Datasheet> 器件分类 > 半导体> 存储器> MT47H128M16RT-25E:C TR

文档预览

MT47H128M16RT-25E:C TR: 产品描述SDRAM - DDR2 存储器 IC 2Gb 并联 400 MHz 400 ps 84-FBGA（9x12.5）; 产品类别半导体存储器; 文件大小2MB，共135页; 制造商Micron Technology; 官网地址http://www.mdtic.com.tw/; 标准

下载文档详细参数全文预览

MT47H128M16RT-25E:C TR概述

SDRAM - DDR2 存储器 IC 2Gb 并联 400 MHz 400 ps 84-FBGA（9x12.5）

MT47H128M16RT-25E:C TR规格参数

参数名称	属性值
类别
厂商名称	Micron Technology
包装	卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带
存储器类型	易失
存储器格式	DRAM
技术	SDRAM - DDR2
存储容量	2Gb
存储器组织	128M x 16
存储器接口	并联
时钟频率	400 MHz
写周期时间 - 字，页	15ns
访问时间	400 ps
电压 - 供电	1.7V ~ 1.9V
工作温度	0°C ~ 85°C（TC）
安装类型	表面贴装型
封装/外壳	84-TFBGA
供应商器件封装	84-FBGA（9x12.5）
基本产品编号	MT47H128M16

文档预览

下载PDF文档

全文
预览

2Gb: x4, x8, x16 DDR2 SDRAM

Features

DDR2 SDRAM

MT47H512M4 – 64 Meg x 4 x 8 banks

MT47H256M8 – 32 Meg x 8 x 8 banks

MT47H128M16 – 16 Meg x 16 x 8 banks

Features

•

= 1.8V ±0.1V, V

DDQ

= 1.8V ±0.1V

JEDEC-standard 1.8V I/O (SSTL_18-compatible)

Differential data strobe (DQS, DQS#) option

4n-bit prefetch architecture

Duplicate output strobe (RDQS) option for x8

DLL to align DQ and DQS transitions with CK

8 internal banks for concurrent operation

Programmable CAS latency (CL)

Posted CAS additive latency (AL)

WRITE latency = READ latency - 1

Programmable burst lengths: 4 or 8

Adjustable data-output drive strength

64ms, 8192-cycle refresh

On-die termination (ODT)

Industrial temperature (IT) option

RoHS-compliant

Supports JEDEC clock jitter specification

Options

• Configuration

– 512 Meg x 4 (64 Meg x 4 x 8 banks)

– 256 Meg x 8 (32 Meg x 8 x 8 banks)

– 128 Meg x 16 (16 Meg x 16 x 8 banks)

• FBGA package (Pb-free) – x16

– 84-ball FBGA (11.5mm x 14mm) Rev. A

• FBGA package (Pb-free) – x4, x8

– 60-ball FBGA (11.5mm x 14mm) Rev. A

• FBGA package (Pb-free) – x16

– 84-ball FBGA (9mm x 12.5mm) Rev. C

• FBGA package (Pb-free) – x4, x8

– 60-ball FBGA (9mm x 11.5mm) Rev. C

• FBGA package (Lead solder) – x16

– 84-ball FBGA (9mm x 12.5mm) Rev. C

• Timing – cycle time

– 1.875ns @ CL = 7 (DDR2-1066)

– 2.5ns @ CL = 5 (DDR2-800)

– 2.5ns @ CL = 6 (DDR2-800)

– 3.0ns @ CL = 5 (DDR2-667)

• Self refresh

– Standard

• Operating temperature

– Commercial (0°C T

+85°C)

– Industrial (–40°C T

+95°C;

–40°C T

+85°C)

• Revision

Note:

Marking

512M4

256M8

128M16

-187E

-25E

-25

-3

None

:A/:C

1. Not all options listed can be combined to

define an offered product. Use the Part

Catalog Search on

www.micron.com

for

product offerings and availability.

CCMTD-1725822587-6523

2Gb_DDR2.pdf – Rev. J 09/18 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

Products and specifications discussed herein are subject to change by Micron without notice.

2Gb: x4, x8, x16 DDR2 SDRAM

Features

Contents

Important Notes and Warnings ......................................................................................................................... 8

State Diagram .................................................................................................................................................. 9

Functional Description ................................................................................................................................... 10

Industrial Temperature ............................................................................................................................... 10

General Notes ............................................................................................................................................ 11

Functional Block Diagrams ............................................................................................................................. 12

Ball Assignments and Descriptions ................................................................................................................. 15

Packaging ...................................................................................................................................................... 19

Package Dimensions ................................................................................................................................... 19

FBGA Package Capacitance ......................................................................................................................... 23

Electrical Specifications – Absolute Ratings ..................................................................................................... 24

Temperature and Thermal Impedance ........................................................................................................ 24

Electrical Specifications – I

Parameters ........................................................................................................ 27

Specifications and Conditions ............................................................................................................... 27

DD7

Conditions .......................................................................................................................................... 27

AC Timing Operating Specifications ................................................................................................................ 33

AC and DC Operating Conditions .................................................................................................................... 45

ODT DC Electrical Characteristics ................................................................................................................... 46

Input Electrical Characteristics and Operating Conditions ............................................................................... 47

Output Electrical Characteristics and Operating Conditions ............................................................................. 50

Output Driver Characteristics ......................................................................................................................... 52

Power and Ground Clamp Characteristics ....................................................................................................... 56

AC Overshoot/Undershoot Specification ......................................................................................................... 57

Input Slew Rate Derating ................................................................................................................................ 59

Commands .................................................................................................................................................... 72

Truth Tables ............................................................................................................................................... 72

DESELECT ................................................................................................................................................. 76

NO OPERATION (NOP) ............................................................................................................................... 77

LOAD MODE (LM) ...................................................................................................................................... 77

ACTIVATE .................................................................................................................................................. 77

READ ......................................................................................................................................................... 77

WRITE ....................................................................................................................................................... 77

PRECHARGE .............................................................................................................................................. 78

REFRESH ................................................................................................................................................... 78

SELF REFRESH ........................................................................................................................................... 78

Mode Register (MR) ........................................................................................................................................ 78

Burst Length .............................................................................................................................................. 79

Burst Type .................................................................................................................................................. 80

Operating Mode ......................................................................................................................................... 80

DLL RESET ................................................................................................................................................. 80

Write Recovery ........................................................................................................................................... 81

Power-Down Mode ..................................................................................................................................... 81

CAS Latency (CL) ........................................................................................................................................ 82

Extended Mode Register (EMR) ....................................................................................................................... 83

DLL Enable/Disable ................................................................................................................................... 84

Output Drive Strength ................................................................................................................................ 84

DQS# Enable/Disable ................................................................................................................................. 84

RDQS Enable/Disable ................................................................................................................................. 84

Output Enable/Disable ............................................................................................................................... 84

On-Die Termination (ODT) ......................................................................................................................... 85

CCMTD-1725822587-6523

2Gb_DDR2.pdf – Rev. J 09/18 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

2Gb: x4, x8, x16 DDR2 SDRAM

Features

Off-Chip Driver (OCD) Impedance Calibration ............................................................................................ 85

Posted CAS Additive Latency (AL) ................................................................................................................ 85

Extended Mode Register 2 (EMR2) ................................................................................................................... 87

Extended Mode Register 3 (EMR3) ................................................................................................................... 88

Initialization .................................................................................................................................................. 89

ACTIVATE ...................................................................................................................................................... 92

READ ............................................................................................................................................................. 94

READ with Precharge .................................................................................................................................. 98

READ with Auto Precharge ......................................................................................................................... 100

WRITE .......................................................................................................................................................... 105

PRECHARGE ................................................................................................................................................. 115

REFRESH ...................................................................................................................................................... 116

SELF REFRESH .............................................................................................................................................. 117

Power-Down Mode ........................................................................................................................................ 119

Precharge Power-Down Clock Frequency Change ........................................................................................... 126

Reset ............................................................................................................................................................. 127

CKE Low Anytime ...................................................................................................................................... 127

ODT Timing .................................................................................................................................................. 129

MRS Command to ODT Update Delay ........................................................................................................ 131

CCMTD-1725822587-6523

2Gb_DDR2.pdf – Rev. J 09/18 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

2Gb: x4, x8, x16 DDR2 SDRAM

Features

List of Tables

Table 1: Key Timing Parameters ....................................................................................................................... 2

Table 2: Addressing ......................................................................................................................................... 2

Table 3: FBGA 84-Ball – x16 and 60-Ball – x4, x8 Descriptions .......................................................................... 17

Table 4: Input Capacitance ............................................................................................................................ 23

Table 5: Absolute Maximum DC Ratings ......................................................................................................... 24

Table 6: Temperature Limits .......................................................................................................................... 25

Table 7: Thermal Impedance ......................................................................................................................... 26

Table 8: General I

Parameters ..................................................................................................................... 27

Table 9: I

DD7

Timing Patterns (8-Bank Interleave READ Operation) ................................................................. 28

Table 10: DDR2 I

Specifications and Conditions (Die Revision A) ................................................................. 29

Table 11: DDR2 I

Specifications and Conditions (Die Revision C) ................................................................ 31

Table 12: AC Operating Specifications and Conditions .................................................................................... 33

Table 13: Recommended DC Operating Conditions (SSTL_18) ........................................................................ 45

Table 14: ODT DC Electrical Characteristics ................................................................................................... 46

Table 15: Input DC Logic Levels ..................................................................................................................... 47

Table 16: Input AC Logic Levels ...................................................................................................................... 47

Table 17: Differential Input Logic Levels ......................................................................................................... 48

Table 18: Differential AC Output Parameters ................................................................................................... 50

Table 19: Output DC Current Drive ................................................................................................................ 50

Table 20: Output Characteristics .................................................................................................................... 51

Table 21: Full Strength Pull-Down Current (mA) ............................................................................................. 52

Table 22: Full Strength Pull-Up Current (mA) .................................................................................................. 53

Table 23: Reduced Strength Pull-Down Current (mA) ...................................................................................... 54

Table 24: Reduced Strength Pull-Up Current (mA) .......................................................................................... 55

Table 25: Input Clamp Characteristics ............................................................................................................ 56

Table 26: Address and Control Balls ................................................................................................................ 57

Table 27: Clock, Data, Strobe, and Mask Balls ................................................................................................. 57

Table 28: AC Input Test Conditions ................................................................................................................ 57

Table 29: DDR2-400/533 Setup and Hold Time Derating Values (

IS and

IH) .................................................... 60

Table 30: DDR2-667/800/1066 Setup and Hold Time Derating Values (

IS and

IH) ........................................... 61

Table 31: DDR2-400/533

DS,

DH Derating Values with Differential Strobe ...................................................... 64

Table 32: DDR2-667/800/1066

DS,

DH Derating Values with Differential Strobe ............................................. 65

Table 33: Single-Ended DQS Slew Rate Derating Values Using

and

................................................... 66

Table 34: Single-Ended DQS Slew Rate Fully Derated (DQS, DQ at V

REF

) at DDR2-667 ...................................... 66

Table 35: Single-Ended DQS Slew Rate Fully Derated (DQS, DQ at V

REF

) at DDR2-533 ...................................... 67

Table 36: Single-Ended DQS Slew Rate Fully Derated (DQS, DQ at V

REF

) at DDR2-400 ...................................... 67

Table 37: Truth Table – DDR2 Commands ...................................................................................................... 72

Table 38: Truth Table – Current State Bank

– Command to Bank

................................................................ 73

Table 39: Truth Table – Current State Bank

– Command to Bank

............................................................... 75

Table 40: Minimum Delay with Auto Precharge Enabled ................................................................................. 76

Table 41: Burst Definition .............................................................................................................................. 80

Table 42: READ Using Concurrent Auto Precharge ......................................................................................... 100

Table 43: WRITE Using Concurrent Auto Precharge ....................................................................................... 106

Table 44: Truth Table – CKE .......................................................................................................................... 121

CCMTD-1725822587-6523

2Gb_DDR2.pdf – Rev. J 09/18 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

MT47H128M16RT-25E:C TR

MT47H128M16RT-25E:C TR概述

MT47H128M16RT-25E:C TR规格参数

文档预览

推荐资源