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Datasheet> 器件分类 > 半导体> 存储器> MT48LC8M16A2P-6A AIT:L

MT48LC8M16A2P-6A AIT:L: 产品描述SDRAM 存储器 IC 128Mb 并联 167 MHz 5.4 ns 54-TSOP II; 产品类别半导体存储器; 文件大小1MB，共94页; 制造商Micron Technology; 官网地址http://www.mdtic.com.tw/; 标准

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MT48LC8M16A2P-6A AIT:L概述

SDRAM 存储器 IC 128Mb 并联 167 MHz 5.4 ns 54-TSOP II

MT48LC8M16A2P-6A AIT:L规格参数

参数名称	属性值
类别
厂商名称	Micron Technology
系列	Automotive, AEC-Q100
包装	散装
存储器类型	易失
存储器格式	DRAM
技术	SDRAM
存储容量	128Mb
存储器组织	8M x 16
存储器接口	并联
时钟频率	167 MHz
写周期时间 - 字，页	12ns
访问时间	5.4 ns
电压 - 供电	3V ~ 3.6V
工作温度	-40°C ~ 85°C（TA）
安装类型	表面贴装型
封装/外壳	54-TSOP（0.400"，10.16mm 宽）
供应商器件封装	54-TSOP II
基本产品编号	MT48LC8M16A2

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256Mb: x4, x8, x16 SDRAM

Features

SDR SDRAM

MT48LC64M4A2 – 16 Meg x 4 x 4 banks

MT48LC32M8A2 – 8 Meg x 8 x 4 banks

MT48LC16M16A2 – 4 Meg x 16 x 4 banks

Features

• PC100- and PC133-compliant

• Fully synchronous; all signals registered on positive

edge of system clock

• Internal, pipelined operation; column address can

be changed every clock cycle

• Internal banks for hiding row access/precharge

• Programmable burst lengths: 1, 2, 4, 8, or full page

• Auto precharge, includes concurrent auto precharge

and auto refresh modes

• Self refresh mode (not available on AT devices)

• Auto refresh

– 64ms, 8192-cycle refresh (commercial and

industrial)

– 16ms, 8192-cycle refresh (automotive)

• LVTTL-compatible inputs and outputs

• Single 3.3V ±0.3V power supply

Options

• Configurations

– 64 Meg x 4 (16 Meg x 4 x 4 banks)

– 32 Meg x 8 (8 Meg x 8 x 4 banks)

– 16 Meg x 16 (4 Meg x 16 x 4 banks)

• Write recovery (

WR)

–

WR = 2 CLK

• Plastic package – OCPL

– 54-pin TSOP II OCPL

(400 mil)

(standard)

– 54-pin TSOP II OCPL

(400 mil)

Pb-free

– 60-ball TFBGA (x4, x8) (8mm x

16mm)

– 60-ball TFBGA (x4, x8) (8mm x

16mm) Pb-free

– 54-ball VFBGA (x16) (8mm x 14 mm)

Pb-free

– 54-ball VFBGA (x16) (8mm x 8 mm)

Pb-free

• Timing – cycle time

– 6ns @ CL = 3 (x8, x16 only)

– 7.5ns @ CL = 3 (PC133)

– 7.5ns @ CL = 2 (PC133)

• Self refresh

– Standard

– Low power

• Operating temperature range

– Commercial (0˚C to +70˚C)

– Industrial (–40˚C to +85˚C)

– Automotive (–40˚C to +105˚C)

• Revision

Notes:

Off-center parting line.

Only available on Revision D.

Only available on Revision G.

Contact Micron for availability.

Marking

64M4

32M8

16M16

-6A

-75

-7E

None

:D/:G

PDF: 09005aef8091e6d1

256Mb_sdr.pdf - Rev. W 05/15 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

Products and specifications discussed herein are subject to change by Micron without notice.

256Mb: x4, x8, x16 SDRAM

Features

Contents

Important Notes and Warnings ......................................................................................................................... 8

General Description ......................................................................................................................................... 8

Automotive Temperature .............................................................................................................................. 9

Functional Block Diagrams ............................................................................................................................. 10

Pin and Ball Assignments and Descriptions ..................................................................................................... 13

Package Dimensions ....................................................................................................................................... 17

Temperature and Thermal Impedance ............................................................................................................ 21

Electrical Specifications .................................................................................................................................. 25

Electrical Specifications – I

Parameters ........................................................................................................ 27

Electrical Specifications – AC Operating Conditions ......................................................................................... 29

Functional Description ................................................................................................................................... 32

Commands .................................................................................................................................................... 33

COMMAND INHIBIT .................................................................................................................................. 33

NO OPERATION (NOP) ............................................................................................................................... 34

LOAD MODE REGISTER (LMR) ................................................................................................................... 34

ACTIVE ...................................................................................................................................................... 34

READ ......................................................................................................................................................... 35

WRITE ....................................................................................................................................................... 36

PRECHARGE .............................................................................................................................................. 37

BURST TERMINATE ................................................................................................................................... 37

REFRESH ................................................................................................................................................... 38

AUTO REFRESH ..................................................................................................................................... 38

SELF REFRESH ....................................................................................................................................... 38

Truth Tables ................................................................................................................................................... 39

Initialization .................................................................................................................................................. 44

Mode Register ................................................................................................................................................ 46

Burst Length .............................................................................................................................................. 48

Burst Type .................................................................................................................................................. 48

CAS Latency ............................................................................................................................................... 50

Operating Mode ......................................................................................................................................... 50

Write Burst Mode ....................................................................................................................................... 50

Bank/Row Activation ...................................................................................................................................... 51

READ Operation ............................................................................................................................................. 52

WRITE Operation ........................................................................................................................................... 61

Burst Read/Single Write .............................................................................................................................. 68

PRECHARGE Operation .................................................................................................................................. 69

Auto Precharge ........................................................................................................................................... 69

AUTO REFRESH Operation ............................................................................................................................. 81

SELF REFRESH Operation ............................................................................................................................... 83

Power-Down .................................................................................................................................................. 85

Clock Suspend ............................................................................................................................................... 86

Revision History ............................................................................................................................................. 89

Rev. W – 05/15 ............................................................................................................................................ 89

Rev. W – 09/14 ............................................................................................................................................ 89

Rev. V – 1/14, 8/14 ...................................................................................................................................... 89

Rev. U – 05/13 ............................................................................................................................................. 89

Rev. T – 03/13 ............................................................................................................................................. 89

Rev. S – 12/12 ............................................................................................................................................. 89

Rev. R – 10/12 ............................................................................................................................................. 89

Rev. Q – 02/12 ............................................................................................................................................. 89

PDF: 09005aef8091e6d1

256Mb_sdr.pdf - Rev. W 05/15 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

256Mb: x4, x8, x16 SDRAM

Features

Rev. P – 12/11 .............................................................................................................................................

Rev. O – 07/11 .............................................................................................................................................

Rev. N – 01/10 .............................................................................................................................................

Rev. M – 11/08 ............................................................................................................................................

Rev. L – 08/07 .............................................................................................................................................

Rev. K – 02/07 .............................................................................................................................................

Rev. K – 06/06 .............................................................................................................................................

Rev. J – 03/05 ..............................................................................................................................................

Rev. H – 02/05 .............................................................................................................................................

Rev. H – 10/04 .............................................................................................................................................

Rev. G – 08/03 .............................................................................................................................................

Rev. F – 01/03 .............................................................................................................................................

Rev. E – 03/02 .............................................................................................................................................

Rev. D – 07/01 .............................................................................................................................................

Rev. C – 03/01 .............................................................................................................................................

Rev. B – 10/00 .............................................................................................................................................

Rev. A – 11/99 .............................................................................................................................................

PDF: 09005aef8091e6d1

256Mb_sdr.pdf - Rev. W 05/15 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

256Mb: x4, x8, x16 SDRAM

Features

List of Figures

Figure 1: 64 Meg x 4 Functional Block Diagram ...............................................................................................

Figure 2: 32 Meg x 8 Functional Block Diagram ...............................................................................................

Figure 3: 16 Meg x 16 Functional Block Diagram .............................................................................................

Figure 4: 54-Pin TSOP (Top View) ..................................................................................................................

Figure 5: 60-Ball FBGA (Top View) .................................................................................................................

Figure 6: 54-Ball VFBGA (Top View) ...............................................................................................................

Figure 7: 54-Pin Plastic TSOP "TG/P" (400 mil) ...............................................................................................

Figure 8: 60-Ball TFBGA "BB/FB" (8mm x 16mm) (x4, x8) ...............................................................................

Figure 9: 54-Ball VFBGA "BG/FG" (8mm x 14mm) (x16) ..................................................................................

Figure 10: 54-Ball VFBGA "B4/F4" (8mm x 8mm) (x16) ...................................................................................

Figure 11: Example: Temperature Test Point Location, 54-Pin TSOP (Top View) ...............................................

Figure 12: Example: Temperature Test Point Location, 54-Ball VFBGA (Top View) ............................................

Figure 13: Example: Temperature Test Point Location, 60-Ball FBGA (Top View) ..............................................

Figure 14: ACTIVE Command ........................................................................................................................

Figure 15: READ Command ...........................................................................................................................

Figure 16: WRITE Command .........................................................................................................................

Figure 17: PRECHARGE Command ................................................................................................................

Figure 18: Initialize and Load Mode Register ..................................................................................................

Figure 19: Mode Register Definition ...............................................................................................................

Figure 20: CAS Latency ..................................................................................................................................

Figure 21: Example: Meeting

RCD (MIN) When 2 <

RCD (MIN)/

CK < 3 ..........................................................

Figure 22: Consecutive READ Bursts ..............................................................................................................

Figure 23: Random READ Accesses ................................................................................................................

Figure 24: READ-to-WRITE ............................................................................................................................

Figure 25: READ-to-WRITE With Extra Clock Cycle .........................................................................................

Figure 26: READ-to-PRECHARGE ..................................................................................................................

Figure 27: Terminating a READ Burst .............................................................................................................

Figure 28: Alternating Bank Read Accesses .....................................................................................................

Figure 29: READ Continuous Page Burst .........................................................................................................

Figure 30: READ – DQM Operation ................................................................................................................

Figure 31: WRITE Burst .................................................................................................................................

Figure 32: WRITE-to-WRITE ..........................................................................................................................

Figure 33: Random WRITE Cycles ..................................................................................................................

Figure 34: WRITE-to-READ ............................................................................................................................

Figure 35: WRITE-to-PRECHARGE .................................................................................................................

Figure 36: Terminating a WRITE Burst ............................................................................................................

Figure 37: Alternating Bank Write Accesses .....................................................................................................

Figure 38: WRITE – Continuous Page Burst .....................................................................................................

Figure 39: WRITE – DQM Operation ...............................................................................................................

Figure 40: READ With Auto Precharge Interrupted by a READ .........................................................................

Figure 41: READ With Auto Precharge Interrupted by a WRITE ........................................................................

Figure 42: READ With Auto Precharge ............................................................................................................

Figure 43: READ Without Auto Precharge .......................................................................................................

Figure 44: Single READ With Auto Precharge ..................................................................................................

Figure 45: Single READ Without Auto Precharge .............................................................................................

Figure 46: WRITE With Auto Precharge Interrupted by a READ ........................................................................

Figure 47: WRITE With Auto Precharge Interrupted by a WRITE ......................................................................

Figure 48: WRITE With Auto Precharge ...........................................................................................................

Figure 49: WRITE Without Auto Precharge .....................................................................................................

Figure 50: Single WRITE With Auto Precharge .................................................................................................

PDF: 09005aef8091e6d1

256Mb_sdr.pdf - Rev. W 05/15 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

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步进电机是将电脉冲信号转变为角位移或线位移的开环控制元件，在非超载的情况下，电机的转速、停止的位置只取决于脉冲信号的频率和脉冲数，而不受负载变化的影响，即给电机加一个脉冲信号，电机则转过一个步距角。这一线性关系的存在，加上步进电机只有周期性的误差而无累积误差等特点。使得在速度、位置等控制领域用步进电机来控制变的非常的简单。　　本文小编主要介绍的是反应式步进电机的结构及工作原理，以三...[详细]

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