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HM66AEB18204BP-60: 产品描述2MX18 DDR SRAM, 0.5ns, PBGA165, PLASTIC, FBGA-165; 产品类别存储存储; 文件大小247KB，共32页; 制造商Renesas(瑞萨电子); 官网地址https://www.renesas.com/

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HM66AEB18204BP-60概述

2MX18 DDR SRAM, 0.5ns, PBGA165, PLASTIC, FBGA-165

HM66AEB18204BP-60规格参数

参数名称	属性值
是否Rohs认证	不符合
厂商名称	Renesas(瑞萨电子)
零件包装代码	BGA
包装说明	LBGA, BGA165,11X15,40
针数	165
Reach Compliance Code	unknown
ECCN代码	3A991.B.2.A
Base Number Matches	1

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To all our customers

Regarding the change of names mentioned in the document, such as Hitachi

Electric and Hitachi XX, to Renesas Technology Corp.

The semiconductor operations of Mitsubishi Electric and Hitachi were transferred to Renesas

Technology Corporation on April 1st 2003. These operations include microcomputer, logic, analog

and discrete devices, and memory chips other than DRAMs (flash memory, SRAMs etc.)

Accordingly, although Hitachi, Hitachi, Ltd., Hitachi Semiconductors, and other Hitachi brand

names are mentioned in the document, these names have in fact all been changed to Renesas

Technology Corp. Thank you for your understanding. Except for our corporate trademark, logo and

corporate statement, no changes whatsoever have been made to the contents of the document, and

these changes do not constitute any alteration to the contents of the document itself.

Renesas Technology Home Page: http://www.renesas.com

Renesas Technology Corp.

Customer Support Dept.

April 1, 2003

Cautions

Keep safety first in your circuit designs!

1. Renesas Technology Corporation puts the maximum effort into making semiconductor products better

and more reliable, but there is always the possibility that trouble may occur with them. Trouble with

semiconductors may lead to personal injury, fire or property damage.

Remember to give due consideration to safety when making your circuit designs, with appropriate

measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or

(iii) prevention against any malfunction or mishap.

Notes regarding these materials

1. These materials are intended as a reference to assist our customers in the selection of the Renesas

Technology Corporation product best suited to the customer's application; they do not convey any

license under any intellectual property rights, or any other rights, belonging to Renesas Technology

Corporation or a third party.

2. Renesas Technology Corporation assumes no responsibility for any damage, or infringement of any

third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or

circuit application examples contained in these materials.

3. All information contained in these materials, including product data, diagrams, charts, programs and

algorithms represents information on products at the time of publication of these materials, and are

subject to change by Renesas Technology Corporation without notice due to product improvements or

other reasons. It is therefore recommended that customers contact Renesas Technology Corporation

or an authorized Renesas Technology Corporation product distributor for the latest product information

before purchasing a product listed herein.

The information described here may contain technical inaccuracies or typographical errors.

Renesas Technology Corporation assumes no responsibility for any damage, liability, or other loss

rising from these inaccuracies or errors.

Please also pay attention to information published by Renesas Technology Corporation by various

means, including the Renesas Technology Corporation Semiconductor home page

(http://www.renesas.com).

4. When using any or all of the information contained in these materials, including product data, diagrams,

charts, programs, and algorithms, please be sure to evaluate all information as a total system before

making a final decision on the applicability of the information and products. Renesas Technology

Corporation assumes no responsibility for any damage, liability or other loss resulting from the

information contained herein.

5. Renesas Technology Corporation semiconductors are not designed or manufactured for use in a device

or system that is used under circumstances in which human life is potentially at stake. Please contact

Renesas Technology Corporation or an authorized Renesas Technology Corporation product distributor

when considering the use of a product contained herein for any specific purposes, such as apparatus or

systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use.

6. The prior written approval of Renesas Technology Corporation is necessary to reprint or reproduce in

whole or in part these materials.

7. If these products or technologies are subject to the Japanese export control restrictions, they must be

exported under a license from the Japanese government and cannot be imported into a country other

than the approved destination.

Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the

country of destination is prohibited.

8. Please contact Renesas Technology Corporation for further details on these materials or the products

contained therein.

HM66AEB18204BP-60相似产品对比

	HM66AEB18204BP-60	HM66AEB9404BP-50	HM66AEB18204BP-30	HM66AEB36104BP-33	HM66AEB36104BP-40	HM66AEB36104BP-60	HM66AEB18204BP-50	HM66AEB9404BP-33	HM66AEB18204BP-33	HM66AEB9404BP-40
描述	2MX18 DDR SRAM, 0.5ns, PBGA165, PLASTIC, FBGA-165	4MX9 DDR SRAM, 0.45ns, PBGA165, PLASTIC, FBGA-165	2MX18 DDR SRAM, 0.45ns, PBGA165, PLASTIC, FBGA-165	1MX36 DDR SRAM, 0.45ns, PBGA165, PLASTIC, FBGA-165	1MX36 DDR SRAM, 0.45ns, PBGA165, PLASTIC, FBGA-165	1MX36 DDR SRAM, 0.5ns, PBGA165, PLASTIC, FBGA-165	2MX18 DDR SRAM, 0.45ns, PBGA165, PLASTIC, FBGA-165	4MX9 DDR SRAM, 0.45ns, PBGA165, PLASTIC, FBGA-165	2MX18 DDR SRAM, 0.45ns, PBGA165, PLASTIC, FBGA-165	4MX9 DDR SRAM, 0.45ns, PBGA165, PLASTIC, FBGA-165
零件包装代码	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA
包装说明	LBGA, BGA165,11X15,40	LBGA, BGA165,11X15,40	LBGA, BGA165,11X15,40	LBGA, BGA165,11X15,40	PLASTIC, FBGA-165	LBGA, BGA165,11X15,40	LBGA, BGA165,11X15,40	LBGA, BGA165,11X15,40	LBGA, BGA165,11X15,40	LBGA, BGA165,11X15,40
针数	165	165	165	165	165	165	165	165	165	165
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
ECCN代码	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A
是否Rohs认证	不符合	不符合	不符合	不符合	-	不符合	不符合	不符合	不符合	不符合
厂商名称	Renesas(瑞萨电子)	-	-	Renesas(瑞萨电子)	Renesas(瑞萨电子)	Renesas(瑞萨电子)	Renesas(瑞萨电子)	Renesas(瑞萨电子)	Renesas(瑞萨电子)	Renesas(瑞萨电子)
最长访问时间	-	0.45 ns	0.45 ns	0.45 ns	0.45 ns	0.5 ns	0.45 ns	0.45 ns	-	0.45 ns
最大时钟频率 (fCLK)	-	200 MHz	333 MHz	300 MHz	250 MHz	167 MHz	200 MHz	300 MHz	-	250 MHz
I/O 类型	-	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	-	COMMON
JESD-30 代码	-	R-PBGA-B165	R-PBGA-B165	R-PBGA-B165	R-PBGA-B165	R-PBGA-B165	R-PBGA-B165	R-PBGA-B165	-	R-PBGA-B165
长度	-	17 mm	17 mm	17 mm	17 mm	17 mm	17 mm	17 mm	-	17 mm
内存密度	-	37748736 bit	37748736 bit	37748736 bit	37748736 bit	37748736 bit	37748736 bit	37748736 bit	-	37748736 bit
内存集成电路类型	-	DDR SRAM	DDR SRAM	DDR SRAM	DDR SRAM	DDR SRAM	DDR SRAM	DDR SRAM	-	DDR SRAM
内存宽度	-	9	18	36	36	36	18	9	-	9
湿度敏感等级	-	1	1	1	3	1	1	1	-	1
功能数量	-	1	1	1	1	1	1	1	-	1
端子数量	-	165	165	165	165	165	165	165	-	165
字数	-	4194304 words	2097152 words	1048576 words	1048576 words	1048576 words	2097152 words	4194304 words	-	4194304 words
字数代码	-	4000000	2000000	1000000	1000000	1000000	2000000	4000000	-	4000000
工作模式	-	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	-	SYNCHRONOUS
最高工作温度	-	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	-	70 °C
组织	-	4MX9	2MX18	1MX36	1MX36	1MX36	2MX18	4MX9	-	4MX9
输出特性	-	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	-	3-STATE
封装主体材料	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	-	PLASTIC/EPOXY
封装代码	-	LBGA	LBGA	LBGA	LBGA	LBGA	LBGA	LBGA	-	LBGA
封装等效代码	-	BGA165,11X15,40	BGA165,11X15,40	BGA165,11X15,40	BGA165,11X15,40	BGA165,11X15,40	BGA165,11X15,40	BGA165,11X15,40	-	BGA165,11X15,40
封装形状	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	-	RECTANGULAR
封装形式	-	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE	-	GRID ARRAY, LOW PROFILE
并行/串行	-	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	-	PARALLEL
峰值回流温度（摄氏度）	-	225	225	225	-	225	225	225	-	225
电源	-	1.5/1.8,1.8 V	1.5/1.8,1.8 V	1.5/1.8,1.8 V	1.5/1.8,1.8 V	1.5/1.8,1.8 V	1.5/1.8,1.8 V	1.5/1.8,1.8 V	-	1.5/1.8,1.8 V
认证状态	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-	Not Qualified
座面最大高度	-	1.46 mm	1.46 mm	1.46 mm	1.46 mm	1.46 mm	1.46 mm	1.46 mm	-	1.46 mm
最大待机电流	-	0.6 A	0.35 A	0.33 A	0.3 A	0.26 A	0.28 A	0.8 A	-	0.7 A
最小待机电流	-	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V	-	1.7 V
最大压摆率	-	0.54 mA	0.77 mA	0.8 mA	0.7 mA	0.52 mA	0.54 mA	0.72 mA	-	0.63 mA
最大供电电压 (Vsup)	-	1.9 V	1.9 V	1.9 V	1.9 V	1.9 V	1.9 V	1.9 V	-	1.9 V
最小供电电压 (Vsup)	-	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V	-	1.7 V
标称供电电压 (Vsup)	-	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	-	1.8 V
表面贴装	-	YES	YES	YES	YES	YES	YES	YES	-	YES
技术	-	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	-	CMOS
温度等级	-	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	-	COMMERCIAL
端子形式	-	BALL	BALL	BALL	BALL	BALL	BALL	BALL	-	BALL
端子节距	-	1 mm	1 mm	1 mm	1 mm	1 mm	1 mm	1 mm	-	1 mm
端子位置	-	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	-	BOTTOM
处于峰值回流温度下的最长时间	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED
宽度	-	15 mm	15 mm	15 mm	15 mm	15 mm	15 mm	15 mm	-	15 mm

HM66AEB18204BP-60

HM66AEB18204BP-60概述

HM66AEB18204BP-60规格参数

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