1Gb: x16, x32 Mobile LPDDR SDRAM
Features
Mobile Low-Power DDR SDRAM
MT46H64M16LF – 16 Meg x 16 x 4 Banks
MT46H32M32LF – 8 Meg x 32 x 4 Banks
Features
•
V
DD
/V
DDQ
= 1.70–1.95V
•
Bidirectional data strobe per byte of data (DQS)
•
Internal, pipelined double data rate (DDR)
architecture; two data accesses per clock cycle
•
Differential clock inputs (CK and CK#)
•
Commands entered on each positive CK edge
•
DQS edge-aligned with data for READs; center-
aligned with data for WRITEs
•
4 internal banks for concurrent operation
•
Data masks (DM) for masking write data—one mask
per byte
•
Programmable burst lengths (BL): 2, 4, 8, or 16
1
•
Concurrent auto precharge option is supported
•
Auto refresh and self refresh modes
•
1.8V LVCMOS-compatible inputs
•
On-chip temp sensor to control self refresh rate
•
Partial-array self refresh (PASR)
•
Deep power-down (DPD)
•
Status read register (SRR)
•
Selectable output drive strength (DS)
•
Clock stop capability
•
64ms refresh
Table 1: Key Timing Parameters (CL = 3)
Speed Grade
-5
-54
-6
-75
Clock Rate (MHz)
200
185
166
133
Access Time
5.0ns
5.0ns
5.5ns
6.0ns
Options
•
V
DD
/V
DDQ
–
1.8V/1.8V
•
Configuration
–
64 Meg x 16 (16 Meg x 16 x 4 banks)
–
32 Meg x 32 (8 Meg x 32 x 4 banks)
•
Row-size option
–
JEDEC-standard option
–
Reduced page-size option
1
•
Plastic green package
–
60-ball VFBGA (10mm x 11.5mm)
2
–
90-ball VFBGA (10mm x 13mm)
3
•
Timing – cycle time
–
5ns @ CL = 3
–
5.4ns @ CL = 3
–
6ns @ CL = 3
–
7.5ns @ CL = 3
•
Power
–
Standard I
DD2
/I
DD6
–
Low-power I
DD2
/I
DD6
•
Operating temperature range
–
Commercial (0˚ to +70˚C)
–
Industrial (–40˚C to +85˚C)
•
Design revision
Notes:
Marking
H
64M16
32M32
LF
LG
CK
CM
-5
-54
-6
-75
None
L
None
IT
:A
1. Contact factory for availability.
2. Only available for x16 configuration.
3. Only available for x32 configuration.
PDF: 09005aef82ce3074
1gb_ddr_mobile_sdram_t48m.pdf - Rev. K 07/09 EN
1
Products and specifications discussed herein are subject to change by Micron without notice.
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©2007
Micron Technology, Inc. All rights reserved.
1Gb: x16, x32 Mobile LPDDR SDRAM
Features
Table 2: Configuration Addressing – 1Gb
Architecture
Configuration
Refresh count
Row addressing
Column addressing
64 Meg x 16
16 Meg x 16 x 4 banks
8K
16K (A[13:0])
1K (A[9:0])
32 Meg x 32
8 Meg x 32 x 4 banks
8K
8K (A[12:0])
1K (A[9:0])
Reduced Page-Size Option 32 Meg x 32
8 Meg x 32 x 4 banks
8K
16K (A[13:0])
512 (A[8:0])
Figure 1: 1Gb Mobile LPDDR Part Numbering
MT 46
Micron Technology
Product Family
46 = Mobile LPDDR
H
64M16 LF CK -6
L IT
:A
Design Revision
:A = First generation
Operating Temperature
Blank = Commercial (0°C to +70°C)
IT = Industrial (–40°C to +85°C)
Operating Voltage
H = 1.8/1.8V
Power
Configuration
64 Meg x 16
32 Meg x 32
Blank = Standard I
DD2
/I
DD6
L = Low-power I
DD2
/I
DD6
Cycle Time
Addressing
LF = Mobile standard addressing
LG = Reduced page-size option
-5 = 5ns
t
CK CL = 3
-54 = 5.4ns
t
CK CL = 3
-6 = 6ns
t
CK CL = 3
-75 = 7.5ns
t
CK CL = 3
Package Codes
CK = 10mm x 11.5mm, VFBGA, green
CM = 10mm x 13mm, VFBGA, green
FBGA Part Marking Decoder
Due to space limitations, FBGA-packaged components have an abbreviated part marking that is different from the
part number. Micron’s FBGA part marking decoder is available at
www.micron.com/decoder.
PDF: 09005aef82ce3074
1gb_ddr_mobile_sdram_t48m.pdf - Rev. K 07/09 EN
2
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©2007
Micron Technology, Inc. All rights reserved.
1Gb: x16, x32 Mobile LPDDR SDRAM
General Description ......................................................................................................................................... 8
Functional Block Diagrams ............................................................................................................................... 9
Ball Assignments and Descriptions ................................................................................................................. 11
Package Dimensions ...................................................................................................................................... 15
Electrical Specifications .................................................................................................................................. 17
Electrical Specifications – I
DD
Parameters ........................................................................................................ 20
Electrical Specifications – AC Operating Conditions ......................................................................................... 24
Output Drive Characteristics ........................................................................................................................... 28
Functional Description ................................................................................................................................... 31
Commands .................................................................................................................................................... 32
DESELECT ................................................................................................................................................ 33
NO OPERATION ........................................................................................................................................ 33
LOAD MODE REGISTER ............................................................................................................................ 33
ACTIVE ..................................................................................................................................................... 33
READ ........................................................................................................................................................ 34
WRITE ...................................................................................................................................................... 35
PRECHARGE ............................................................................................................................................. 36
BURST TERMINATE .................................................................................................................................. 37
AUTO REFRESH ........................................................................................................................................ 37
SELF REFRESH ........................................................................................................................................... 38
DEEP POWER-DOWN ................................................................................................................................ 38
Truth Tables ................................................................................................................................................... 39
State Diagram ................................................................................................................................................ 44
Initialization .................................................................................................................................................. 45
Standard Mode Register .................................................................................................................................. 48
Burst Length .............................................................................................................................................. 48
Burst Type ................................................................................................................................................. 49
CAS Latency .............................................................................................................................................. 50
Operating Mode ......................................................................................................................................... 51
Extended Mode Register ................................................................................................................................. 52
Temperature-Compensated Self Refresh .................................................................................................... 52
Partial-Array Self Refresh ........................................................................................................................... 53
Output Drive Strength ................................................................................................................................ 53
Status Read Register ....................................................................................................................................... 54
Bank/Row Activation ...................................................................................................................................... 56
READ Operation ............................................................................................................................................. 57
WRITE Operation ........................................................................................................................................... 68
PRECHARGE Operation .................................................................................................................................. 80
Auto Precharge ............................................................................................................................................... 80
Concurrent Auto Precharge ........................................................................................................................ 81
AUTO REFRESH Operation ............................................................................................................................. 86
SELF REFRESH Operation .............................................................................................................................. 87
Power-Down .................................................................................................................................................. 88
Deep Power-Down .................................................................................................................................... 90
Clock Change Frequency ................................................................................................................................ 92
Revision History ............................................................................................................................................. 93
Rev. K – 07/09 ............................................................................................................................................. 93
Rev. J – 06/09 .............................................................................................................................................. 93
Rev. I – 03/09 .............................................................................................................................................. 93
Rev. H – 02/09 ............................................................................................................................................ 93
Contents
PDF: 09005aef82ce3074
1gb_ddr_mobile_sdram_t48m.pdf - Rev. K 07/09 EN
3
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©2007
Micron Technology, Inc. All rights reserved.
1Gb: x16, x32 Mobile LPDDR SDRAM
Rev. G – 06/08 ............................................................................................................................................
Rev. F – 04/08Rev. E – 03/08 ........................................................................................................................
Rev. D – 02/08 ............................................................................................................................................
Rev. C – 09/07 .............................................................................................................................................
Rev. B – 07/07 .............................................................................................................................................
Rev. A – 02/07 .............................................................................................................................................
Revision History for Commands, Operations, and Timing Diagrams .............................................................
Update – 05/08 ...........................................................................................................................................
Update – 05/08 ...........................................................................................................................................
Update – 03/08 ...........................................................................................................................................
Update – 12/07 ...........................................................................................................................................
Update – 07/07 ...........................................................................................................................................
93
93
94
94
94
94
94
94
94
95
95
95
PDF: 09005aef82ce3074
1gb_ddr_mobile_sdram_t48m.pdf - Rev. K 07/09 EN
4
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©2007
Micron Technology, Inc. All rights reserved.
1Gb: x16, x32 Mobile LPDDR SDRAM
Table 1: Key Timing Parameters (CL = 3) .......................................................................................................... 1
Table 2: Configuration Addressing – 1Gb .......................................................................................................... 2
Table 3: VFBGA Ball Descriptions .................................................................................................................. 13
Table 4: Absolute Maximum Ratings .............................................................................................................. 17
Table 5: AC/DC Electrical Characteristics and Operating Conditions ............................................................... 17
Table 6: Capacitance (x16, x32) ...................................................................................................................... 18
Table 7: I
DD
Specifications and Conditions (x16) ............................................................................................ 20
Table 8: I
DD
Specifications and Conditions (x32) ............................................................................................ 21
Table 9: I
DD6
Specifications and Conditions ................................................................................................... 22
Table 10: Electrical Characteristics and Recommended AC Operating Conditions ............................................ 24
Table 11: Target Output Drive Characteristics (Full Strength) .......................................................................... 28
Table 12: Target Output Drive Characteristics (Three-Quarter Strength) .......................................................... 29
Table 13: Target Output Drive Characteristics (One-Half Strength) ................................................................. 30
Table 14: Truth Table – Commands ............................................................................................................... 32
Table 15: DM Operation Truth Table ............................................................................................................. 33
Table 16: Truth Table – Current State Bank
n
– Command to Bank
n
............................................................... 39
Table 17: Truth Table – Current State Bank
n
– Command to Bank
m
.............................................................. 40
Table 18: Truth Table – CKE .......................................................................................................................... 43
Table 19: Burst Definition Table .................................................................................................................... 49
List of Tables
PDF: 09005aef82ce3074
1gb_ddr_mobile_sdram_t48m.pdf - Rev. K 07/09 EN
5
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©2007
Micron Technology, Inc. All rights reserved.
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