR 存储器 IC 128Mb SPI 108 MHz 8-SOP2

N25Q128A13ESEC0G规格参数

参数名称	属性值
类别
厂商名称	Micron Technology
包装	管件
存储器类型	非易失
存储器格式	闪存
技术	FLASH - NOR
存储容量	128Mb
存储器组织	32M x 4
存储器接口	SPI
时钟频率	108 MHz
写周期时间 - 字，页	8ms，5ms
电压 - 供电	2.7V ~ 3.6V
工作温度	-40°C ~ 85°C（TA）
安装类型	表面贴装型
封装/外壳	8-SOIC（0.209"，5.30mm 宽）
供应商器件封装	8-SOP2
基本产品编号	N25Q128A13

文档预览

下载PDF文档

全文
预览

128Mb, 3V, Multiple I/O Serial Flash Memory

Features

Micron Serial NOR Flash Memory

3V, Multiple I/O, 4KB Sector Erase

N25Q128A

Features

•

SPI-compatible serial bus interface

108 MHz (MAX) clock frequency

2.7–3.6V single supply voltage

Dual/quad I/O instruction provides increased

throughput up to 432 MHz

Supported protocols

– Extended SPI, dual I/O, and quad I/O

Execute-in-place (XIP) mode for all three protocols

– Configurable via volatile or nonvolatile registers

– Enables memory to work in XIP mode directly af-

ter power-on

PROGRAM/ERASE SUSPEND operations

Continuous read of entire memory via a single com-

mand

– Fast read

– Quad or dual output fast read

– Quad or dual I/O fast read

Flexible to fit application

– Configurable number of dummy cycles

– Output buffer configurable

Software reset

64-byte, user-lockable, one-time programmable

(OTP) dedicated area

Erase capability

– Subsector erase 4KB uniform granularity blocks

– Sector erase 64KB uniform granularity blocks

– Full-chip erase

• Write protection

– Software write protection applicable to every

64KB sector via volatile lock bit

– Hardware write protection: protected area size

defined by five nonvolatile bits (BP0, BP1, BP2,

BP3, and TB)

– Additional smart protections, available upon re-

quest

• Electronic signature

– JEDEC-standard 2-byte signature (BA18h)

– Unique ID code (UID): 17 read-only bytes, in-

cluding:

• Two additional extended device ID (EDID)

bytes to identify device factory options

• Customized factory data (14 bytes)

• Minimum 100,000 ERASE cycles per sector

• More than 20 years data retention

• Packages JEDEC standard, all RoHS compliant

– F7 = V-PDFN-8 6mm x 5mm Sawn (MLP8 6mm x

5mm)

– F8 = V-PDFN-8 8mm x 6mm (MLP8 8mm x 6mm)

– 12 = T-PBGA-24b05 6mm x 8mm

– 14 = T-PBGA-24b05 6mm x 8mm, 4x6 ball array

– SF = SOP2-16 300 mils body width (SO16W)

– SE = SOP2-8 208 mils body width (SO8W)

•

09005aef845665fe

n25q_128mb_3v_65nm.pdf - Rev. T 02/18 EN

Products and specifications discussed herein are subject to change by Micron without notice.

Micron Technology, Inc. reserves the right to change products or specifications without notice.

128Mb, 3V, Multiple I/O Serial Flash Memory

Features

Contents

Important Notes and Warnings ......................................................................................................................... 6

Device Description ........................................................................................................................................... 7

Features ....................................................................................................................................................... 7

Operating Protocols ...................................................................................................................................... 7

XIP Mode ..................................................................................................................................................... 7

Device Configurability .................................................................................................................................. 8

Signal Assignments ........................................................................................................................................... 9

Signal Descriptions ......................................................................................................................................... 11

Memory Organization .................................................................................................................................... 13

Memory Configuration and Block Diagram .................................................................................................. 13

Memory Map – 128Mb Density ....................................................................................................................... 14

Device Protection ........................................................................................................................................... 15

Serial Peripheral Interface Modes .................................................................................................................... 17

SPI Protocols .................................................................................................................................................. 20

Nonvolatile and Volatile Registers ................................................................................................................... 21

Status Register ............................................................................................................................................ 22

Nonvolatile and Volatile Configuration Registers .......................................................................................... 23

Enhanced Volatile Configuration Register .................................................................................................... 26

Flag Status Register ..................................................................................................................................... 27

Command Definitions .................................................................................................................................... 29

READ REGISTER and WRITE REGISTER Operations ........................................................................................ 31

READ STATUS REGISTER or FLAG STATUS REGISTER Command ................................................................ 31

READ NONVOLATILE CONFIGURATION REGISTER Command ................................................................... 31

READ VOLATILE or ENHANCED VOLATILE CONFIGURATION REGISTER Command .................................. 32

WRITE STATUS REGISTER Command ......................................................................................................... 32

WRITE NONVOLATILE CONFIGURATION REGISTER Command ................................................................. 33

WRITE VOLATILE or ENHANCED VOLATILE CONFIGURATION REGISTER Command ................................. 33

READ LOCK REGISTER Command .............................................................................................................. 34

WRITE LOCK REGISTER Command ............................................................................................................ 35

CLEAR FLAG STATUS REGISTER Command ................................................................................................ 36

READ IDENTIFICATION Operations ............................................................................................................... 37

READ ID and MULTIPLE I/O READ ID Commands ...................................................................................... 37

READ SERIAL FLASH DISCOVERY PARAMETER Command ......................................................................... 38

READ MEMORY Operations ............................................................................................................................ 41

PROGRAM Operations .................................................................................................................................... 45

WRITE Operations .......................................................................................................................................... 49

WRITE ENABLE Command ......................................................................................................................... 49

WRITE DISABLE Command ........................................................................................................................ 49

ERASE Operations .......................................................................................................................................... 51

SUBSECTOR ERASE Command ................................................................................................................... 51

SECTOR ERASE Command ......................................................................................................................... 51

BULK ERASE Command ............................................................................................................................. 52

PROGRAM/ERASE SUSPEND Command ..................................................................................................... 53

PROGRAM/ERASE RESUME Command ...................................................................................................... 55

ONE TIME PROGRAMMABLE Operations ....................................................................................................... 56

READ OTP ARRAY Command ...................................................................................................................... 56

PROGRAM OTP ARRAY Command .............................................................................................................. 56

XIP Mode ....................................................................................................................................................... 58

Activate or Terminate XIP Using Volatile Configuration Register ................................................................... 58

Activate or Terminate XIP Using Nonvolatile Configuration Register ............................................................. 58

09005aef845665fe

n25q_128mb_3v_65nm.pdf - Rev. T 02/18 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

128Mb, 3V, Multiple I/O Serial Flash Memory

Features

Confirmation Bit Settings Required to Activate or Terminate XIP ..................................................................

Terminating XIP After a Controller and Memory Reset .................................................................................

Power-Up and Power-Down ............................................................................................................................

Power-Up and Power-Down Requirements ..................................................................................................

Power Loss Rescue Sequence ......................................................................................................................

AC Reset Specifications ...................................................................................................................................

Absolute Ratings and Operating Conditions .....................................................................................................

DC Characteristics and Operating Conditions ..................................................................................................

AC Characteristics and Operating Conditions – Standard .................................................................................

AC Characteristics and Operating Conditions – Enhanced ................................................................................

Package Dimensions .......................................................................................................................................

Part Number Ordering Information .................................................................................................................

Revision History .............................................................................................................................................

Rev. T – 02/2018 ..........................................................................................................................................

Rev. S – 11/2014 ..........................................................................................................................................

Rev. R - 07/2014 ..........................................................................................................................................

Rev. Q – 05/2014 .........................................................................................................................................

Rev. P – 06/2013 ..........................................................................................................................................

Rev. O – 04/2013 .........................................................................................................................................

Rev. N – 01/2013 .........................................................................................................................................

Rev. M – 07/2012 ........................................................................................................................................

Rev. L – 06/2012 ..........................................................................................................................................

Rev. K – 02/2012 .........................................................................................................................................

Rev. J – 12/2011 ..........................................................................................................................................

Rev. I – 10/2011 ..........................................................................................................................................

Rev. H – 08/2011 .........................................................................................................................................

Rev. G – 08/2011 .........................................................................................................................................

Rev. F – 02/2011 ..........................................................................................................................................

Rev. E – 01/2011 ..........................................................................................................................................

Rev. D – 10/2010 .........................................................................................................................................

Rev. C – 02/2010 .........................................................................................................................................

Rev. B – 05/2009 .........................................................................................................................................

Rev. A – 01/2009 ..........................................................................................................................................

09005aef845665fe

n25q_128mb_3v_65nm.pdf - Rev. T 02/18 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

128Mb, 3V, Multiple I/O Serial Flash Memory

Features

List of Figures

Figure 1: Logic Diagram ................................................................................................................................... 8

Figure 2: 8-Pin, VDFPN8 – MLP8 and SOP2 – SO8W (Top View) ......................................................................... 9

Figure 3: 16-Pin, Plastic Small Outline – SO16 (Top View) .................................................................................. 9

Figure 4: 24-Ball TBGA (Balls Down) .............................................................................................................. 10

Figure 5: 24-Ball TBGA , 4x6 (Balls Down) ....................................................................................................... 10

Figure 6: Block Diagram ................................................................................................................................ 13

Figure 7: Bus Master and Memory Devices on the SPI Bus ............................................................................... 18

Figure 8: Bus Master and Memory Devices on the SPI Bus ............................................................................... 19

Figure 9: SPI Modes ....................................................................................................................................... 19

Figure 10: Internal Configuration Register ...................................................................................................... 21

Figure 11: READ REGISTER Command .......................................................................................................... 31

Figure 12: WRITE REGISTER Command ......................................................................................................... 33

Figure 13: READ LOCK REGISTER Command ................................................................................................. 35

Figure 14: WRITE LOCK REGISTER Command ............................................................................................... 36

Figure 15: READ ID and MULTIPLE I/O Read ID Commands .......................................................................... 38

Figure 16: READ Command ........................................................................................................................... 42

Figure 17: FAST READ Command ................................................................................................................... 42

Figure 18: DUAL OUTPUT FAST READ ........................................................................................................... 43

Figure 19: DUAL INPUT/OUTPUT FAST READ Command .............................................................................. 43

Figure 20: QUAD OUTPUT FAST READ Command ......................................................................................... 44

Figure 21: QUAD INPUT/OUTPUT FAST READ Command ............................................................................. 44

Figure 22: PAGE PROGRAM Command .......................................................................................................... 46

Figure 23: DUAL INPUT FAST PROGRAM Command ...................................................................................... 46

Figure 24: EXTENDED DUAL INPUT FAST PROGRAM Command ................................................................... 47

Figure 25: QUAD INPUT FAST PROGRAM Command ..................................................................................... 47

Figure 26: EXTENDED QUAD INPUT FAST PROGRAM Command ................................................................... 48

Figure 27: WRITE ENABLE and WRITE DISABLE Command Sequence ............................................................ 50

Figure 28: SUBSECTOR and SECTOR ERASE Command .................................................................................. 52

Figure 29: BULK ERASE Command ................................................................................................................ 53

Figure 30: READ OTP Command .................................................................................................................... 56

Figure 31: PROGRAM OTP Command ............................................................................................................ 57

Figure 32: XIP Mode Directly After Power-On .................................................................................................. 58

Figure 33: Power-Up Timing .......................................................................................................................... 60

Figure 34: Reset AC Timing During PROGRAM or ERASE Cycle ........................................................................ 63

Figure 35: Reset Enable ................................................................................................................................. 63

Figure 36: Serial Input Timing ........................................................................................................................ 63

Figure 37: Write Protect Setup and Hold During WRITE STATUS REGISTER Operation (SRWD = 1) ................... 64

Figure 38: Hold Timing .................................................................................................................................. 65

Figure 39: Output Timing .............................................................................................................................. 66

Figure 40: V

PPH

Timing .................................................................................................................................. 66

Figure 41: AC Timing Input/Output Reference Levels ...................................................................................... 68

Figure 42: V-PDFN-8 6mm x 5mm Sawn (MLP8) – Package Code: F7 ................................................................ 73

Figure 43: V-PDFN-8 8mm x 6mm (MLP8) – Package Code: F8 ........................................................................ 74

Figure 44: T-PBGA-24b05 6mm x 8mm – Package Code: 12 .............................................................................. 75

Figure 45: T-PBGA-24b05 6mm x 8mm – Package Code: 14 .............................................................................. 76

Figure 46: SOP2-16 (300 mils body width) – Package Code: SF ......................................................................... 77

Figure 47: SOP2-8 (208 mils body width) – Package Code: SE ........................................................................... 78

09005aef845665fe

n25q_128mb_3v_65nm.pdf - Rev. T 02/18 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

128Mb, 3V, Multiple I/O Serial Flash Memory

Features

List of Tables

Table 1: Signal Descriptions ...........................................................................................................................

Table 2: Sectors[255:0] ...................................................................................................................................

Table 3: Data Protection using Device Protocols .............................................................................................

Table 4: Memory Sector Protection Truth Table ..............................................................................................

Table 5: Protected Area Sizes – Upper Area .....................................................................................................

Table 6: Protected Area Sizes – Lower Area ......................................................................................................

Table 7: SPI Modes ........................................................................................................................................

Table 8: Extended, Dual, and Quad SPI Protocols ............................................................................................

Table 9: Status Register Bit Definitions ...........................................................................................................

Table 10: Nonvolatile Configuration Register Bit Definitions ...........................................................................

Table 11: Volatile Configuration Register Bit Definitions ..................................................................................

Table 12: Sequence of Bytes During Wrap .......................................................................................................

Table 13: Supported Clock Frequencies ..........................................................................................................

Table 14: Enhanced Volatile Configuration Register Bit Definitions ..................................................................

Table 15: Flag Status Register Bit Definitions ..................................................................................................

Table 16: Command Set .................................................................................................................................

Table 17: Lock Register ..................................................................................................................................

Table 18: Data/Address Lines for READ ID and MULTIPLE I/O READ ID Commands .......................................

Table 19: Read ID Data Out ............................................................................................................................

Table 20: Extended Device ID, First Byte .........................................................................................................

Table 21: Serial Flash Discovery Parameter – Header Structure ........................................................................

Table 22: Parameter ID ..................................................................................................................................

Table 23: Command/Address/Data Lines for READ MEMORY Commands .......................................................

Table 24: Data/Address Lines for PROGRAM Commands ................................................................................

Table 25: Suspend Parameters .......................................................................................................................

Table 26: Operations Allowed/Disallowed During Device States ......................................................................

Table 27: OTP Control Byte (Byte 64) ..............................................................................................................

Table 28: XIP Confirmation Bit .......................................................................................................................

Table 29: Effects of Running XIP in Different Protocols ....................................................................................

Table 30: Power-Up Timing and V

Threshold ...............................................................................................

Table 31: AC RESET Conditions ......................................................................................................................

Table 32: Absolute Ratings .............................................................................................................................

Table 33: Operating Conditions ......................................................................................................................

Table 34: Input/Output Capacitance ..............................................................................................................

Table 35: AC Timing Input/Output Conditions ...............................................................................................

Table 36: DC Current Characteristics and Operating Conditions ......................................................................

Table 37: DC Voltage Characteristics and Operating Conditions ......................................................................

Table 38: AC Characteristics and Operating Conditions – Standard Specifications ............................................

Table 39: AC Characteristics and Operating Conditions – Enhanced Specifications ..........................................

Table 40: Part Number Information ................................................................................................................

Table 41: Package Details ...............................................................................................................................

09005aef845665fe

n25q_128mb_3v_65nm.pdf - Rev. T 02/18 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

推荐资源

胆机TDA1541NOS DAC--2电路图

带自锁的双向转换开关典型电路

wince 中能不能支持.3ds 和.obj 格式: wince 中能不能支持Autodesk 公司的 .3ds和 Wavefront公司.obj格式谢谢...; 1200324 嵌入式系统

LCD显示: 写了一个测温度的程序，隔2S测一次。所以温度的值是变化的。希望显示的效果是：“Temp is XX”。我现在设置的是先显示字符串“Temp is“，再计算温度并一个字符一个字符的显示。有没有办法用一 ......; jinger0311 微控制器 MCU

关于aduc7026（ARM7）一直进中断的问题: 我用keil+ULINK调的aduc7026，一块板子没问题，另一块板子还没跳进main，就一直往中断的handler里跳，程序和设置都一样，就是硬件有些不同？这会是什么原因？ PLL？不能正常reset ？谁有遇到 ......; asdfgghjkllpo ARM技术

28035can通讯中断问题，论坛新人求大神帮助啊: 小弟开始做28035can通讯的内容。出了一些问题，求各位大神赐教。我打开自测试模式下测试软件。软件发送模块的ＴＡｎ位置位没问题，软件也运行过去了，但是ＴＸ引脚没有任何信号。软件也无法 ......; 黑旋风马内 DSP 与 ARM 处理器

给大家分享一个有关嵌入式开发的一个很好的网站。: http://www.cnemb.com/...; luxiaoyu_sdc 嵌入式系统

拆解西数 WD Elements 移动硬盘: 本来周末预备修修收音机的，但是因为一些事情耽误了。正好因为需要试一个SSD硬盘，却一时找不到硬盘盒，正好有一个西数 WD Elements 500G移动硬盘，就想把它拆开换成SSD试试行不行。移 ......; dcexpert DIY/开源硬件专区

AI“三重境界”：芯片、智慧系统和AI应用

　　随着人类对人工智能研究的不断深入， AI 已然成为当下智能产品研发的主流趋势。但是手机行业出现了一个怪现象，即三类“跟风式” AI ：即算力无本质提升的包装式 AI 、功能无实质落地的炒作式AI、缺乏生态建设的封闭式AI。下面就随嵌入式小编一起来了解一下相关内容吧。　　未来真正的AI手机应该能够在各个领域缩短我们跟专家的差距。而AI荣耀手机核心战略就是人脑协处理器，缩短普通人与专家距离。...[详细]
55亿晶体管的麒麟970为何被30亿晶体管的骁龙835吊打？

　　关于处理器的构架，这里不提，因为太抽象，直接比较二者的CPU和GPU是最好不过了，这也是区分二者处理性能的最佳标准和最佳方法。麒麟970 处理器，华为自主研发并发布的最新一代高端处理器手机芯片，根据介绍，这是第一款拥有人工智能的芯片，自然而然，这款处理器达到了55亿晶体管也不是没有道理的，所以晶体管数量也就超过了同时期的骁龙835 芯片。下面就随手机便携小编一起来了解一下相关内容吧。 ...[详细]
台积电力压三星英特尔，拿下苹果订单的秘密武器

原标题：一个“小媳妇部门”成为台积电力压三星英特尔，拿下苹果订单的秘密武器为达成一个被视为“根本不可能成功”的任务，他受命负责一个“小媳妇部门”，9年后，竟成为台积力压三星、英特尔的秘密武器。 2017年11月21日上午，台积电董事长张忠谋出现在台湾地区“总统府”。他很难得的坐在台下当配角，看着部属、台积研发副总余振华从“总统”蔡英文手中领奖，边鼓掌。这是台湾地区科学领域最高荣耀...[详细]
车云五周年暨车云研究院献词

世界如此喧嚣，真相不会不辩自明，总要有人去探寻啊。从2013年4月15日成立，今天是车云的第五个生日。过去五年，车云所关注的汽车科技变革堪称21世纪人类最壮观的实验场之一，我们有幸身逢其时，成为一名参与者和记录者。但我们时常也会陷入另一种自省：人们对信息的汲取变得速食粗略，阅读取向变得轻浮琐碎，新闻就如同一粒喧嚣的尘土，易碎易逝。而汽车行业是如此的复杂深刻又充满裂变，快速生产的新闻很...[详细]
HB型混合式步进电机的结构和工作原理详解

混合式步进电机分三种：永磁式（PM），反应式（VR）和混合式（HB）。反应式步进一般为两相，转矩和体积较小，步进角一般为7.5度或1.5度；永磁式步进一般为三相，可实现大转矩输出，步进角一般为1.5度，但噪声和振动都很大。在欧美等发达国家80年代已被淘汰；混合式步进是指混合了永磁式和反应式的优点。　　混合式（即HB型）步进电机有两相、三相、五相式，转子因与相数无关，而采用相同转子，本文以...[详细]
三方软件深度体验解读华为手机AI能力！

随着AI技术的发展，商业化与行业落地已成为近两年AI市场的核心。而作为全球第一大硬件入口的智能手机，AI又岂会放弃这块“肥肉”，也正在从芯片、语音、视觉等各个方面加速涌入手机入口。近期华为发布了P20智能手机，这是搭载了其自研的麒麟970 AI芯片的又一款手机。自2017年9月，华为率先在全球发布麒麟970芯片后，此前这款AI芯片已经先后落地华为Mate 10、荣耀V10等系列新品。 ...[详细]
半导体激光产业发展空间较大技术发展速度加快

　　半导体激光器是20 世纪60 年代发展起来的一种激光器，以半导体材料作为工作物质。从20 世纪70 年代末开始，半导体激光器明显向着两个方向发展，一类是以传递信息为目的的信息型激光器，另一类是以直接使用输出激光的光功率为目的的功率型激光器。下面就随嵌入式小编一起来了解一下相关内容吧。　　什么是半导体激光器　　半导体激光器是20 世纪60 年代发展起来的一种激光器，以半导体材料作为...[详细]
写在AMD锐龙2发布后：CPU生死战2.0时代将至

　　去年3月末， AMD 发布并上市了ZEN架构处理器，而其中面对消费级市场的“Ryzen”凭借优秀的表现以及较高的性价比，一经上市就抢占原本劣势的CPU市场; AMD 沉寂多年后反击的这一拳，确实打得疼!下面就随嵌入式小编一起来了解一下相关内容吧。　　1. intel 背后再一寒? 　　随后没过多久，Intel快速的发布了8代处理器，用“全民消费6核心”的理念迎击;然而上周， ...[详细]
华夏芯：中国芯如何选择未来发展路径

芯片，中国如何选择未来发展路径　　——访华夏芯（北京）通用处理器有限公司董事长李科奕　近段时间，国产芯片业的现状与发展成为网络舆论的热点，同时也引发了业界关于中国集成电路产业未来发展路径的诸多思考。　　那么，我国未来如何尽快破解“缺芯”之痛？集成电路产业实现“换道超车”的创新突破口应该如何选择？为此，记者采访了华夏芯（北京）通用处理器有限公司董事长李科奕，这家公司是中...[详细]
物联网与大数据发展刺激连网汽车安全需求

连网汽车商机正在蓬勃发展。据BI Intelligence数据显示，连网汽车汽车市场5年的年复合成长率为45%，是整体汽车市场的10倍。随着物联网与大数据技术的发展与普及，连网汽车安全特性将刺激市场需求，预期2020年全球75%的汽车将配备必要的连网硬件。 TechTarget报导，目前连网汽车价格还很高，全球联网服务营收70%来自高阶品牌，但到2022年将下降到50%，届时将让更多客户...[详细]
圣邦股份：产品综合性能品质达到国际同类产品先进水平

4月24日讯圣邦股份(300661)2017年度业绩网上说明会周二上午在全景网举行。关于公司盈利模式，董事副总经理、董事会秘书张勤介绍，公司通过设计、代工制造并销售自主知识产权的模拟集成电路芯片产品，满足终端电子产品客户对高性能、高品质模拟集成电路元器件的需求，从而获得收入和利润。公司的产品需要根据市场的需求以及客户的实际应用要求，进行有针对性的设计开发，并按照公司的技术标准委托代工厂商...[详细]
台积电调低利润预期苹果公司市值蒸发640亿美元

新浪科技讯北京时间4月25日凌晨消息，自上周五以来，苹果公司的股价累计下跌了7.1%，市值因此下降了639亿美元。此次股价下跌主要原因是，苹果重要合作伙伴台积电于上周四公布了低于华尔街期望的第二季度利润预期。　　作为世界上最大的半导体加工厂和苹果公司芯片制造合作伙伴，台积电（Taiwan Semiconductor Manufacturing）于上周四宣称其对今年第二季度的利润预...[详细]
传华为预计年底前撤出美国市场北美重心转向加拿大

在美国的处处针对后，华为也向外界传递即将撤出美国市场的信号。据《Forbes》撰稿人、咨询机构Atherton Research 副总裁兼首席分析Jean Baptiste Su 指出，美国市场已不再是华为全球战略的一部分，最新的裁员也正在进行，预计今年底会完全撤出美国。另一方面，华为并未完全放弃北美，正努力开发加拿大市场。据《The Verge》报导指出，华为已和多家加拿大电信商...[详细]
中兴通讯事件背后，“不惜一切代价发展芯片产业”的结论

背景：近日中兴通讯公司遭到美国商务部的制裁，由此引发了舆论的热烈争论。对此，著名经济学家吴敬琏表示，“不惜一切代价发展芯片产业”是危险的。吴敬琏认为，中国40年改革开放，在经济发展上取得了很大的成就。但是经济发展越是到了高的阶段，遇到的矛盾和在国际环境上需要解决的问题就越多。随后，吴敬琏提到了中美贸易冲突和中兴通讯事件。他强调，此事牵扯到对外开放是不是要继续，国内改革怎么能够更加深入，解...[详细]
小米手机海外版都将配官方版安卓

跟国外情况不同的是，国内用户使用都是Android系统的定制版，所以国产手机厂商选择出海的时候，在系统上就要做出一些调整。对于在印度市场取得出色成绩的小米，其也将对海外销售的手机，做一些调整，比如把原先的MIUI换成载谷歌官方安卓系统。有一个问题我们要搞清楚，谷歌官方安卓系统和第三方定制的开源安卓，是完全不同的操作系统和应用生态系统。在官方安卓中，谷歌提供了大量自家的应用软件和服务，...[详细]

器件捷径: L0 L1 L2 L3 L4 L5 L6 L7 L8 L9 LA LB LC LD LE LF LG LH LI LJ LK LL LM LN LO LP LQ LR LS LT LU LV LW LX LY LZ M0 M1 M2 M3 M4 M5 M6 M7 M8 M9 MA MB MC MD ME MF MG MH MI MJ MK ML MM MN MO MP MQ MR MS MT MU MV MW MX MY MZ N0 N1 N2 N3 N4 N5 N6 N7 N8 NA NB NC ND NE NF NG NH NI NJ NK NL NM NN NO NP NQ NR NS NT NU NV NX NZ O0 O1 O2 O3 OA OB OC OD OE OF OG OH OI OJ OK OL OM ON OP OQ OR OS OT OV OX OY OZ P0 P1 P2 P3 P4 P5 P6 P7 P8 P9 PA PB PC PD PE PF PG PH PI PJ PK PL PM PN PO PP PQ PR PS PT PU PV PW PX PY PZ Q1 Q2 Q3 Q4 Q5 Q6 Q8 Q9 QA QB QC QE QF QG QH QK QL QM QP QR QS QT QV QW QX QY R0 R1 R2 R3 R4 R5 R6 R7 R8 R9 RA RB RC RD RE RF RG RH RI RJ RK RL RM RN RO RP RQ RR RS RT RU RV RW RX RY RZ

热门器件

开源项目推荐更多

热门活动更多

热门文章更多

技术资料推荐更多