128Mb: x4, x8, x16 SDRAM
Features
SDR SDRAM
MT48LC32M4A2 – 8 Meg x 4 x 4 Banks
MT48LC16M8A2 – 4 Meg x 8 x 4 Banks
MT48LC8M16A2 – 2 Meg x 16 x 4 Banks
Features
• PC100- and PC133-compliant
• Fully synchronous; all signals registered on positive
edge of system clock
• Internal, pipelined operation; column address can
be changed every clock cycle
• Internal banks for hiding row access/precharge
• Programmable burst lengths (BL): 1, 2, 4, 8, or full
page
• Auto precharge, includes concurrent auto precharge
and auto refresh modes
• Self refresh modes: Standard and low power
(not available on AT devices)
• Auto Refresh
– 64ms, 4096-cycle refresh (commercial and
industrial)
– 16ms, 4096-cycle refresh (automotive)
• LVTTL-compatible inputs and outputs
• Single 3.3V ±0.3V power supply
• Plastic package – OCPL
2
– 54-pin TSOP II (400 mil)
– 54-pin TSOP II (400 mil) Pb-free
– 60-ball TFBGA (8mm x 16mm)
– 60-ball TFBGA (8mm x 16mm) Pb-
free
– 54-ball VFBGA (x16 only) (8mm x
8mm)
– 54-ball VFBGA (x16 only) (8mm x
8mm) Pb-free
• Timing – cycle time
– 7.5ns @ CL = 3 (PC133)
– 7.5ns @ CL = 2 (PC133)
– 6.0ns @ CL = 3 (x16 only)
• Self refresh
– Standard
– Low power
• Revision
• Operating temperature range
– Commercial (0˚C to +70˚C)
– Industrial (–40˚C to +85˚C)
– Automotive (–40˚C to +105˚C)
Notes:
1. Contact Micron for availability.
2. Off-center parting line.
3. Only available on Revision G.
Options
Marking
TG
P
FB
1
BB
1
F4
B4
-75
3
-7E
-6A
None
L
3
:G/:L
None
IT
AT
1
Options
• Configurations
– 32 Meg x 4 (8 Meg x 4 x 4 banks)
1
– 16 Meg x 8 (4 Meg x 8 x 4 banks)
– 8 Meg x 16 (2 Meg x 16 x 4 banks)
• Write recovery (
t
WR)
–
t
WR = 2 CLK
Table 1: Key Timing Parameters
CL = CAS (READ) latency
Speed Grade
-6A
-75
-7E
Clock
Frequency (MHz)
167
133
133
Marking
32M4
16M8
8M16
A2
Target
t
RCD-
t
RP-CL
3-3-3
3-3-3
2-2-2
t
RCD
(ns)
t
RP
(ns)
CL (ns)
18
20
15
18
20
15
18
20
15
PDF: 09005aef8091e66d
128mb_x4x8x16_sdram.pdf - Rev. V 09/14 EN
1
Products and specifications discussed herein are subject to change by Micron without notice.
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©
1999 Micron Technology, Inc. All rights reserved.
128Mb: x4, x8, x16 SDRAM
Features
Table 2: Address Table
Parameter
Configuration
Refresh count
Row addressing
Bank addressing
Column addressing
32 Meg x 4
8 Meg x 4 x 4 banks
4K
4K A[11:0]
4 BA[1:0]
2K A[9:0], A11
16 Meg x 8
4 Meg x 8 x 4 banks
4K
4K A[11:0]
4 BA[1:0]
1K A[9:0]
8 Meg x 16
2 Meg x 16 x 4 banks
4K
4K A[11:0]
4 BA[1:0]
512 A[8:0]
Table 3: 128Mb SDR Part Numbering
Part Numbers
MT48LC32M4A2TG
MT48LC32M4A2P
MT48LC16M8A2TG
MT48LC16M8A2P
MT48LC16M8A2FB
MT48LC16M8A2BB
MT48LC8M16A2TG
MT48LC8M16A2P
MT48LC8M16A2B4
MT48LC8M16A2F4
Note:
1. FBGA Device Decoder:
www.micron.com/decoder
Architecture
32 Meg x 4
32 Meg x 4
16 Meg x 8
16 Meg x 8
16 Meg x 8
16 Meg x 8
8 Meg x 16
8 Meg x 16
8 Meg x 16
16 Meg x 16
PDF: 09005aef8091e66d
128mb_x4x8x16_sdram.pdf - Rev. V 09/14 EN
2
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©
1999 Micron Technology, Inc. All rights reserved.
128Mb: x4, x8, x16 SDRAM
Features
Contents
General Description ......................................................................................................................................... 7
Automotive Temperature .............................................................................................................................. 7
Functional Block Diagrams ............................................................................................................................... 8
Pin and Ball Assignments and Descriptions ..................................................................................................... 11
Package Dimensions ....................................................................................................................................... 15
Temperature and Thermal Impedance ............................................................................................................ 18
Electrical Specifications .................................................................................................................................. 22
Electrical Specifications – I
DD
Parameters ........................................................................................................ 24
Electrical Specifications – AC Operating Conditions ......................................................................................... 26
Functional Description ................................................................................................................................... 29
Commands .................................................................................................................................................... 30
COMMAND INHIBIT .................................................................................................................................. 30
NO OPERATION (NOP) ............................................................................................................................... 31
LOAD MODE REGISTER (LMR) ................................................................................................................... 31
ACTIVE ...................................................................................................................................................... 31
READ ......................................................................................................................................................... 32
WRITE ....................................................................................................................................................... 33
PRECHARGE .............................................................................................................................................. 34
BURST TERMINATE ................................................................................................................................... 34
REFRESH ................................................................................................................................................... 35
AUTO REFRESH ..................................................................................................................................... 35
SELF REFRESH ....................................................................................................................................... 35
Truth Tables ................................................................................................................................................... 36
Initialization .................................................................................................................................................. 41
Mode Register ................................................................................................................................................ 43
Burst Length .............................................................................................................................................. 45
Burst Type .................................................................................................................................................. 45
CAS Latency ............................................................................................................................................... 47
Operating Mode ......................................................................................................................................... 47
Write Burst Mode ....................................................................................................................................... 47
Bank/Row Activation ...................................................................................................................................... 48
READ Operation ............................................................................................................................................. 49
WRITE Operation ........................................................................................................................................... 58
Burst Read/Single Write .............................................................................................................................. 65
PRECHARGE Operation .................................................................................................................................. 66
Auto Precharge ........................................................................................................................................... 66
AUTO REFRESH Operation ............................................................................................................................. 78
SELF REFRESH Operation ............................................................................................................................... 80
Power-Down .................................................................................................................................................. 82
Clock Suspend ............................................................................................................................................... 83
PDF: 09005aef8091e66d
128mb_x4x8x16_sdram.pdf - Rev. V 09/14 EN
3
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©
1999 Micron Technology, Inc. All rights reserved.
128Mb: x4, x8, x16 SDRAM
Features
List of Figures
Figure 1: 32 Meg x 4 Functional Block Diagram ................................................................................................. 8
Figure 2: 16 Meg x 8 Functional Block Diagram ................................................................................................. 9
Figure 3: 8 Meg x 16 Functional Block Diagram ............................................................................................... 10
Figure 4: 54-Pin TSOP (Top View) .................................................................................................................. 11
Figure 5: 60-Ball FBGA (TopView) .................................................................................................................. 12
Figure 6: 54-Ball VFBGA (Top View) ............................................................................................................... 13
Figure 7: 54-Pin Plastic TSOP (400 mil) ........................................................................................................... 15
Figure 8: 60-Ball TFBGA (x8 Device), 8mm x 16mm – Package Code FB/BB ...................................................... 16
Figure 9: 54-Ball VFBGA (x16 Device), 8mm x 8mm – Package Code F4/B4 ....................................................... 17
Figure 10: Example: Temperature Test Point Location, 54-Pin TSOP (Top View) ............................................... 20
Figure 11: Example: Temperature Test Point Location, 54-Ball VFBGA (Top View) ............................................ 21
Figure 12: Example: Temperature Test Point Location, 60-Ball FBGA (Top View) .............................................. 21
Figure 13: ACTIVE Command ........................................................................................................................ 31
Figure 14: READ Command ........................................................................................................................... 32
Figure 15: WRITE Command ......................................................................................................................... 33
Figure 16: PRECHARGE Command ................................................................................................................ 34
Figure 17: Initialize and Load Mode Register .................................................................................................. 42
Figure 18: Mode Register Definition ............................................................................................................... 44
Figure 19: CAS Latency .................................................................................................................................. 47
Figure 20: Example: Meeting
t
RCD (MIN) When 2 <
t
RCD (MIN)/
t
CK < 3 .......................................................... 48
Figure 21: Consecutive READ Bursts .............................................................................................................. 50
Figure 22: Random READ Accesses ................................................................................................................ 51
Figure 23: READ-to-WRITE ............................................................................................................................ 52
Figure 24: READ-to-WRITE With Extra Clock Cycle ......................................................................................... 53
Figure 25: READ-to-PRECHARGE .................................................................................................................. 53
Figure 26: Terminating a READ Burst ............................................................................................................. 54
Figure 27: Alternating Bank Read Accesses ..................................................................................................... 55
Figure 28: READ Continuous Page Burst ......................................................................................................... 56
Figure 29: READ – DQM Operation ................................................................................................................ 57
Figure 30: WRITE Burst ................................................................................................................................. 58
Figure 31: WRITE-to-WRITE .......................................................................................................................... 59
Figure 32: Random WRITE Cycles .................................................................................................................. 60
Figure 33: WRITE-to-READ ............................................................................................................................ 60
Figure 34: WRITE-to-PRECHARGE ................................................................................................................. 61
Figure 35: Terminating a WRITE Burst ............................................................................................................ 62
Figure 36: Alternating Bank Write Accesses ..................................................................................................... 63
Figure 37: WRITE – Continuous Page Burst ..................................................................................................... 64
Figure 38: WRITE – DQM Operation ............................................................................................................... 65
Figure 39: READ With Auto Precharge Interrupted by a READ ......................................................................... 67
Figure 40: READ With Auto Precharge Interrupted by a WRITE ........................................................................ 68
Figure 41: READ With Auto Precharge ............................................................................................................ 69
Figure 42: READ Without Auto Precharge ....................................................................................................... 70
Figure 43: Single READ With Auto Precharge .................................................................................................. 71
Figure 44: Single READ Without Auto Precharge ............................................................................................. 72
Figure 45: WRITE With Auto Precharge Interrupted by a READ ........................................................................ 73
Figure 46: WRITE With Auto Precharge Interrupted by a WRITE ...................................................................... 73
Figure 47: WRITE With Auto Precharge ........................................................................................................... 74
Figure 48: WRITE Without Auto Precharge ..................................................................................................... 75
Figure 49: Single WRITE With Auto Precharge ................................................................................................. 76
Figure 50: Single WRITE Without Auto Precharge ............................................................................................ 77
PDF: 09005aef8091e66d
128mb_x4x8x16_sdram.pdf - Rev. V 09/14 EN
4
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©
1999 Micron Technology, Inc. All rights reserved.
128Mb: x4, x8, x16 SDRAM
Features
Figure 51:
Figure 52:
Figure 53:
Figure 54:
Figure 55:
Figure 56:
Auto Refresh Mode ........................................................................................................................
Self Refresh Mode ..........................................................................................................................
Power-Down Mode ........................................................................................................................
Clock Suspend During WRITE Burst ...............................................................................................
Clock Suspend During READ Burst .................................................................................................
Clock Suspend Mode .....................................................................................................................
79
81
82
83
84
85
PDF: 09005aef8091e66d
128mb_x4x8x16_sdram.pdf - Rev. V 09/14 EN
5
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©
1999 Micron Technology, Inc. All rights reserved.
嵌入式系统
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
