Single Channel, High Speed
Optocouplers
Technical Data
6N135/6
HCNW135/6
HCNW4502/3
HCPL-2502
HCPL-0452/3
HCPL-0500/1
HCPL-4502/3
Features
• 15 kV/
µ
s Minimum Common
Mode Transient Immunity at
V
CM
= 1500 V (4503/0453)
• High Speed: 1 Mb/s
• TTL Compatible
• Available in 8-Pin DIP, SO-8,
Widebody Packages
• Open Collector Output
• Guaranteed Performance
from Temperature: 0
°
C
to 70
°
C
• Safety Approval
UL Recognized – 3750 V rms
for 1 minute (5000 V rms for
1 minute for HCNW and
Option 020 devices) per
UL1577
CSA Approved
IEC/EN/DIN EN 60747-5-2
Approved
–V
IORM
= 630 V
peak
for
HCPL-4503#060
–V
IORM
= 1414 V
peak
for
HCNW devices
• Dual Channel Version
Available (253X/4534/053X/
0534)
• MIL-PRF-38534 Hermetic
Version Available (55XX/
65XX/4N55)
Applications
• High Voltage Insulation
• Video Signal Isolation
• Power Transistor Isolation
in Motor Drives
• Line Receivers
• Feedback Element in
Switched Mode Power
Supplies
• High Speed Logic Ground
Isolation – TTL/TTL, TTL/
CMOS, TTL/LSTTL
• Replaces Pulse Transformers
• Replaces Slow
Phototransistor Isolators
• Analog Signal Ground
Isolation
Description
These diode-transistor optocoup-
lers use an insulating layer
between a LED and an integrated
photodetector to provide elec-
trical insulation between input
and output. Separate connections
for the photodiode bias and
output-transistor collector
increase the speed up to a
hundred times that of a conven-
tional phototransistor coupler by
reducing the base-collector
capacitance.
Functional Diagram
NC 1
ANODE 2
CATHODE 3
NC 4
8 V
CC
*
7 V
B
6 V
O
5 GND
TRUTH TABLE
(POSITIVE LOGIC)
V
O
LED
LOW
ON
HIGH
OFF
* NOTE: FOR 4502/3, 0452/3,
PIN 7 IS NOT CONNECTED.
A 0.1
µF
bypass capacitor must be connected between pins 5 and 8.
CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to
prevent damage and/or degradation which may be induced by ESD.
2
These single channel optocoup-
lers are available in 8-Pin DIP,
SO-8 and Widebody package
configurations.
The 6N135, HCPL-0500, and
HCNW135 are for use in TTL/
CMOS, TTL/LSTTL or wide
bandwidth analog applications.
Current transfer ratio (CTR) for
these devices is 7% minimum at
I
F
= 16 mA.
The 6N136, HCPL-2502,
HCPL-0501, and HCNW136 are
designed for high speed TTL/TTL
applications. A standard 16 mA
TTL sink current through the
input LED will provide enough
output current for 1 TTL load and
a 5.6 kΩ pull-up resistor. CTR for
these devices is 19% minimum at
I
F
= 16 mA.
The HCPL-4502, HCPL-0452,
and HCNW4502 provide the
electrical and switching
performance of the 6N136,
HCPL-0501, and HCNW136 with
increased ESD protection.
The HCPL-4503, HCPL-0453,
and HCNW4503 are similar to the
HCPL-4502, HCPL-0452, and
HCNW4502 optocouplers but
have increased common mode
transient immunity of 15 kV/µs
minimum at V
CM
= 1500 V
guaranteed.
Schematic
2
ANODE
+
V
F
CATHODE
–
3
SHIELD
HCPL-4503/0453
HCNW4503
I
F
I
CC
8
V
CC
I
O
6
V
O
5
GND
I
B
7 *
V
B
* NOTE: FOR HCPL-4502/-3, HCPL-0452/3,
HCNW4502/3, PIN 7 IS NOT CONNECTED.
Selection Guide
Minimum CMR
dV/dt
(V/
µ
s)
1,000
V
CM
(V)
10
8-Pin DIP (300 Mil)
Current
Single
Dual
Transfer
Channel
Channel
Ratio (%)
Package
Package*
7
6N135
HCPL-2530
19
6N136
HCPL-2531
HCPL-4502†
15
HCPL-2502
19
HCPL-4503† HCPL-4534
9
Small-Outline SO-8
Single
Dual
Channel
Channel
Package
Package*
HCPL-0500
HCPL-0530
HCPL-0501
HCPL-0531
HCPL-0452†
HCPL-0453†
HCPL-0534
Widebody
(400 Mil)
Hermetic
Single
Single and
Channel
Dual Channel
Package
Packages*
HCNW135
HCNW136
HCNW4502†
HCNW4503†
HCPL-55XX
HCPL-65XX
4N55
15,000
1,000
1500
10
*Technical data for these products are on separate Agilent publications.
†Pin 7, transistor base, is not connected.
Ordering Information
Specify Part Number followed by Option Number (if desired).
Example:
HCPL-4503#XXXX
020 = UL 5000 V rms/1 Minute Option*
060 = IEC/EN/DIN EN 60747-5-2 V
IORM
= 630 V
peak
Option**
300 = Gull Wing Surface Mount Option†
500 = Tape and Reel Packaging Option
XXXE = Lead Free Option
Option data sheets available. Contact your Agilent sales representative or authorized distributor for information.
*For 6N135/6 and HCPL-4502/3 only.
**For HCPL-4503 only. Combination of Option 020 and Option 060 is not available.
†Gull wing surface mount option applies to through hole parts only.
Remarks: The notation “#” is used for existing products, while (new) products launched since 15th July
2001 and lead free option will use “-”
3
Package Outline Drawings
8-Pin DIP Package (6N135/6, HCPL-4502/3, HCPL-2502)
9.65 ± 0.25
(0.380 ± 0.010)
TYPE NUMBER
8
7
6
5
7.62 ± 0.25
(0.300 ± 0.010)
6.35 ± 0.25
(0.250 ± 0.010)
OPTION CODE*
DATE CODE
A XXXXZ
YYWW RU
1
1.19 (0.047) MAX.
2
3
4
UL
RECOGNITION
1.78 (0.070) MAX.
+ 0.076
0.254 - 0.051
+ 0.003)
(0.010 - 0.002)
5° TYP.
3.56 ± 0.13
(0.140 ± 0.005)
4.70 (0.185) MAX.
0.51 (0.020) MIN.
2.92 (0.115) MIN.
1.080 ± 0.320
(0.043 ± 0.013)
0.65 (0.025) MAX.
2.54 ± 0.25
(0.100 ± 0.010)
DIMENSIONS IN MILLIMETERS AND (INCHES).
*MARKING CODE LETTER FOR OPTION NUMBERS
"L" = OPTION 020
"V" = OPTION 060
OPTION NUMBERS 300 AND 500 NOT MARKED.
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
8-Pin DIP Package with Gull Wing Surface Mount Option 300 (6N135/6, HCPL-4502/3)
LAND PATTERN RECOMMENDATION
9.65 ± 0.25
(0.380 ± 0.010)
8
7
6
5
1.016 (0.040)
6.350 ± 0.25
(0.250 ± 0.010)
10.9 (0.430)
1
2
3
4
1.27 (0.050)
2.0 (0.080)
1.19
(0.047)
MAX.
1.780
(0.070)
MAX.
9.65 ± 0.25
(0.380 ± 0.010)
7.62 ± 0.25
(0.300 ± 0.010)
+ 0.076
0.254 - 0.051
+ 0.003)
(0.010 - 0.002)
3.56 ± 0.13
(0.140 ± 0.005)
1.080 ± 0.320
(0.043 ± 0.013)
0.635 ± 0.130
2.54
(0.025 ± 0.005)
(0.100)
BSC
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
0.635 ± 0.25
(0.025 ± 0.010)
12° NOM.
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
4
Small Outline SO-8 Package (HCPL-0500/1, HCPL-0452/3)
LAND PATTERN RECOMMENDATION
8
7
6
5
3.937 ± 0.127
(0.155 ± 0.005)
XXX
YWW
5.994 ± 0.203
(0.236 ± 0.008)
TYPE NUMBER
(LAST 3 DIGITS)
DATE CODE
4
7.49 (0.295)
PIN ONE
1
0.406 ± 0.076
(0.016 ± 0.003)
2
3
1.9 (0.075)
1.270 BSC
(0.050)
0.64 (0.025)
*
5.080 ± 0.127
(0.200 ± 0.005)
7°
45° X
0.432
(0.017)
3.175 ± 0.127
(0.125 ± 0.005)
0 ~ 7°
1.524
(0.060)
0.203 ± 0.102
(0.008 ± 0.004)
0.228 ± 0.025
(0.009 ± 0.001)
*
TOTAL PACKAGE LENGTH (INCLUSIVE OF MOLD FLASH)
5.207 ± 0.254 (0.205 ± 0.010)
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES) MAX.
0.305 MIN.
(0.012)
8-Pin Widebody DIP Package (HCNW135/6, HCNW4502/3)
11.15 ± 0.15
(0.442 ± 0.006)
8
7
6
5
11.00 MAX.
(0.433)
9.00 ± 0.15
(0.354 ± 0.006)
TYPE NUMBER
DATE CODE
A
HCNWXXXX
YYWW
1
2
3
4
1.55
(0.061)
MAX.
10.16 (0.400)
TYP.
7° TYP.
+ 0.076
0.254 - 0.0051
+ 0.003)
(0.010 - 0.002)
5.10 MAX.
(0.201)
3.10 (0.122)
3.90 (0.154)
2.54 (0.100)
TYP.
1.78 ± 0.15
(0.070 ± 0.006)
0.40 (0.016)
0.56 (0.022)
0.51 (0.021) MIN.
DIMENSIONS IN MILLIMETERS (INCHES).
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
5
8-Pin Widebody DIP Package with Gull Wing Surface Mount Option 300 (HCNW135/6,
HCNW4502/3)
11.15 ± 0.15
(0.442 ± 0.006)
8
7
6
5
LAND PATTERN RECOMMENDATION
9.00 ± 0.15
(0.354 ± 0.006)
13.56
(0.534)
1
2
3
4
1.3
(0.051)
1.55
(0.061)
MAX.
12.30 ± 0.30
(0.484 ± 0.012)
11.00 MAX.
(0.433)
2.29
(0.09)
4.00 MAX.
(0.158)
1.78 ± 0.15
(0.070 ± 0.006)
2.54
(0.100)
BSC
0.75 ± 0.25
(0.030 ± 0.010)
1.00 ± 0.15
(0.039 ± 0.006)
+ 0.076
0.254 - 0.0051
+ 0.003)
(0.010 - 0.002)
7° NOM.
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
Solder Reflow Temperature Profile
300
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.
PEAK
TEMP.
245°C
PEAK
TEMP.
240°C
PEAK
TEMP.
230°C
2.5°C ± 0.5°C/SEC.
160°C
150°C
140°C
3°C + 1°C/–0.5°C
30
SEC.
30
SEC.
SOLDERING
TIME
200°C
TEMPERATURE (°C)
200
100
PREHEATING TIME
150°C, 90 + 30 SEC.
50 SEC.
TIGHT
TYPICAL
LOOSE
ROOM
TEMPERATURE
0
0
50
100
150
200
250
TIME (SECONDS)
DSP 与 ARM 处理器
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
