NTC Type SMD
Thermometrics Surface
Mount Devices
EIA Style 1206
0.5 mm (0.02 in)
typical
1.27 mm
(0.05 in)
maximum
Nickel barrier solder coated
3 sided wrap around
1.6 mm ±0.2 mm
(0.063 mm ±0.008 in)
3.2 mm ±0.2 mm
(0.126 in ±0.008 in)
Features
•
•
•
•
•
•
Nickel barrier tin plated terminations for
soldering
High sensitivity to changes in temperature
Wide operating temperature range -40°F to
257°F (-40°C to 125°C)
Rugged construction
Available in other material systems
Intended for temperature measurement,
control and compensation
•
•
•
•
Suitable for standard soldering techniques
Excellent solderability without
“tombstoning”
Ceramic between electrodes glass coated
for improved stability
Supplied in tape-and-reel packaging
Amphenol
Advanced Sensors
Type NHQ
Specification
Surface mount chip 1206 size
0.5 mm ±0.2 mm
(0.0197 in ±0.008 in)
1.6 mm ±0.2 mm
(0.063 in ±0.008 in)
Description
A range of 1206 size surface mount NTC chip
thermistors.The terminations are nickel barrier
with tin plating.
1.2 mm (0.0472 in)
maximum
General
Soldering Recommendations
• Maximum storage time in closed package:
One year
• Maximum storage time exposed to ambient
conditions of 59°F to 86°F (15°C to 30°C),
15% to 70% RH: 30 days
• Drying prior to soldering: Not to exceed 48h
at 176°F (80°C) or 16h at 212°F (100°C) or 8h
at 257°F (125°C)
• Flux type: R or RMA
3.2 mm ±0.2 mm
(0.126 in ±0.008 in)
NTC Type NHQ Outline Drawing
Code
NHQ202B410T5
NHQ222B410T5
NHQ252B410T5
NHQ302B410T5
NHQ472B355T5
NHQ502B355T5
NHQ103B375T5
NHQ153B400T5
NHQ203B400T5
NHQ223B400T5
NHQ303B400T5
NHQ333B400T5
NHQ473B400T5
NHQ503B400T5
NHQ104B425T5
NHQ154B425T5
NHQ304B435T5
NHQ474B435T5
NHQ504B435T5
R25
W
2000
2200
2500
3000
4700
5000
10000
15000
20000
22000
30000
33000
47000
50000
100000
150000
300000
470000
500000
B (25/85)
4100
4100
4100
4100
3550
3550
3750
4000
4000
4000
4000
4000
4000
4000
4250
4250
4350
4350
4350
Flow Soldering Conditions
• Preheat temperature: 176°F to 302°F (80°C to
150°C)
• Maximum rate of temperature change:
4.5°F/s or 2.5°C/s
• Maximum solder temperature: 509°F (265°C)
• Maximum dwell time: 10 seconds
•
Cooling in ambient or air flow of 5m/s
Reflow Soldering Conditions
• Method infrared, hot gas, vapor
• Maximum rate of preheat temperature
change: 4.5°F/s or 2.5°C/s
• Maximum temperature: 437°F (225°C)
• Maximum time above: 392°F (200°C) 30
seconds
•
Maximum radiant flux: (0.1 to 100 W µ) 5 W/
cm2
• Maximum hot air temperature: 527°F (275°C)
at 4 m/s
• Maximum vapor temperature: 419°F (215°C)
• Maximum rate of cooling: 4.5°F/s or 2.5°C/s
Data
• Resistance tolerance at 77°F (25°C) ±5%;
for ±10% replace T5 by T10 in code.
• Tolerance on B value ±200 K
• Minimum temperature: -40°F (-40°C)
• Maximum temperature: 257°F (125°C)
• Dissipation factor: 3 mW/K
• Time constant: 8 seconds maximum
Cleaning
Ultrasonic cleaning in methanol or isopropanol
not exceeding 40 kHz for 5 minutes, or
aqueous cleaning not exceeding 158°F (70°C)
for 7 minutes (recommended).
2
Type NHQM
Specification
Surface mount chip 0805 size
0.4 mm ±0.2 mm
(0.0157 in ±0.008 in)
1.25 mm ±0.2 mm
(0.0492 in ±0.008 in)
Description
A range of 0805 size surface mount NTC chip
thermistors.The terminations are nickel barrier with tin
plating.
1.2 mm (0.0472 in)
maximum
General
Soldering Recommendations
• Maximum storage time in closed package: One year
• Maximum storage time exposed to ambient conditions
of 59°F to 86°F (15°C to 30°C), 15% to 70% RH: 30
days
• Drying prior to soldering: Not to exceed 48h at 176°F
(80°C) or 16h at 212°F (100°C) or 8h at 257°F (125°C)
• Flux type: R or RMA
2 mm ±0.2 mm
(0.0787 in ±0.008 in)
NTC Type NHQM Outline Drawing
Code
NHQM202B410T5
NHQM252B410T5
NHQM272B410T5
NHQM302B410T5
NHQM472B355T5
NHQM502B355T5
NHQM682B375T5
NHQM103B375T5
NHQM153B400T5
NHQM203B400T5
NHQM223B400T5
NHQM273B400T5
NHQM303B400T5
NHQM333B400T5
NHQM473B415T5
NHQM503B415T5
NHQM104B425T5
NHQM154B425T5
NHQM304B425T5
NHQM474B435T5
NHQM504B435T5
R25
W
2000
2500
2700
3000
4700
5000
6800
10000
15000
20000
22000
27000
30000
33000
47000
50000
100000
150000
300000
470000
500000
B (25/85°C)
4100
4100
4100
4100
3550
3550
3750
3750
4000
4000
4000
4000
4000
4000
4150
4150
4250
4250
4250
4350
4350
Flow Soldering Conditions
•
•
•
•
•
Preheat temperature: 176°F to 302°F (80°C to 150°C)
Maximum rate of temperature change: 4.5°F/s or
2.5°C/s
Maximum solder temperature: 509°F (265°C)
Maximum dwell time: 10 seconds
Cooling in ambient or air flow of 5m/s
Reflow Soldering Conditions
• Method infrared, hot gas, vapor
• Maximum rate of preheat temperature change: 4.5°F/s
or 2.5°C/s
• Maximum temperature: 437°F (225°C)
• Maximum time above: 392°F (200°C) 30 seconds
•
Maximum radiant flux: (0.1 to 100 Wµ) 5 W µ/cm2
• Maximum hot air temperature: 527°F (275°C) at 4 m/s
• Maximum vapor temperature: 419°F (215°C)
• Maximum rate of cooling: 4.5°F/s or 2.5°Cs
Cleaning
Ultrasonic cleaning in methanol or isopropanol not
exceeding 40 kHz for 5 minutes, or aqueous cleaning not
exceeding 158°F (70°C) for 7 minutes (recommended).
Data
• Resistance tolerance at 77°F (25°C) ±5%; for
±10% replace T5 by T10 in code.
• Tolerance on B value ±200 K
• Minimum temperature: -40°F (-40°C)
• Maximum temperature: 257°F (125°C)
• Dissipation factor: 1.5 mW/K
• Time constant: 5 seconds maximum
3
Type NHQMM
Specification
Surface mount chip 0603 size
0.3 mm ± 0.2 mm
(0.012 in ± 0.008 in)
0.8 mm ± 2 mm
(0.031 in ± 0.08 in)
Description
A range of 0603 size surface mount NTC chip
thermistors.The terminations are nickel barrier
with tin plating.
1 mm max
(0.039 in max)
General
Soldering Recommendations
• Maximum storage time in closed package:
One year
• Maximum storage time exposed to ambient
conditions of 59°F to 86°F (15°C to 30°C),
15% to 70% RH: 30 days
• Drying prior to soldering: Not to exceed 48h
at 176°F (80°C) or 16h at 212°F (100°C) or
8h at 257°F (125°C)
• Flux type: R or RMA
1.6 mm ± 0.2 mm
(0.063 in ± 0.008 in)
NTC Type NHQMM Outline Drawing
Code
NHQMM202B410T5
NHQMM222B410T5
NHQMM302B410T5
NHQMM332B410T5
NHQMM472B355T5
NHQMM502B355T5
NHQMM682B355T5
NHQMM103B375T5
NHQMM153B380T5
NHQMM203B380T5
NHQMM223B380T5
NHQMM303B400T5
NHQMM333B400T5
NHQMM473B400T5
NHQMM503B400T5
NHQMM683B400T5
NHQMM104B415T5
NHQMM154B425T5
NHQMM204B425T5
R25
W
2000
2200
3000
3300
4700
5000
6800
10000
15000
20000
22000
30000
33000
47000
50000
68000
100000
150000
200000
B (25/85)
4100
4100
4100
4100
3550
3550
3550
3750
3800
3800
3800
4000
4000
4000
4000
4000
4150
4250
4250
Flow Soldering Conditions
• Preheat temperature: 176°F to 302°F (80°C
to 150°C)
• Maximum rate of temperature change:
4.5°F/s or 2.5°C/s
• Maximum solder temperature: 509°F
(265°C)
• Maximum dwell time: 10 seconds
•
Cooling in ambient or air flow of 5m/s
Reflow Soldering Conditions
• Method infrared, hot gas, vapor
• Maximum rate of preheat temperature
change: 4.5°F/s or 2.5°C/s
• Maximum temperature: 437°F (225°C)
• Maximum time above: 392°F (200°C) 30
seconds
•
Maximum radiant flux: (0.1 to 100 Wµ) 5
Wµ/cm
2
• Maximum hot air temperature: 527°F
(275°C) at 4 m/s
• Maximum vapor temperature: 419°F (215°C)
• Maximum rate of cooling: 4.5°F/s or 2.5°C/s
Data
• Resistance tolerance at 77°F (25°C) ±5%;
for ±10% replace T5 by T10 in code
• Tolerance on B value ±200 K
• Minimum temperature: -40°F (-40°C)
• Maximum temperature: 257°F (125°C)
• Dissipation factor: 1.2 mW/K
• Time constant: 4 seconds maximum
Cleaning
Ultrasonic cleaning in methanol or
isopropanol not exceeding 40 kHz for 5
minutes, or aqueous cleaning not exceeding
158°F (70°C) for 7 minutes (recommended).
4
Type NHQT
Specification
Surface mount chip 0402 size
0.2 mm ±0.1 mm
(0.078 in ±0.004 in)
0.5 mm ±0.15 mm
(0.0196 in ±0.006 in)
Description
A range of 0402 size surface mount NTC
chip thermistors.The terminations are nickel
barrier with tin plating.
0.45 mm ±0.15 mm
(0.0177 in ±0.006 in)
General
Soldering Recommendations
• Maximum storage time in closed package:
One year
• Maximum storage time exposed to
ambient conditions of 59°F to 86°F (15°C
to 30°C), 15% to 70% RH: 30 days
• Drying prior to soldering: Not to exceed
48h at 176°F (80°C) or 16h at 212°F
(100°C) or 8h at 257°F (125°C)
• Flux type: R or RMA
1 mm ±0.15 mm
(0.0394 in ±0.006 in)
NTC Type NHQT Outline Drawing
Code
NHQT500B285T5
NHQT202B410T5
NHQT252B410T5
NHQT332B410T5
NHQT352B410T5
NHQT402B410T5
NHQT652B410T5
NHQT153B380T5
NHQT203B380T5
NHQT223B380T5
NHQT303B400T5
NHQT473B400T5
NHQT683B400T5
NHQT154B425T5
R25
W
50
2000
2500
3300
3500
4000
6500
15000
20000
22000
30000
47000
68000
150000
B (25/85)
2850
4100
4100
4100
4100
4100
4100
3800
3800
3800
4000
4000
4000
4250
Flow Soldering Conditions
• Preheat temperature: 176°F to 302°F (80°C
to 150°C)
• Maximum rate of temperature change:
4.5°F/s or 2.5°C/s
• Maximum solder temperature: 509°F
(265°C)
• Maximum dwell time: 10 seconds
•
Cooling in ambient or air flow of 5m/s
Reflow Soldering Conditions
• Method infrared, hot gas, vapor
• Maximum rate of preheat temperature
change: 4.5°F/s or 2.5°C/s
• Maximum temperature: 437°F (225°C)
• Maximum time above: 392°F (200°C) 30
seconds
•
Maximum radiant flux: (0.1 to 100 Wµ) 5
Wµ/cm2
• Maximum hot air temperature: 527°F
(275°C) at 4 m/s
• Maximum vapor temperature: 419°F
(215°C)
• Maximum rate of cooling: 4.5°F/s or
2.5°C/s
Data
• Resistance tolerance at 77°F (25°C) ±5%;
for ±10% replace T5 by T10 in code
• Tolerance on B value ±200 K
• Minimum temperature: -40°F (-40°C)
• Maximum temperature: 257°F (125°C)
• Dissipation factor: 1.5 mW/K
• Time constant: 4 seconds maximum
Cleaning
Ultrasonic cleaning in methanol or
isopropanol notexceeding 40 kHz for 5
minutes, or aqueous cleaning not exceeding
158°F (70°C) for 7 minutes (recommended).
5
FPGA/CPLD
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