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Global Connector Technology Ltd. - BF055: 2.0mm PITCH ELEVATED PIN HEADER, DUAL ROW, THROUGH HOLE, VERTICAL
A
5
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7
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A
B
B
C
C
D
D
E
Ordering Grid
SPECIFICATIONS
规格
CURRENT RATING
电流额定值：
2 AMP
INSULATOR RESISTANCE
绝缘额定值：
1000 MEGOHMS MIN.
CONTACT RESISTANCE
接触电阻值：
20 mOHMS MAX
No. of Contacts
DIELECTRIC WITHSTANDING
耐电压：AC
500 V
04 to 80
OPERATING TEMPERATURE
工½温度：-40°C
TO +105°C
CONTACT MATERIAL
端子物料：COPPER
ALLOY
Contact Plating
F
INSULATOR MATERIAL
绝缘½物料:
A = Gold Flash All Over
STANDARD
标准物料:
POLYAMIDE
聚醯胺,
NYLON 6T, UL 94-V0
B = Selective Gold Flash Contact Area/
OPTIONS
可选物料:
POLYESTER
聚酯,
LCP, UL 94-V0
Tin On Tail
OR POLYESTER
聚酯,
PBT, UL94-V0
C = Tin All Over
SOLDERING PROCESS
可焊性:
G = 10µ" Gold Contact Area/Tin On Tail
NYLON 6T (STANDARD标准物料) -
IR REFLOW
回流焊:
260°C for 10 sec.
I = 30µ" Gold Contact Area/Tin On Tail
WAVE
波峰焊:230°C
for 5-10 sec.
Standard = Gold Flash All Over
MANUAL SOLDER
人工焊接:
350°C for 3-5 sec
G
PBT (OPTION
可选物料)
- MANUAL SOLDER人工焊接: 330°C for 3-5 sec.
(NOT SUITABLE FOR HI-TEMP PROCESS
不适合高温处理
)
LCP (OPTION
可选物料)
-
IR REFLOW
回流焊:
260°C for 10 sec.
WAVE
波峰焊:250°C
for 5-10 sec.
MANUAL SOLDER
人工焊接:
350°C for 3-5 sec
MATES WITH
配套之母座
(SUBJECT TO PIN LENGTH
在端子长度适合的条件下
):
BF065
BF075
BF080
BF095
BF100
BF105
BF115
BF120
E
BF055
XX X
X
XXXX
XXXX
XXXX
X
X
Packing Options
G = Plastic Box (Standard)
D = Tube
E = Tube with Cap
Insulator
Height 'H'
A = 1.50mm
B = 2.00mm
Standard = 2.00mm
Dimension C (1/100mm)
(Post Height)
Standard - 4.00mm = 0400
Or specify Dimension C
e.g. 2.50mm = 0250
TOL +/- 0.2mm
Insulator Material
N = Nylon 6T (Standard)
L = LCP
P = PBT
F
Dimension D (1/100mm)
(Tail Length)
Standard - 2.80mm = 0280
Or specify Dimension D
e.g. 2.50mm = 0250
TOL +/- 0.2mm
Dimension E (1/100mm)
(Stack Height)
Standard - 12.00mm = 1200
Minimum - 3.00mm = 0300
Or specify Dimension E
e.g. 5.00mm = 0500
TOL +/- 0.2mm
G
Tolerances
(Except as noted)
Part Number:-
Date:-
Dimensions in mm
X.°±5°
.X°±2°
.XX°±1°
X.XXX ± 0.10 .XXX°±0.5°
X.X ± 0.20
X.XX ± 0.15
Third Angle Projection
X. ± 0.30
BF055
Description:-
31 OCT 07
H
By
DETAIL
REV
DATE
LYH
DRAWING
RELEASE
A
31/10/07
CB
PN
DR
CHANGE TO SOLDER
TEMP. INFORMATION
D
30/07/09
PACKING OPTIONS
CORRECTION TO
ORDERING GRID
CHANGED
B
27/04/09
C
10/06/09
RoHS
3
4
2.0mm PITCH ELEVATED PIN HEADER, DUAL ROW,
THROUGH HOLE, VERTICAL
Global
Connector
Technology
www.globalconnectortechnology.com
Scale
NTS
H
C
THIS DRAWING IS CONFIDENTIAL AND MUST NOT BE
COPIED OR DISCLOSED WITHOUT WRITTEN CONSENT
Revision
D
Material
See Note
Drawn by
LYH
E & OE
Sheet No.
1/1
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Microchip MCU
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