256Mb: x8, x16 Automotive DDR SDRAM
Features
Automotive DDR SDRAM
MT46V32M8 – 8 Meg x 8 x 4 banks
MT46V16M16 – 4 Meg x 16 x 4 banks
Features
• V
DD
= 2.5V ±0.2V, V
DDQ
= 2.5V ±0.2V
V
DD
= 2.6V ±0.1V, V
DDQ
= 2.6V ±0.1V (DDR400)
1
• Bidirectional data strobe (DQS) transmitted/
received with data, that is, source-synchronous data
capture (x16 has two – one per byte)
• Internal, pipelined double-data-rate (DDR)
architecture; two data accesses per clock cycle
• Differential clock inputs (CK and CK#)
• Commands entered on each positive CK edge
• DQS edge-aligned with data for READs; center-
aligned with data for WRITEs
• DLL to align DQ and DQS transitions with CK
• Four internal banks for concurrent operation
• Data mask (DM) for masking write data
(x16 has two – one per byte)
• Programmable burst lengths (BL): 2, 4, or 8
• Auto refresh
–
64ms, 8192-cycle(AIT)
–
16ms, 8192-cycle (AAT)
• Self refresh (not available on AAT devices)
• Longer-lead TSOP for improved reliability (OCPL)
• 2.5V I/O (SSTL_2-compatible)
• Concurrent auto precharge option supported
•
t
RAS lockout supported (
t
RAP =
t
RCD)
• AEC-Q100
• PPAP submission
• 8D response time
Options
• Configuration
–
32 Meg x 8 (8 Meg x 8 x 4 banks)
–
16 Meg x 16 (4 Meg x 16 x 4 banks)
• Plastic package – OCPL
–
66-pin TSOP
–
66-pin TSOP (Pb-free)
• Plastic package
–
60-ball FBGA (8mm x 12.5mm)
–
60-ball FBGA (8mm x 12.5mm)
(Pb-free)
• Timing – cycle time
–
5ns @ CL = 3 (DDR400)
• Self refresh
–
Standard
–
Low-power self refresh
• Temperature rating
–
Industrial (–40qC to +85qC)
–
Automotive (–40qC to +105qC)
• Revision
–
x8, x16
Marking
32M8
16M16
TG
P
CV
CY
-5B
None
L
AIT
AAT
:M
Notes: 1. DDR400 devices operating at < DDR333 con-
ditions can use V
DD
/V
DDQ
= 2.5V +0.2V.
2. Not all options listed can be combined to
define an offered product. Use the Part Cata-
log Search on www.micron.com for product
offerings and availability.
PDF:09005aef848ea6ef/Source: 09005aef845d3b9c
256mb_x8x16_at_ddr_t66a_d1.fm - Rev. A; Core DDR Rev.
C 7/18EN
1
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2011 Micron Technology, Inc. All rights reserved.
Products and specifications discussed herein are subject to change by Micron without notice.
256Mb: x8, x16 Automotive DDR SDRAM
Features
Table 1:
Key Timing Parameters
CL = CAS (READ) latency; MIN clock rate with 50% duty cycle at CL = 2 (-75E, -75Z), CL = 2.5 (-6, -6T, -75), and
CL = 3 (-5B)
Clock Rate (MHz)
Speed Grade
-5B
-6
6T
-75E/-75Z
-75
CL = 2
133
133
133
133
100
CL = 2.5
167
167
167
133
133
CL = 3
200
n/a
n/a
n/a
n/a
Data-Out Window
1.6ns
2.1ns
2.0ns
2.5ns
2.5ns
Access
Window
±0.70ns
±0.70ns
±0.70ns
±0.75ns
±0.75ns
DQS–DQ
Skew
+0.40ns
+0.40ns
+0.45ns
+0.50ns
+0.50ns
Table 2:
Parameter
Addressing
32 Meg x 8
8 Meg x 8 x 4 banks
8K
8K (A[12:0])
4 (BA[1:0])
1K (A[9:0])
16 Meg x 16
4 Meg x 16 x 4 banks
8K
8K (A[12:0])
4 (BA[1:0])
512 (A[8:0])
Configuration
Refresh count
Row address
Bank address
Column address
Table 3:
Marking
-5B
1
-6
-6T
-75E
-75Z
-75
Speed Grade Compatibility
PC3200 (3-3-3) PC2700 (2.5-3-3) PC2100 (2-2-2) PC2100 (2-3-3) PC2100 (2.5-3-3) PC1600(2-2-2)
Yes
–
–
–
–
–
-5B
Notes:
Yes
Yes
Yes
–
–
–
-6/-6T
Yes
Yes
Yes
Yes
–
–
-75E
Yes
Yes
Yes
Yes
Yes
–
-75Z
Yes
Yes
Yes
Yes
Yes
Yes
-75
Yes
Yes
Yes
Yes
Yes
Yes
-75
1. The -5B device is backward compatible with all slower speed grades. The voltage range of
-5B device operating at slower speed grades is V
DD
= V
DDQ
= 2.5V ± 0.2V.
PDF:09005aef848ea6ef/Source: 09005aef845d3b9c
256mb_x8x16_at_ddr_t66a_d1.fm - Rev. A; Core DDR Rev. B 11/11 EN
2
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2011 Micron Technology, Inc. All rights reserved.
256Mb: x8, x16 Automotive DDR SDRAM
Features
Figure 1:
256Mb DDR SDRAM Part Numbers
Example Part Number: MT 4 6 V1 6 M1 6 P - 5 B A IT: M
-
MT46V
Configuration
Package
Speed
:
Sp.
Op. Temp. Revision
Revision
Configuration
32 Meg x 8
16 Meg x 16
32M8
16M16
:M
x8, x16
Operating Temperature
AIT
Automotive Industrial Temp
Package
400-mil TSOP
400-mil TSOP (Pb-free)
8mm x 12.5mm FBGA
8mm x 12.5mm FBGA (Pb-free)
TG
P
CV
CY
AAT Automotive Temp
Special Options
Standard
L
Low power
Speed Grade
-5B
tCK = 5ns, CL = 3
FBGA Part Marking System
Due to space limitations, FBGA-packaged components have an abbreviated part
marking that is different from the part number. For a quick conversion of an FBGA code,
see the FBGA Part Marking Decoder on Micron’s Web site:
www.micron.com.
PDF:09005aef848ea6ef/Source: 09005aef845d3b9c
256mb_x8x16_at_ddr_t66a_d1.fm - Rev. A; Core DDR Rev. B 11/11 EN
3
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2011 Micron Technology, Inc. All rights reserved.
256Mb: x8, x16 Automotive DDR SDRAM
Table of Contents
Table of Contents
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
FBGA Part Marking System 3
State Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5
Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6
General Notes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6
Automotive Industrial Tempature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
Automotive Tempature. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
Functional Block Diagrams. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
Pin and Ball Assignments and Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
Package Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14
Electrical Specifications – I
DD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16
Electrical Specifications – DC and AC. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17
Notes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34
Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .42
DESELECT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .46
NO OPERATION (NOP). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .46
LOAD MODE REGISTER (LMR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .46
ACTIVE (ACT) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .47
READ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .48
WRITE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .49
PRECHARGE (PRE) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .50
BURST TERMINATE (BST) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .50
AUTO REFRESH (AR). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .50
SELF REFRESH . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .50
Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .51
INITIALIZATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .51
REGISTER DEFINITION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .54
Mode Register 54
Extended Mode Register 57
ACTIVE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .58
READ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .59
WRITE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .71
PRECHARGE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .84
Auto Precharge 84
AUTO REFRESH . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .86
SELF REFRESH . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .87
Power-down (CKE Not Active) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .89
PDF:09005aef848ea6ef/Source: 09005aef845d3b9c
256mb_x8x16_at_ddr_t66aTOC.fm - Rev. A; Core DDR Rev. B 11/11 EN
4
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2011 Micron Technology, Inc. All rights reserved.
Important Notes and Warnings
Important Notes and Warnings
Micron Technology, Inc. ("Micron") reserves the right to make changes to information published in this document,
including without limitation specifications and product descriptions. This document supersedes and replaces all
information supplied prior to the publication hereof. You may not rely on any information set forth in this docu-
ment if you obtain the product described herein from any unauthorized distributor or other source not authorized
by Micron.
Automotive Applications.
Products are not designed or intended for use in automotive applications unless specifi-
cally designated by Micron as automotive-grade by their respective data sheets. Distributor and customer/distrib-
utor shall assume the sole risk and liability for and shall indemnify and hold Micron harmless against all claims,
costs, damages, and expenses and reasonable attorneys' fees arising out of, directly or indirectly, any claim of
product liability, personal injury, death, or property damage resulting directly or indirectly from any use of non-
automotive-grade products in automotive applications. Customer/distributor shall ensure that the terms and con-
ditions of sale between customer/distributor and any customer of distributor/customer (1) state that Micron
products are not designed or intended for use in automotive applications unless specifically designated by Micron
as automotive-grade by their respective data sheets and (2) require such customer of distributor/customer to in-
demnify and hold Micron harmless against all claims, costs, damages, and expenses and reasonable attorneys'
fees arising out of, directly or indirectly, any claim of product liability, personal injury, death, or property damage
resulting from any use of non-automotive-grade products in automotive applications.
Critical Applications.
Products are not authorized for use in applications in which failure of the Micron compo-
nent could result, directly or indirectly in death, personal injury, or severe property or environmental damage
("Critical Applications"). Customer must protect against death, personal injury, and severe property and environ-
mental damage by incorporating safety design measures into customer's applications to ensure that failure of the
Micron component will not result in such harms. Should customer or distributor purchase, use, or sell any Micron
component for any critical application, customer and distributor shall indemnify and hold harmless Micron and
its subsidiaries, subcontractors, and affiliates and the directors, officers, and employees of each against all claims,
costs, damages, and expenses and reasonable attorneys' fees arising out of, directly or indirectly, any claim of
product liability, personal injury, or death arising in any way out of such critical application, whether or not Mi-
cron or its subsidiaries, subcontractors, or affiliates were negligent in the design, manufacture, or warning of the
Micron product.
Customer Responsibility.
Customers are responsible for the design, manufacture, and operation of their systems,
applications, and products using Micron products. ALL SEMICONDUCTOR PRODUCTS HAVE INHERENT FAIL-
URE RATES AND LIMITED USEFUL LIVES. IT IS THE CUSTOMER'S SOLE RESPONSIBILITY TO DETERMINE
WHETHER THE MICRON PRODUCT IS SUITABLE AND FIT FOR THE CUSTOMER'S SYSTEM, APPLICATION, OR
PRODUCT. Customers must ensure that adequate design, manufacturing, and operating safeguards are included
in customer's applications and products to eliminate the risk that personal injury, death, or severe property or en-
vironmental damages will result from failure of any semiconductor component.
Limited Warranty.
In no event shall Micron be liable for any indirect, incidental, punitive, special or consequential
damages (including without limitation lost profits, lost savings, business interruption, costs related to the removal
or replacement of any products or rework charges) whether or not such damages are based on tort, warranty,
breach of contract or other legal theory, unless explicitly stated in a written agreement executed by Micron's duly
authorized representative.
PDF:09005aef848ea6ef/Source: 09005aef845d3b9c
256mb_x8x16_at_ddr_t66a_d1.fm - Rev. A; Core DDR Rev. C 7/18EN
1
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©
2018
Micron Technology, Inc. All rights reserved.
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