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Technical Support ..................................................... 16
Document Number: 001-96968 Rev. *E
Page 2 of 16
CY62158H MoBL
®
Product Portfolio
Power Dissipation
Product
Features and Options (see
Pin
Configurations – CY62158H)
Range
V
CC
Range
(V)
Speed Operating I
CC
(mA)
(ns)
f = f
max
Typ
[3]
CY62158H Dual Chip Enable
Industrial
4.5 V–5.5 V
45
29
Max
36
Standby I
SB2
(µA)
Typ
[3]
5.5
Max
16
Pin Configurations – CY62158H
Figure 1. 44-pin TSOP II Pinout
[4]
A
4
A
3
A
2
A
1
A
0
CE
1
NC
NC
I/O
0
I/O
1
V
CC
V
SS
I/O
2
I/O
3
NC
NC
WE
A
19
A
18
A
17
A
16
A
15
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
A
5
A
6
A
7
OE
CE
2
A
8
NC
NC
I/O
7
I/O
6
V
SS
V
CC
I/O
5
I/O
4
NC
NC
A
9
A
10
A
11
A
12
A
13
A
14
Notes
3. Typical values are included for reference only and are not guaranteed or tested. Typical values are measured at V
CC
= 5 V (for V
CC
range of 4.5 V–5.5 V), T
A
= 25 °C.
4. NC pins are not connected internally to the die and are typically used for address expansion to a higher-density device. Refer to the respective datasheets for pin
configuration.
Document Number: 001-96968 Rev. *E
Page 3 of 16
CY62158H MoBL
®
Maximum Ratings
Exceeding maximum ratings may shorten the useful life of the
device. User guidelines are not tested.
Storage temperature ............................... –65 °C to + 150 °C
Ambient temperature
with power applied .................................. –55 °C to + 125 °C
Supply voltage to ground potential ..... –0.5 V to V
CC
+ 0.5 V
DC voltage applied to outputs
in High Z state
[5]
.................................. –0.5 V to V
CC
+ 0.5 V
DC input voltage
[5]
.............................. –0.5 V to V
CC
+ 0.5 V
Output current into outputs (LOW) ............................. 20 mA
Static discharge voltage
(MIL-STD-883, Method 3015) ................................. >2001 V
Latch-up current ..................................................... >140 mA
Operating Range
Grade
Industrial
Ambient Temperature
–40
C
to +85
C
V
CC
[6]
4.5 V to 5.5 V
DC Electrical Characteristics
Over the Operating Range of –40
C
to 85
C
Parameter
V
OH
V
OL
V
IH[5]
V
IL[5]
I
IX
I
OZ
I
CC
Description
Output HIGH
voltage
Output LOW
voltage
Input HIGH
voltage
Input LOW
voltage
4.5 V to 5.5 V
4.5 V to 5.5 V
4.5 V to 5.5 V
4.5 V to 5.5 V
4.5 V to 5.5 V
GND < V
IN
< V
CC
GND < V
OUT
< V
CC
, Output disabled
V
CC
= Max, I
OUT
= 0 mA, f = 22.22 MHz
CMOS levels
(45 ns)
f = 1 MHz
I
SB1[9]
Automatic power down current – CE
1
> V
CC
– 0.2 V or CE
2
< 0.2 V,
CMOS inputs;
V
IN
> V
CC
– 0.2 V, V
IN
< 0.2 V,
V
CC
= 4.5 to 5.5 V
f = f
max
(address and data only),
f = 0 (OE, and WE), V
CC
= V
CC(max)
I
SB2[9]
Automatic power down current – CE
1
> V
CC
– 0.2 V or
CMOS inputs;
CE
2
< 0.2 V, or
V
CC
= 4.5 to 5.5 V
V
IN
> V
CC
– 0.2 V or
V
IN
< 0.2 V,
f = 0, V
CC
= V
CC(max)
25 °C
[10]
40 °C
[10]
70 °C
[10]
85 °C
–
–
–
–
5.5
6.3
8.4
12.0
[10]
6.5
8.0
12.0
16.0
A
Test Conditions
V
CC
= Min, I
OH
= –1.0 mA
V
CC
= Min, I
OH
= –0.1 mA
V
CC
= Min, I
OL
= 2.1 mA
–
–
45 ns
Min
2.4
V
CC
– 0.4
[8]
–
2.2
–0.5
–1.0
–1.0
–
–
–
Typ
[7]
–
–
–
–
–
–
–
29.0
7.0
5.5
Max
–
–
0.4
V
CC
+ 0.5
0.8
+1.0
+1.0
36.0
9.0
16.0
A
V
V
V
A
A
mA
Unit
V
Input leakage current
Output leakage current
V
CC
operating supply current
Notes
5. V
IL(min)
= –2.0 V and V
IH(max)
= V
CC
+ 2 V for pulse durations of less than 20 ns.
6. Full Device AC operation assumes a 100 µs ramp time from 0 to V
CC(min)
and 200 µs wait time after V
CC
stabilization.
7. Typical values are included for reference only and are not guaranteed or tested. Typical values are measured at V
CC
= 5 V (for V
CC
range of 4.5 V–5.5 V), T
A
= 25 °C.
8. This parameter is guaranteed by design and not tested.
9. Chip enables (CE
1
and CE
2
) must be tied to CMOS levels to meet the I
SB1
/ I
SB2
/ I
CCDR
spec. Other inputs can be left floating.
10. The I
SB2
limits at 25 °C, 40 °C, 70 °C and typical limit at 85 °C are guaranteed by design and not 100% tested.
Document Number: 001-96968 Rev. *E
Page 4 of 16
CY62158H MoBL
®
Capacitance
Parameter
[11]
C
IN
C
OUT
Description
Input capacitance
Output capacitance
Test Conditions
T
A
= 25 °C, f = 1 MHz, V
CC
= V
CC(typ)
Max
10
10
Unit
pF
pF
Thermal Resistance
Parameter
[11]
JA
JC
Description
Thermal resistance
(junction to ambient)
Thermal resistance
(junction to case)
Test Conditions
Still air, soldered on a 3 × 4.5 inch, four-layer printed circuit
board
44-pin TSOP II Unit
66.93
13.09
°C/W
°C/W
AC Test Loads and Waveforms
Figure 2. AC Test Loads and Waveforms
V
CC
OUTPUT
R1
V
HIGH
GND
30 pF
INCLUDING
JIG AND
SCOPE
R2
10%
ALL INPUT PULSES
90%
90%
10%
Fall Time = 1 V/ns
Rise Time = 1 V/ns
Equivalent to: THÉVENIN EQUIVALENT
R
TH
OUTPUT
V
TH
Parameters
R1
R2
R
TH
V
TH
V
HIGH
5.0 V
1800
990
639
1.77
5.0
Unit
V
V
Note
11. Tested initially and after any design or process changes that may affect these parameters.
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