2Gb: x8, x16 Automotive DDR2 SDRAM
Features
Automotive DDR2 SDRAM
MT47H256M8 – 32 Meg x 8 x 8 banks
MT47H128M16 – 16 Meg x 16 x 8 banks
Features
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Industrial and automotive temperature compliant
V
DD
= 1.8V ±0.1V, V
DDQ
= 1.8V ±0.1V
JEDEC-standard 1.8V I/O (SSTL_18-compatible)
Differential data strobe (DQS, DQS#) option
4n-bit prefetch architecture
Duplicate output strobe (RDQS) option for x8
DLL to align DQ and DQS transitions with CK
8 internal banks for concurrent operation
Programmable CAS latency (CL)
Posted CAS additive latency (AL)
WRITE latency = READ latency - 1
t
CK
Programmable burst lengths (BL): 4 or 8
Adjustable data-output drive strength
32ms, 8192-cycle refresh
On-die termination (ODT)
RoHS-compliant
Supports JEDEC clock jitter specification
AEC-Q100
PPAP submisson
8D response time
Options
1
• Configuration
– 256 Meg x 8 (32 Meg x 8 x 8 banks)
– 128 Meg x 16 (16 Meg x 16 x 8 banks)
• FBGA package (Pb-free) – x8
– 60-ball FBGA (9mm x 11.5mm)
• FBGA package (Pb-free) – x16
– 84-ball FBGA (9mm x 12.5mm)
• FBGA package (lead solder) – x16
– 84-ball FBGA (9mm x 12.5mm)
• Timing – cycle time
– 2.5ns @ CL = 5 (DDR2-800)
– 3.0ns @ CL = 5 (DDR2-667)
• Self refresh
– Standard
• Operating temperature
– Industrial (–40°C
≤
T
C
≤
+95°C;
–40°C
≤
T
A
≤
+85°C)
– Automotive (–40°C
≤
T
C
, T
A
≤
+105°C)
• Revision
Note:
Marking
256M8
128M16
EB
RT
PK
-25E
-3
None
AIT
AAT
:C
1. Not all options listed can be combined to
define an offered product. Use the Part
Catalog Search on
www.micron.com
for
product offerings and availability.
Table 1: Key Timing Parameters
Data Rate (MT/s)
Speed Grade
-25E
-25
-3
CL = 3
n/a
n/a
400
CL = 4
533
533
533
CL = 5
800
667
667
CL = 6
800
800
n/a
CL = 7
n/a
n/a
n/a
t
RC
(ns)
55
55
55
09005aef8441c566
2gbddr2_ait_aat.pdf – Rev. F 06/18 EN
1
Products and specifications discussed herein are subject to change by Micron without notice.
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©
2011 Micron Technology, Inc. All rights reserved.
2Gb: x8, x16 Automotive DDR2 SDRAM
Features
Table 2: Addressing
Parameter
Configuration
Refresh count
Row address
Bank address
Column address
256 Meg x 8
32 Meg x 8 x 8 banks
8K
A[14:0] (16K)
BA[2:0] (8)
A[9:0] (1K)
128 Meg x 16
16 Meg x 16 x 8 banks
8K
A[13:0] (16K)
BA[2:0] (8)
A[9:0] (1K)
Figure 1: 2Gb DDR2 Part Numbers
Example Part Number:
MT47H128M16RT-25E :C
-
MT47H
Configuration
Package
Speed
:
Revision
{
:C Revision
Configuration
256 Meg x 8
128 Meg x 16
Package
Pb-free
60-ball 9mm x 11.5mm FBGA
84-ball 9mm x 12.5mm FBGA
Lead solder
84-ball 9mm x 12.5mm FBGA
PK
EB
RT
256M8
128M16
Speed Grade
-25E
-3
tCK = 2.5ns, CL = 5
tCK = 3ns, CL = 5
AIT Automotive industrial temperature
AAT Automotive temperature
Note:
1. Not all speeds and configurations are available in all packages.
FBGA Part Number System
Due to space limitations, FBGA-packaged components have an abbreviated part marking that is different from the
part number. For a quick conversion of an FBGA code, see the FBGA Part Marking Decoder on Micron’s Web site:
http://www.micron.com.
09005aef8441c566
2gbddr2_ait_aat.pdf – Rev. F 06/18 EN
2
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©
2011 Micron Technology, Inc. All rights reserved.
2Gb: x8, x16 Automotive DDR2 SDRAM
Features
Contents
Important Notes and Warnings ......................................................................................................................... 8
State Diagram .................................................................................................................................................. 9
Functional Description ................................................................................................................................... 10
Automotive Industrial Temperature ............................................................................................................. 10
Automotive Temperature ............................................................................................................................ 11
General Notes ............................................................................................................................................ 11
Ball Assignments and Descriptions ................................................................................................................. 12
Packaging ...................................................................................................................................................... 16
Package Dimensions ................................................................................................................................... 16
FBGA Package Capacitance ......................................................................................................................... 18
Electrical Specifications – Absolute Ratings ..................................................................................................... 19
Temperature and Thermal Impedance ........................................................................................................ 19
Electrical Specifications – I
DD
Parameters ........................................................................................................ 21
I
DD
Specifications and Conditions ............................................................................................................... 21
I
DD7
Conditions .......................................................................................................................................... 22
AC Timing Operating Specifications ................................................................................................................ 25
AC and DC Operating Conditions .................................................................................................................... 37
ODT DC Electrical Characteristics ................................................................................................................... 38
Input Electrical Characteristics and Operating Conditions ............................................................................... 39
Output Electrical Characteristics and Operating Conditions ............................................................................. 42
Output Driver Characteristics ......................................................................................................................... 44
Power and Ground Clamp Characteristics ....................................................................................................... 48
AC Overshoot/Undershoot Specification ......................................................................................................... 49
Input Slew Rate Derating ................................................................................................................................ 51
Commands .................................................................................................................................................... 64
Truth Tables ............................................................................................................................................... 64
DESELECT ................................................................................................................................................. 68
NO OPERATION (NOP) ............................................................................................................................... 69
LOAD MODE (LM) ...................................................................................................................................... 69
ACTIVATE .................................................................................................................................................. 69
READ ......................................................................................................................................................... 69
WRITE ....................................................................................................................................................... 69
PRECHARGE .............................................................................................................................................. 70
REFRESH ................................................................................................................................................... 70
SELF REFRESH ........................................................................................................................................... 70
Mode Register (MR) ........................................................................................................................................ 70
Burst Length .............................................................................................................................................. 71
Burst Type .................................................................................................................................................. 72
Operating Mode ......................................................................................................................................... 72
DLL RESET ................................................................................................................................................. 72
Write Recovery ........................................................................................................................................... 73
Power-Down Mode ..................................................................................................................................... 73
CAS Latency (CL) ........................................................................................................................................ 74
Extended Mode Register (EMR) ....................................................................................................................... 75
DLL Enable/Disable ................................................................................................................................... 76
Output Drive Strength ................................................................................................................................ 76
DQS# Enable/Disable ................................................................................................................................. 76
RDQS Enable/Disable ................................................................................................................................. 76
Output Enable/Disable ............................................................................................................................... 76
On-Die Termination (ODT) ......................................................................................................................... 77
09005aef8441c566
2gbddr2_ait_aat.pdf – Rev. F 06/18 EN
3
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©
2011 Micron Technology, Inc. All rights reserved.
2Gb: x8, x16 Automotive DDR2 SDRAM
Features
Off-Chip Driver (OCD) Impedance Calibration ............................................................................................ 77
Posted CAS Additive Latency (AL) ................................................................................................................ 77
Extended Mode Register 2 (EMR2) ................................................................................................................... 79
Extended Mode Register 3 (EMR3) ................................................................................................................... 80
Initialization .................................................................................................................................................. 81
ACTIVATE ...................................................................................................................................................... 84
READ ............................................................................................................................................................. 86
READ with Precharge .................................................................................................................................. 90
READ with Auto Precharge .......................................................................................................................... 92
WRITE ........................................................................................................................................................... 97
PRECHARGE ................................................................................................................................................. 107
REFRESH ...................................................................................................................................................... 108
SELF REFRESH .............................................................................................................................................. 109
Power-Down Mode ........................................................................................................................................ 111
Precharge Power-Down Clock Frequency Change ........................................................................................... 118
Reset ............................................................................................................................................................. 119
CKE Low Anytime ...................................................................................................................................... 119
ODT Timing .................................................................................................................................................. 121
MRS Command to ODT Update Delay ........................................................................................................ 123
09005aef8441c566
2gbddr2_ait_aat.pdf – Rev. F 06/18 EN
4
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©
2011 Micron Technology, Inc. All rights reserved.
2Gb: x8, x16 Automotive DDR2 SDRAM
Features
List of Tables
Table 1: Key Timing Parameters ....................................................................................................................... 1
Table 2: Addressing ......................................................................................................................................... 2
Table 3: FBGA 84-Ball – x16 and 60-Ball – x4, x8 Descriptions .......................................................................... 14
Table 4: Input Capacitance ............................................................................................................................ 18
Table 5: Absolute Maximum DC Ratings ......................................................................................................... 19
Table 6: Temperature Limits .......................................................................................................................... 20
Table 7: Thermal Impedance ......................................................................................................................... 20
Table 8: General I
DD
Parameters ..................................................................................................................... 21
Table 9: I
DD7
Timing Patterns (8-Bank Interleave READ Operation) ................................................................. 22
Table 10: DDR2 I
DD
Specifications and Conditions (Die Revision C) ................................................................ 23
Table 11: AC Operating Specifications and Conditions .................................................................................... 25
Table 12: Recommended DC Operating Conditions (SSTL_18) ........................................................................ 37
Table 13: ODT DC Electrical Characteristics ................................................................................................... 38
Table 14: Input DC Logic Levels ..................................................................................................................... 39
Table 15: Input AC Logic Levels ...................................................................................................................... 39
Table 16: Differential Input Logic Levels ......................................................................................................... 40
Table 17: Differential AC Output Parameters ................................................................................................... 42
Table 18: Output DC Current Drive ................................................................................................................ 42
Table 19: Output Characteristics .................................................................................................................... 43
Table 20: Full Strength Pull-Down Current (mA) ............................................................................................. 44
Table 21: Full Strength Pull-Up Current (mA) .................................................................................................. 45
Table 22: Reduced Strength Pull-Down Current (mA) ...................................................................................... 46
Table 23: Reduced Strength Pull-Up Current (mA) .......................................................................................... 47
Table 24: Input Clamp Characteristics ............................................................................................................ 48
Table 25: Address and Control Balls ................................................................................................................ 49
Table 26: Clock, Data, Strobe, and Mask Balls ................................................................................................. 49
Table 27: AC Input Test Conditions ................................................................................................................ 49
Table 28: DDR2-400/533 Setup and Hold Time Derating Values (
t
IS and
t
IH) .................................................... 52
Table 29: DDR2-667/800/1066 Setup and Hold Time Derating Values (
t
IS and
t
IH) ........................................... 53
Table 30: DDR2-400/533
t
DS,
t
DH Derating Values with Differential Strobe ...................................................... 56
Table 31: DDR2-667/800/1066
t
DS,
t
DH Derating Values with Differential Strobe ............................................. 57
Table 32: Single-Ended DQS Slew Rate Derating Values Using
t
DS
b
and
t
DH
b
................................................... 58
Table 33: Single-Ended DQS Slew Rate Fully Derated (DQS, DQ at V
REF
) at DDR2-667 ...................................... 58
Table 34: Single-Ended DQS Slew Rate Fully Derated (DQS, DQ at V
REF
) at DDR2-533 ...................................... 59
Table 35: Single-Ended DQS Slew Rate Fully Derated (DQS, DQ at V
REF
) at DDR2-400 ...................................... 59
Table 36: Truth Table – DDR2 Commands ...................................................................................................... 64
Table 37: Truth Table – Current State Bank
n
– Command to Bank
n
................................................................ 65
Table 38: Truth Table – Current State Bank
n
– Command to Bank
m
............................................................... 67
Table 39: Minimum Delay with Auto Precharge Enabled ................................................................................. 68
Table 40: Burst Definition .............................................................................................................................. 72
Table 41: READ Using Concurrent Auto Precharge .......................................................................................... 92
Table 42: WRITE Using Concurrent Auto Precharge ........................................................................................ 98
Table 43: Truth Table – CKE .......................................................................................................................... 113
09005aef8441c566
2gbddr2_ait_aat.pdf – Rev. F 06/18 EN
5
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©
2011 Micron Technology, Inc. All rights reserved.
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