SPECIFICATION FOR APPROVAL
REF : 20100428-A
PROD.
NAME
PAGE: 1
ABC'S DWG NO.
ABC'S ITEM NO.
MH1005□□□□L□-□□□
MULTILAYER CHIP INDUCTOR
Ⅰ﹒CONFIGURATION
& DIMENSIONS：
A
A : 1.00±0.10
B
B : 0.50±0.10
C : 0.50±0.10
D : 0.23±0.10
D
m/m
m/m
m/m
m/m
Ⅱ﹒SCHEMATIC
DIAGRAM：
Ⅲ﹒FEATURES：
a﹒Monolithic structure ensuring high performance and reliability.
b﹒High frequency applications up to 6GHz.
c﹒Terminal：Ag/Cu/Ni/Sn
d﹒Remark：Products comply with RoHS' requirements
Ⅳ﹒APPLICATIONS：
a﹒RF modules for telecommunication systems including
GSM, PCS,DECT,WLAN,Bluetooth,etc.
Ⅴ﹒GENERAL
SPECIFICATION：
a﹒Storage Conditions：
Max time above 230℃
：50sec
max.
Max time above 200℃
：70sec
max.
Electrical Performance temp：-55℃ ~ +125℃
Temperature
Rising Area
Preheat Area
Terminal Solderability & Packages Material temp：
+4.0
℃
/ sec max.
150 ~ 200
℃
/ 60 ~ 120sec
-10
℃
~ +40
℃
and RH 70% max.
b﹒Operating temp.：-55℃ ---- +125℃
Solder : Sn96.5 / Ag3 / Cu0.5
or equivalent
Solder temp. : 260±5℃
Flux : Rosin
Dip time : 4±1 seconds
Temperature (
℃
)
250
50sec max.
C
Peak Temp：260℃ max.
Reflow Area
Forced Cooling Area
+2.0 ~ 4.0
℃
-(1.0 ~ 5.0)
℃
/ sec max.
/ sec max.
Peak Temperature:
260℃
230℃
c﹒Solderability：
200
150
70sec max.
100
50
0
50
100
150
Time ( seconds )
200
250
AR-001A
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